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Extract from the Register of European Patents

EP About this file: EP1523040

EP1523040 - Flip chip heat sink package and method [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  05.07.2019
Database last updated on 07.10.2024
FormerThe patent has been granted
Status updated on  27.07.2018
FormerGrant of patent is intended
Status updated on  09.04.2018
Most recent event   Tooltip03.07.2020Lapse of the patent in a contracting state
New state(s): CY		published on 05.08.2020  [2020/32]
Applicant(s)For all designated states
Delphi Technologies, Inc.
PO Box 5052
Troy, MI 48007 / US
[2005/15]
Inventor(s)01 / Chengalva, Suresh K.
3007 Matthew Dr. - Appt. G
Kokomo, IN 46902 / US
02 / Mandel, Larry M.
21255 Cunion court
Noblesville, IN 46060 / US
03 / Sarma, Dwadasi H.
4707 Glen Moor Way
Kokomo, IN 46902 / US
04 / Gertiser, Kevin M.
624 Heatherwood court
Noblesville, IN 46060 / US
05 / Zimmerman, David W.
12019 Colbarn Dr.
Fishers, IN 46038 / US
 [2005/15]
Representative(s)BorgWarner France SAS
Campus Saint Christophe
Bâtiment Galilée 2
10, avenue de l'Entreprise
95863 Cergy Pontoise Cedex / FR
[N/P]
Former [2018/35]Delphi France SAS
c/o Delphi Technologies
Campus Saint Christophe
Bâtiment Galilée 2
10, avenue de l'Entreprise
95863 Cergy Pontoise Cedex / FR
Former [2013/10]Robert, Vincent
Delphi France SAS
Bât. le Raspail - ZAC Paris Nord 2
22, avenue des Nations
CS 65059 Villepinte
95972 Roissy CDG Cedex / FR
Former [2008/34]Denton, Michael John, et al
Delphi European Headquarters 64 avenue de la Pleine de France Paris Nord II B.P. 65059, Tremblay en France
95972 Roissy Charles de Gaulle Cedex / FR
Former [2005/15]Denton, Michael John, et al
Delphi European Headquarters 64 avenue de la Plaine de France Paris Nord II BP 60059 Tremblay-en-France
95972 Roissy Charles de Gaulle Cedex / FR
Application number, filing date04077702.130.09.2004
[2005/15]
Priority number, dateUS2003068301510.10.2003         Original published format: US 683015
[2005/15]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1523040
Date:13.04.2005
Language:EN
[2005/15]
Type: A3 Search report 
No.:EP1523040
Date:18.04.2007
[2007/16]
Type: B1 Patent specification 
No.:EP1523040
Date:29.08.2018
Language:EN
[2018/35]
Search report(s)(Supplementary) European search report - dispatched on:EP19.03.2007
ClassificationIPC:H01L25/065, H01L23/367, H01L23/427, H01L23/42, H01L21/48, H01L21/56
[2018/16]
CPC:
H01L23/427 (EP,US); H01L21/4878 (EP,US); H01L21/4882 (EP,US);
H01L23/3675 (EP,US); H01L23/3677 (EP,US); H01L23/42 (EP,US);
H01L21/563 (EP,US); H01L2224/16 (EP,US); H01L2224/73204 (EP,US);
H01L2224/73253 (EP,US); Y10T29/49144 (EP,US) (-)
Former IPC [2007/16]H01L25/065, H01L23/367, H01L23/427
Former IPC [2005/15]H01L25/065, H01L23/367
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2018/35]
Former [2005/15]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Flipchip Kühlgehäuse und Methode[2005/15]
English:Flip chip heat sink package and method[2005/15]
French:Boîtier pour puce renversée avec dissipateur de chaleur et méthode associée[2018/17]
Former [2005/15]Boîtier de type puce inversée avec dissipateur de chaleur et méthode associée
Examination procedure18.10.2007Examination requested  [2007/48]
19.11.2007Despatch of a communication from the examining division (Time limit: M04)
04.03.2008Reply to a communication from the examining division
12.06.2009Despatch of a communication from the examining division (Time limit: M04)
21.09.2009Reply to a communication from the examining division
10.04.2018Communication of intention to grant the patent
16.07.2018Fee for grant paid
16.07.2018Fee for publishing/printing paid
16.07.2018Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  19.11.2007
Opposition(s)31.05.2019No opposition filed within time limit [2019/32]
Fees paidRenewal fee
02.10.2006Renewal fee patent year 03
01.10.2007Renewal fee patent year 04
30.09.2008Renewal fee patent year 05
30.09.2009Renewal fee patent year 06
30.09.2010Renewal fee patent year 07
30.09.2011Renewal fee patent year 08
01.10.2012Renewal fee patent year 09
30.09.2013Renewal fee patent year 10
30.09.2014Renewal fee patent year 11
30.09.2015Renewal fee patent year 12
30.09.2016Renewal fee patent year 13
02.10.2017Renewal fee patent year 14
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU30.09.2004
AT29.08.2018
CY29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
