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EP1530233
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EP About this file: EP1530233
| EP1530233 - Semiconductor device and method of manufacturing the same [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 03.10.2014 Database last updated on 04.06.2024 | Most recent event Tooltip | 03.10.2014 | Application deemed to be withdrawn | published on 05.11.2014 [2014/45] | Applicant(s) | For all designated states Renesas Electronics Corporation 1753, Shimonumabe Nakahara-ku Kawasaki-shi Kanagawa / JP | [2010/40] |
| Former [2005/19] | For all designated states NEC Electronics Corporation 1753 Shimonumabe, Nakahara-ku Kawasaki, Kanagawa 211-8668 / JP | Inventor(s) | 01 /
Itou, Masayuki c/o NEC Electronics Corp. 1753 Shimonumabe Nakahara-ku, Kawasaki, Kanagawa 211-8668 / JP | [2005/19] | Representative(s) | Betten & Resch Patent- und Rechtsanwälte PartGmbB Maximiliansplatz 14 80333 München / DE | [N/P] |
| Former [2005/19] | Betten & Resch Patentanwälte, Theatinerstrasse 8 80333 München / DE | Application number, filing date | 04026578.7 | 09.11.2004 | [2005/19] | Priority number, date | JP20030379835 | 10.11.2003 Original published format: JP 2003379835 | [2005/19] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1530233 | Date: | 11.05.2005 | Language: | EN | [2005/19] | Type: | A3 Search report | No.: | EP1530233 | Date: | 22.03.2006 | [2006/12] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.02.2006 | Classification | IPC: | H01L21/762 | [2005/19] | CPC: |
H01L21/763 (EP,US);
H01L21/76224 (EP,US);
H01L21/76232 (EP,US)
| Designated contracting states | DE, FR, IT [2006/48] |
| Former [2005/19] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Halbleiterbauelement und dessen Herstellungsverfahren | [2005/19] | English: | Semiconductor device and method of manufacturing the same | [2005/19] | French: | Dispositif semi-conducteur et son procédé de fabrication | [2005/19] | Examination procedure | 31.03.2006 | Examination requested [2006/22] | 23.09.2006 | Loss of particular rights, legal effect: designated state(s) | 18.01.2007 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GB, GR, HU, IE, IS, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR | 05.03.2007 | Despatch of a communication from the examining division (Time limit: M04) | 16.07.2007 | Reply to a communication from the examining division | 03.06.2014 | Application deemed to be withdrawn, date of legal effect [2014/45] | 27.06.2014 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2014/45] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 05.03.2007 | Fees paid | Renewal fee | 24.11.2006 | Renewal fee patent year 03 | 30.11.2007 | Renewal fee patent year 04 | 31.03.2008 | Renewal fee patent year 05 | 30.11.2009 | Renewal fee patent year 06 | 30.11.2010 | Renewal fee patent year 07 | 30.11.2011 | Renewal fee patent year 08 | 30.11.2012 | Renewal fee patent year 09 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 02.11.2006 | AT M01 Not yet paid | 02.11.2006 | BE M01 Not yet paid | 02.11.2006 | BG M01 Not yet paid | 02.11.2006 | CH M01 Not yet paid | 02.11.2006 | CY M01 Not yet paid | 02.11.2006 | CZ M01 Not yet paid | 02.11.2006 | DK M01 Not yet paid | 02.11.2006 | EE M01 Not yet paid | 02.11.2006 | ES M01 Not yet paid | 02.11.2006 | FI M01 Not yet paid | 02.11.2006 | GB M01 Not yet paid | 02.11.2006 | GR M01 Not yet paid | 02.11.2006 | HU M01 Not yet paid | 02.11.2006 | IE M01 Not yet paid | 02.11.2006 | IS M01 Not yet paid | 02.11.2006 | LU M01 Not yet paid | 02.11.2006 | MC M01 Not yet paid | 02.11.2006 | NL M01 Not yet paid | 02.11.2006 | PL M01 Not yet paid | 02.11.2006 | PT M01 Not yet paid | 02.11.2006 | RO M01 Not yet paid | 02.11.2006 | SE M01 Not yet paid | 02.11.2006 | SI M01 Not yet paid | 02.11.2006 | SK M01 Not yet paid | 02.11.2006 | TR M01 Not yet paid | Additional fee for renewal fee | 30.11.2013 | 10 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [DA]JP2002237518 ; | [XA]EP0272491 (TEXAS INSTRUMENTS INC [US]) [X] 1-5,7 * column 5, lines 33-39 * * column 7, lines 21-33 * * column 7, line 58 - column 8, line 12 * * figure 11 * [A] 6,8-17; | [XA]US4926235 (TAMAKI YOICHI [JP], et al) [X] 1-5,7 * column 6, lines 4-18 * * figure 6 * [A] 6,8-17; | [XA]US5773871 (BOYD JOHN M [CA], et al) [X] 1-5,7-12,14 * column 8, lines 43-65 * * figure 19 * [A] 6,13; | [A]EP0928023 (SIEMENS AG [DE]) [A] 1-17 * column 2, paragraph 6 ** figure 3b * | [DA] - PATENT ABSTRACTS OF JAPAN, (20021212), vol. 2002, no. 12, & JP2002237518 A 20020823 (SONY CORP) [DA] 1-17 * abstract * * paragraph [0063] * * figure 15 * |