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EP1570518
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EP About this file: EP1570518
| EP1570518 - A METHOD FOR DEPOSITING A METAL LAYER ON A SEMICONDUCTOR INTERCONNECT STRUCTURE [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 12.03.2010 Database last updated on 30.03.2026 | Most recent event Tooltip | 12.03.2010 | Application deemed to be withdrawn | published on 14.04.2010 [2010/15] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
| Former [2005/36] | For all designated states International Business Machines Corporation New Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
MALHOTRA, Sandra 4385 Watson Circle Santa Clara, CA 95054 / US | 02 /
SIMON, Andrew 269 Crestwood Court 12524 Fishkill / US | [2006/52] |
| Former [2005/36] | 01 /
MALHOTRA, Sandra 478 Main Street 12508 Beacon / US | ||
| 02 /
SIMON, Andrew 269 Crestwood Court 12524 Fishkill / US | Representative(s) | Teufel, Fritz, et al IBM Deutschland Management & Business Support GmbH Patentwesen u. Urheberrecht 71137 Ehningen / DE | [N/P] |
| Former [2009/38] | Teufel, Fritz, et al IBM Deutschland Management & Business Support GmbH Patentwesen u. Urheberrecht 71137 Ehningen / DE | ||
| Former [2008/37] | Teufel, Fritz, et al IBM Deutschland GmbH Intellectual Property 70548 Stuttgart / DE | ||
| Former [2005/36] | Teufel, Fritz, et al Patentwesen und Urheberrecht, IBM Deutschland GmbH, Postfach 70548 Stuttgart / DE | Application number, filing date | 03799543.8 | 08.12.2003 | [2005/36] | WO2003EP50958 | Priority number, date | US20020318605 | 11.12.2002 Original published format: US 318605 | [2005/36] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | WO2004053926 | Date: | 24.06.2004 | Language: | EN | [2004/26] | Type: | A2 Application without search report | No.: | EP1570518 | Date: | 07.09.2005 | Language: | EN | The application published by WIPO in one of the EPO official languages on 24.06.2004 takes the place of the publication of the European patent application. | [2005/36] | Search report(s) | International search report - published on: | EP | 25.11.2004 | Classification | IPC: | H01L21/768 | [2005/36] | CPC: |
H10W20/034 (EP,US);
H10D64/011 (KR);
H10W20/054 (EP,US);
H10W20/083 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, MC, NL, PT, RO, SE, SI, SK, TR [2005/36] | Extension states | AL | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | Title | German: | EIN VERFAHREN ZUR ABSCHEIDUNG EINER METALLSCHICHT AUF EINER HALBLEITER-INTERKONNEKTSTRUKTUR | [2005/36] | English: | A METHOD FOR DEPOSITING A METAL LAYER ON A SEMICONDUCTOR INTERCONNECT STRUCTURE | [2005/36] | French: | PROCEDE DE DEPOSITION D'UNE COUCHE METALLIQUE SUR UNE STRUCTURE D'INTERCONNEXION A SEMI-CONDUCTEUR | [2005/36] | Entry into regional phase | 04.05.2005 | National basic fee paid | 04.05.2005 | Designation fee(s) paid | 04.05.2005 | Examination fee paid | Examination procedure | 02.07.2004 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 04.05.2005 | Examination requested [2005/36] | 19.05.2009 | Despatch of a communication from the examining division (Time limit: M04) | 30.09.2009 | Application deemed to be withdrawn, date of legal effect [2010/15] | 05.11.2009 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2010/15] | Fees paid | Renewal fee | 16.12.2005 | Renewal fee patent year 03 | 19.12.2006 | Renewal fee patent year 04 | 17.12.2007 | Renewal fee patent year 05 | 12.12.2008 | Renewal fee patent year 06 | Penalty fee | Additional fee for renewal fee | 31.12.2009 | 07 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [X] YAMAGISHI H ET AL: "TEM/SEM INVESTIGATION AND ELECTRICAL EVALUATION OF A BOTTOMLESS I-PVD TA(N) BARRIER IN DUAL DAMASCENE", ADVANCED METALLIZATION CONFERENCE. PROCEEDINGS OF THE CONFERENCE, XX, XX, 2 October 2000 (2000-10-02), pages 279 - 285, XP008012016 * abstract * | Examination | US5985762 |