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Extract from the Register of European Patents

EP About this file: EP1413776

EP1413776 - Interconnection support for plate-like microcomponents [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  05.05.2006
Database last updated on 16.07.2024
Most recent event   Tooltip05.05.2006No opposition filed within time limitpublished on 07.06.2006  [2006/23]
Applicant(s)For all designated states
Merck Patent GmbH
Frankfurter Strasse 250
64293 Darmstadt / DE
[N/P]
Former [2004/18]For all designated states
MERCK PATENT GmbH
Frankfurter Strasse 250
64293 Darmstadt / DE
Inventor(s)01 / Dr. Hohmann, Michael
Rosenstrasse 2
63179 Obertshausen / DE
02 / Schmelz, Michael
Im Meerchen 21
64560 Riedstadt / DE
03 / Wurziger, Hanns
Greinstrasse 7b
64291 Darmstadt / DE
04 / Schwesinger, Norbert
Bahnhofstrasse 35a
85386 Eching / DE
 [2004/37]
Former [2004/18]01 / Hohmann, Michael
Liebfrauenstrasse 49
64289 Darmstadt / DE
02 / Schmelz, Michael
Im Meerchen 21
64560 Riedstadt / DE
03 / Wurziger, Hanns
Greinstrasse 7b
64291 Darmstadt / DE
04 / Schwesinger, Norbert
Bahnhofstrasse 35a
85386 Eching / DE
Representative(s)Habermann, Jan
Katscher Habermann Patentanwälte
Dolivostrasse 15A
64293 Darmstadt / DE
[N/P]
Former [2004/18]Habermann, Jan
Katscher Habermann Patentanwälte Fröbelweg 1
64291 Darmstadt / DE
Application number, filing date04000604.117.11.1999
[2004/18]
Priority number, dateDE199815409624.11.1998         Original published format: DE 19854096
[2004/18]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP1413776
Date:28.04.2004
Language:DE
[2004/18]
Type: A3 Search report 
No.:EP1413776
Date:30.06.2004
[2004/27]
Type: B1 Patent specification 
No.:EP1413776
Date:22.06.2005
Language:DE
[2005/25]
Search report(s)(Supplementary) European search report - dispatched on:EP17.05.2004
ClassificationIPC:F15C5/00, B01L11/00
[2004/27]
CPC:
B81C3/008 (EP,US); F15C5/00 (EP,KR,US); B01J19/0093 (EP,US);
B01L3/502715 (EP,US); F15C4/00 (KR); F16K99/0001 (EP,US);
F16K99/0042 (EP,US); B01J2219/0002 (EP,US); B01J2219/00783 (EP,US);
B01J2219/0081 (EP,US); B01L2200/025 (EP,US); B01L2200/027 (EP,US);
B81B2201/13 (EP,US); F16K2099/008 (EP,US); F16K2099/0084 (EP,US);
F16L33/22 (KR); F16L55/00 (KR); G01N2035/00326 (EP,US);
Y10T436/25625 (EP,US); Y10T436/2575 (EP,US) (-)
Former IPC [2004/18]F15C5/00
Designated contracting statesCH,   DE,   FR,   GB,   LI,   NL [2004/18]
TitleGerman:Anschlussträger für plattenförmige Mikrokomponenten[2004/18]
English:Interconnection support for plate-like microcomponents[2004/18]
French:Support de connexion pour microcomposants sous forme de plaques[2004/18]
Examination procedure10.07.2004Amendment by applicant (claims and/or description)
25.08.2004Examination requested  [2004/44]
08.11.2004Communication of intention to grant the patent
03.12.2004Fee for grant paid
03.12.2004Fee for publishing/printing paid
Parent application(s)   TooltipEP99956004.8  / EP1133642
Opposition(s)23.03.2006No opposition filed within time limit [2006/23]
Fees paidRenewal fee
06.05.2004Renewal fee patent year 03
06.05.2004Renewal fee patent year 04
06.05.2004Renewal fee patent year 05
12.11.2004Renewal fee patent year 06
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Documents cited:Search[A]EP0040186  (SCANDITRONIX INSTR [SE]) [A] 1,5,7 * page 5, line 29 - page 6, line 11 * * page 8, line 1 - line 5 * * page 9, line 25 - line 29 * * figures 2,6 *;
 [A]US5519635  (MIYAKE RYO [JP], et al) [A] 1 * column 8, line 32 - line 53; figures 2,6-8,13 *;
 [PA]DE19746585  (MERCK PATENT GMBH [DE]) [PA] 2* column 2, line 58 - line 64; figure 1 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.