MC29.08.2018
NL29.08.2018
PL29.08.2018
PT29.08.2018
RO29.08.2018
SE29.08.2018
SI29.08.2018
SK29.08.2018
TR29.08.2018
BE30.09.2018
CH30.09.2018
IE30.09.2018
LI30.09.2018
LU30.09.2018
BG29.11.2018
GR30.11.2018
[2020/32]
Former [2020/28]HU30.09.2004
AT29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
MC29.08.2018
NL29.08.2018
PL29.08.2018
PT29.08.2018
RO29.08.2018
SE29.08.2018
SI29.08.2018
SK29.08.2018
TR29.08.2018
BE30.09.2018
CH30.09.2018
IE30.09.2018
LI30.09.2018
LU30.09.2018
BG29.11.2018
GR30.11.2018
Former [2020/17]AT29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
MC29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
SI29.08.2018
SK29.08.2018
TR29.08.2018
BE30.09.2018
CH30.09.2018
IE30.09.2018
LI30.09.2018
LU30.09.2018
BG29.11.2018
GR30.11.2018
Former [2019/39]AT29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
MC29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
SI29.08.2018
SK29.08.2018
BE30.09.2018
CH30.09.2018
IE30.09.2018
LI30.09.2018
LU30.09.2018
BG29.11.2018
GR30.11.2018
Former [2019/38]AT29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
MC29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
SI29.08.2018
SK29.08.2018
BE30.09.2018
IE30.09.2018
LU30.09.2018
BG29.11.2018
GR30.11.2018
Former [2019/37]AT29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
MC29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
SI29.08.2018
SK29.08.2018
IE30.09.2018
LU30.09.2018
BG29.11.2018
GR30.11.2018
Former [2019/33]AT29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
MC29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
SK29.08.2018
IE30.09.2018
LU30.09.2018
BG29.11.2018
GR30.11.2018
Former [2019/30]AT29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
MC29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
SK29.08.2018
LU30.09.2018
BG29.11.2018
GR30.11.2018
Former [2019/28]AT29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
MC29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
SK29.08.2018
BG29.11.2018
GR30.11.2018
Former [2019/26]AT29.08.2018
CZ29.08.2018
DK29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
SK29.08.2018
BG29.11.2018
GR30.11.2018
Former [2019/23]AT29.08.2018
CZ29.08.2018
EE29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
SK29.08.2018
BG29.11.2018
GR30.11.2018
Former [2019/22]CZ29.08.2018
ES29.08.2018
FI29.08.2018
IT29.08.2018
NL29.08.2018
PL29.08.2018
RO29.08.2018
SE29.08.2018
BG29.11.2018
GR30.11.2018
Former [2019/21]ES29.08.2018
FI29.08.2018
IT29.08.2018
NL29.08.2018
SE29.08.2018
BG29.11.2018
GR30.11.2018
Former [2019/12]ES29.08.2018
FI29.08.2018
NL29.08.2018
SE29.08.2018
BG29.11.2018
GR30.11.2018
Former [2019/10]FI29.08.2018
NL29.08.2018
SE29.08.2018
BG29.11.2018
GR30.11.2018
Former [2019/09]FI29.08.2018
NL29.08.2018
Former [2019/08]FI29.08.2018
Documents cited:Search[A]US5608610  (BRZEZINSKI DENNIS [US]) [A] 1-20 * the whole document *;
 [A]US6008536  (MERTOL ATILA [US]) [A] 1-20 * the whole document *;
 [XY]US6101092  (ONISHI YUKIHIRO [JP]) [X] 1-3,6,7,11-14,17-19 * column 3, line 17 - column 4, line 11; figures 1,3,5 * [Y] 4,5,9,10,15,16,20;
 [XY]US6118177  (LISCHNER DAVID [US], et al) [X] 1,9,11,12,14,17,18 * the whole document * [Y] 2-8,10,13,15,16,19,20;
 [A]US2001013640  (TAO TETSUYA [JP]) [A] 1-20* the whole document *;
 [XY]US2001026957  (ATWOOD EUGENE R [US], et al) [X] 1-4,10-12,17,18 * figures 1,2A,3,5 * * paragraph [0076] - paragraph [0083] * [Y] 5-9,13-16,19,20;
 [Y]EP1178594  (MITSUBISHI ELECTRIC CORP [JP]) [Y] 1-20 * figures 1,2 * * paragraph [0018] - paragraph [0019] * * paragraph [0023] *;
 [XY]US6411507  (AKRAM SALMAN [US]) [X] 1,9,11,12,14,17,18 * figure 2 * * column 3, line 9 - line 46 * [Y] 2-8,10,13,15,16,19,20;
 [XY]JP2002353388  (HITACHI LTD) [X] 1,6,7,9-12,15-19 * figures 1-3,9,17,18 * [Y] 8,14,20;
 [XY]US2003051868  (DISHONGH TERRANCE J [US], et al) [X] 1-6,10-13,17,18 * figures 1,3 * * paragraph [0019] - paragraph [0025] * [Y] 7-9,14-16,19,20;
 [XY]US2003134454  (HOULE SABINA J [US]) [X] 1,9,11,12,14,17,18 * figures 3,5A-5C,6 * * paragraph [0020] - paragraph [0023] * * paragraph [0029] - paragraph [0032] * [Y] 2-8,10,13,15,16,19,20;
 [Y]  - "A HEAT SINK WITH THERMAL CAPACITANCE", RESEARCH DISCLOSURE, MASON PUBLICATIONS, HAMPSHIRE, GB, (200004), no. 432, ISSN 0374-4353, page 640, XP000968830 [Y] 1-5,10-13,16-18 * the whole document *
by applicantEP1178594
 JP2002353388
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.