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Extract from the Register of European Patents

EP About this file: EP1561239

EP1561239 - ATOMIC LAYER DEPOSITION METHODS [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  02.03.2012
Database last updated on 07.10.2024
Most recent event   Tooltip04.10.2013Lapse of the patent in a contracting state
New state(s): HU		published on 06.11.2013  [2013/45]
Applicant(s)For all designated states
Micron Technology, Inc.
8000 South Federal Way, MS 525
Boise, ID 83716 / US
[2011/17]
Former [2005/32]For all designated states
Micron Technology, Inc.
8000 South Federal Way, MS 525
Boise, ID 83716 / US
Inventor(s)01 / DOAN, Trung, Tri
101 Lausen Court
Los Gaton, CA 95032 / US
02 / BLALOCK, Guy, T.
2178 Nrth Greenvieuw Court
Eagle, ID 83616 / US
03 / SANDHU, Gurtej, S.
2964 East Parkriver Drive
Boise, ID 83706 / US
 [2005/32]
Representative(s)Hackett, Sean James
Marks & Clerk LLP
Alpha Tower
Suffolk Street Queensway
Birmingham B1 1TT / GB
[N/P]
Former [2008/33]Hackett, Sean James
Marks & Clerk Alpha Tower Suffolk Street Queensway
Birmingham B1 1TT / GB
Former [2005/32]Hackett, Sean James
Marks & Clerk, Patent Attorneys, Alpha Tower, Suffolk Street Queensway
Birmingham B1 1TT / GB
Application number, filing date03783399.312.11.2003
[2005/32]
WO2003US36223
Priority number, dateUS2002029307212.11.2002         Original published format: US 293072
[2005/32]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO2004044963
Date:27.05.2004
Language:EN
[2004/22]
Type: A2 Application without search report 
No.:EP1561239
Date:10.08.2005
Language:EN
The application published by WIPO in one of the EPO official languages on 27.05.2004 takes the place of the publication of the European patent application.
[2005/32]
Type: B1 Patent specification 
No.:EP1561239
Date:27.04.2011
Language:EN
[2011/17]
Search report(s)International search report - published on:EP25.11.2004
ClassificationIPC:H01L21/285
[2005/32]
CPC:
C23C16/38 (EP,US); H01L21/20 (KR); H01L21/0228 (EP,US);
C23C16/403 (EP,US); C23C16/45542 (EP,US); C23C16/515 (EP,US);
H01L21/02274 (EP,KR,US); H01L21/28562 (EP,US); H01L21/3141 (US);
H01L21/76841 (EP,US); H01L21/02178 (EP,KR,US); H01L21/02183 (EP,KR,US);
H01L21/02186 (EP,KR,US); H01L21/02205 (EP,KR,US); H01L21/31616 (US);
H01L21/31683 (US) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   RO,   SE,   SI,   SK,   TR [2011/17]
Former [2005/32]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  RO,  SE,  SI,  SK,  TR 
Extension statesALNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
TitleGerman:VERFAHREN ZUR ATOMSCHICHTABSCHEIDUNG[2005/32]
English:ATOMIC LAYER DEPOSITION METHODS[2005/32]
French:PROCEDES DE DEPOT DE COUCHE ATOMIQUE[2005/32]
Entry into regional phase23.05.2005National basic fee paid 
23.05.2005Designation fee(s) paid 
23.05.2005Examination fee paid 
Examination procedure10.06.2004Request for preliminary examination filed
International Preliminary Examining Authority: US
17.05.2005Amendment by applicant (claims and/or description)
23.05.2005Examination requested  [2005/32]
21.05.2007Despatch of a communication from the examining division (Time limit: M06)
28.11.2007Reply to a communication from the examining division
19.11.2010Communication of intention to grant the patent
09.03.2011Fee for grant paid
09.03.2011Fee for publishing/printing paid
Opposition(s)30.01.2012No opposition filed within time limit [2012/14]
Fees paidRenewal fee
14.11.2005Renewal fee patent year 03
14.11.2006Renewal fee patent year 04
15.11.2007Renewal fee patent year 05
12.11.2008Renewal fee patent year 06
12.11.2009Renewal fee patent year 07
12.11.2010Renewal fee patent year 08
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HU27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
TR27.04.2011
BG27.07.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
