EP1413776 - Interconnection support for plate-like microcomponents [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.05.2006 Database last updated on 16.07.2024 | Most recent event Tooltip | 05.05.2006 | No opposition filed within time limit | published on 07.06.2006 [2006/23] | Applicant(s) | For all designated states Merck Patent GmbH Frankfurter Strasse 250 64293 Darmstadt / DE | [N/P] |
Former [2004/18] | For all designated states MERCK PATENT GmbH Frankfurter Strasse 250 64293 Darmstadt / DE | Inventor(s) | 01 /
Dr. Hohmann, Michael Rosenstrasse 2 63179 Obertshausen / DE | 02 /
Schmelz, Michael Im Meerchen 21 64560 Riedstadt / DE | 03 /
Wurziger, Hanns Greinstrasse 7b 64291 Darmstadt / DE | 04 /
Schwesinger, Norbert Bahnhofstrasse 35a 85386 Eching / DE | [2004/37] |
Former [2004/18] | 01 /
Hohmann, Michael Liebfrauenstrasse 49 64289 Darmstadt / DE | ||
02 /
Schmelz, Michael Im Meerchen 21 64560 Riedstadt / DE | |||
03 /
Wurziger, Hanns Greinstrasse 7b 64291 Darmstadt / DE | |||
04 /
Schwesinger, Norbert Bahnhofstrasse 35a 85386 Eching / DE | Representative(s) | Habermann, Jan Katscher Habermann Patentanwälte Dolivostrasse 15A 64293 Darmstadt / DE | [N/P] |
Former [2004/18] | Habermann, Jan Katscher Habermann Patentanwälte Fröbelweg 1 64291 Darmstadt / DE | Application number, filing date | 04000604.1 | 17.11.1999 | [2004/18] | Priority number, date | DE1998154096 | 24.11.1998 Original published format: DE 19854096 | [2004/18] | Filing language | DE | Procedural language | DE | Publication | Type: | A2 Application without search report | No.: | EP1413776 | Date: | 28.04.2004 | Language: | DE | [2004/18] | Type: | A3 Search report | No.: | EP1413776 | Date: | 30.06.2004 | [2004/27] | Type: | B1 Patent specification | No.: | EP1413776 | Date: | 22.06.2005 | Language: | DE | [2005/25] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.05.2004 | Classification | IPC: | F15C5/00, B01L11/00 | [2004/27] | CPC: |
B81C3/008 (EP,US);
F15C5/00 (EP,KR,US);
B01J19/0093 (EP,US);
B01L3/502715 (EP,US);
F15C4/00 (KR);
F16K99/0001 (EP,US);
F16K99/0042 (EP,US);
B01J2219/0002 (EP,US);
B01J2219/00783 (EP,US);
B01J2219/0081 (EP,US);
B01L2200/025 (EP,US);
B01L2200/027 (EP,US);
B81B2201/13 (EP,US);
F16K2099/008 (EP,US);
F16K2099/0084 (EP,US);
F16L33/22 (KR);
F16L55/00 (KR);
G01N2035/00326 (EP,US);
|
Former IPC [2004/18] | F15C5/00 | Designated contracting states | CH, DE, FR, GB, LI, NL [2004/18] | Title | German: | Anschlussträger für plattenförmige Mikrokomponenten | [2004/18] | English: | Interconnection support for plate-like microcomponents | [2004/18] | French: | Support de connexion pour microcomposants sous forme de plaques | [2004/18] | Examination procedure | 10.07.2004 | Amendment by applicant (claims and/or description) | 25.08.2004 | Examination requested [2004/44] | 08.11.2004 | Communication of intention to grant the patent | 03.12.2004 | Fee for grant paid | 03.12.2004 | Fee for publishing/printing paid | Parent application(s) Tooltip | EP99956004.8 / EP1133642 | Opposition(s) | 23.03.2006 | No opposition filed within time limit [2006/23] | Fees paid | Renewal fee | 06.05.2004 | Renewal fee patent year 03 | 06.05.2004 | Renewal fee patent year 04 | 06.05.2004 | Renewal fee patent year 05 | 12.11.2004 | Renewal fee patent year 06 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0040186 (SCANDITRONIX INSTR [SE]) [A] 1,5,7 * page 5, line 29 - page 6, line 11 * * page 8, line 1 - line 5 * * page 9, line 25 - line 29 * * figures 2,6 *; | [A]US5519635 (MIYAKE RYO [JP], et al) [A] 1 * column 8, line 32 - line 53; figures 2,6-8,13 *; | [PA]DE19746585 (MERCK PATENT GMBH [DE]) [PA] 2* column 2, line 58 - line 64; figure 1 * |