GB12.11.2011
IE12.11.2011
LU12.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
[2013/45]
Former [2013/44]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
TR27.04.2011
BG27.07.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
GB12.11.2011
IE12.11.2011
LU12.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
Former [2013/29]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
BG27.07.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
GB12.11.2011
IE12.11.2011
LU12.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
Former [2013/25]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
GB12.11.2011
IE12.11.2011
LU12.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
Former [2013/04]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
GB12.11.2011
IE12.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
Former [2012/47]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
GB12.11.2011
IE12.11.2011
CH30.11.2011
LI30.11.2011
MC30.11.2011
Former [2012/46]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
GB12.11.2011
CH30.11.2011
LI30.11.2011
MC30.11.2011
Former [2012/33]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
CH30.11.2011
LI30.11.2011
MC30.11.2011
Former [2012/29]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
MC30.11.2011
Former [2012/10]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
Former [2012/09]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
EE27.04.2011
FI27.04.2011
NL27.04.2011
SE27.04.2011
SI27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
Former [2012/01]AT27.04.2011
BE27.04.2011
CY27.04.2011
FI27.04.2011
NL27.04.2011
SE27.04.2011
SI27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
Former [2011/52]AT27.04.2011
CY27.04.2011
FI27.04.2011
SE27.04.2011
SI27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
Former [2011/50]CY27.04.2011
FI27.04.2011
SE27.04.2011
SI27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
Former [2011/49]CY27.04.2011
FI27.04.2011
SE27.04.2011
GR28.07.2011
ES07.08.2011
PT29.08.2011
Former [2011/47]PT29.08.2011
Cited inInternational search[A]EP1167567  (APPLIED MATERIALS INC [US]) [A] 64-71 * column 5, line 19 - column 6, line 36 * * column 8, line 17 - line 35; figures 5,12,13 *;
 [A]US2002000598  (KANG SANG-BOM [KR], et al) [A] 64-71 * page 3, paragraph 40 * * page 3, paragraph 43 - page 4, paragraph 45; figures 1ab,2ab *;
 [DA]US6343565  (HONGOH TOSHIAKI [JP]) [DA] 1-50 * column 1, line 1 - column 5, line 64 * * column 6, line 48 - column 7, line 39; figures 1,2,5 *;
 [XA]WO0243114  (SIMPLUS SYSTEMS CORP [US]) [X] 51-58,62,63,72,74-80,82-86,88,90-92,94-98 * the whole document * [A] 64-71;
 [DA]US6399520  (KAWAKAMI SATORU [JP], et al) [DA] 1-50 * column 5, line 33 - column 16, line 21; figures 3-5 *;
 [XA]WO0245871  (ANGSTRON SYSTEMS INC [US]) [X] 72,75-77,83,86-88,95,98,99 * the whole document * [A] 1-50,81,93;
 [A]US2002076507  (CHIANG TONY P [US], et al) [A] 1,2,6,7,10-16,18-29,33,37-45,48-51,64 * page 8, column R, paragraph 120 - page 9, column L, paragraph 130 * * page 13, column L, paragraph 174 - page 17, column R, paragraph 221; figures 13,34-38; claim 1 *;
 [PX]US2002197856  (MATSUSE KIMIHIRO [JP], et al) [PX] 1,6-10,15-21,25-34,40-48 * page 4, column R, paragraph 49 - page 6, column L, paragraph 60 * * page 6, column R, paragraph 65 - page 8, column L, paragraph 72 * * page 9, column R, paragraph 83 - page 11, column L, paragraph 92 * * page 11, column R, paragraph 98 - paragraph 99; figures 5,7,8,12 *;
 [PX]WO03087431  (MICRON TECHNOLOGY INC [US]) [PX] 1,6-10,15-21,25-33,40-48 * the whole document *;
 [E]US2004038525  (MENG SHUANG [US], et al) [E] 51,52,62,63 * page 2, paragraph 31 - page 4, paragraph 39 * * page 6, paragraph 49 ** page 9, paragraph 83; figures 1-3 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.