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EP About this file: EP1447850

EP1447850 - Electronic parts packaging structure and method of manufacturing the same [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 08.06.2012 Database last updated on 17.05.2024
Most recent event Tooltip	08.06.2012	Application deemed to be withdrawn	published on 11.07.2012 [2012/28]
Applicant(s)	For all designated states SHINKO ELECTRIC INDUSTRIES CO., LTD. 80 Oshimada-machi Nagano-shi, Nagano 381-2287 / JP
	[N/P]
Former [2004/34]	For all designated states Shinko Electric Industries Co., Ltd. 80 Oshimada-machi Nagano-shi, Nagano 381-2287 / JP
Inventor(s)	01 / Sunohara, Masahiro 80, Oshimada-machi Nagano-shi Nagano 381-2287 / JP
	02 / Murayama, Kei 80, Oshimada-machi Nagano-shi Nagano 381-2287 / JP
	03 / Koyama, Toshinori 80, Oshimada-machi Nagano-shi Nagano 381-2287 / JP
	04 / Kobayashi, Kazutaka 80, Oshimada-machi Nagano-shi Nagano 381-2287 / JP
	05 / Higashi, Mitsutoshi 80, Oshimada-machi Nagano-shi Nagano 381-2287 / JP
	[2004/34]
Representative(s)	Fenlon, Christine Lesley, et al Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London WC1V 7JH / GB
	[N/P]
Former [2009/48]	Fenlon, Christine Lesley, et al Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London WC1V 7JH / GB
Former [2004/34]	Fenlon, Christine Lesley, et al Haseltine Lake, Imperial House, 15-19 Kingsway London WC2B 6UD / GB
Application number, filing date	04250677.4	09.02.2004
	[2004/34]
Priority number, date	JP20030035156	13.02.2003 Original published format: JP 2003035156
	[2004/34]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP1447850
	Date:	18.08.2004
	Language:	EN
	[2004/34]
	Type:	A3 Search report
	No.:	EP1447850
	Date:	21.07.2010
	[2010/29]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	17.06.2010
Classification	IPC:	H01L25/065, H01L23/538, H01L21/98	[2004/34]
	CPC:	H01L23/5383 (EP,US); H01L23/12 (KR); H01L21/52 (KR); H01L23/5389 (EP,US); H01L24/24 (EP,US); H01L24/82 (EP,US); (+) H01L24/92 (EP); H01L25/0657 (EP,US); H05K1/185 (EP,US); H05K1/186 (EP,US); H05K3/30 (KR); H01L21/563 (EP,US); H01L21/76898 (EP,US); H01L2224/02372 (EP); H01L2224/02379 (EP); H01L2224/04105 (EP); H01L2224/05001 (EP,US); H01L2224/05022 (EP,US); H01L2224/05023 (EP,US); H01L2224/0508 (EP,US); H01L2224/05548 (EP,US); H01L2224/05568 (EP,US); H01L2224/05573 (EP,US); H01L2224/12105 (EP); H01L2224/13144 (EP,US); H01L2224/16 (US); H01L2224/16146 (EP); H01L2224/16225 (US); H01L2224/16238 (EP); H01L2224/17181 (EP); H01L2224/24226 (EP,US); H01L2224/32225 (EP,US); H01L2224/73204 (EP,US); H01L2224/81205 (EP,US); H01L2224/8121 (EP,US); H01L2224/81815 (EP,US); H01L2224/82039 (EP,US); H01L2224/9202 (EP); H01L2225/06513 (EP,US); H01L2225/06517 (EP,US); H01L2225/06524 (EP,US); H01L2225/06541 (EP,US); H01L2225/06572 (EP,US); H01L24/03 (EP); H01L24/05 (EP); H01L24/81 (EP,US); H01L2924/00011 (EP,US); H01L2924/00014 (EP,US); H01L2924/01004 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01015 (EP,US); H01L2924/01027 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01047 (EP,US); H01L2924/01057 (EP,US); H01L2924/01075 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/014 (EP,US); H01L2924/12042 (EP,US); H01L2924/19041 (EP,US); H01L2924/19043 (EP,US); H01L2924/30105 (EP,US); H05K2201/0195 (EP,US); H05K2201/10636 (EP,US); H05K2201/10674 (EP,US); H05K3/4644 (EP,US); Y02P70/50 (EP,US) (-)
	C-Set:	H01L2224/05155, H01L2924/00014 (EP,US); H01L2224/05644, H01L2924/00014 (EP,US); H01L2224/16225, H01L2224/13144, H01L2924/00 (US,EP); H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP); (+) H01L2224/9202, H01L2224/81, H01L21/76898 (EP); H01L2224/9202, H01L2224/81, H01L2224/03 (EP); H01L2924/00011, H01L2924/01005 (EP,US); H01L2924/00014, H01L2224/48 (US,EP); H01L2924/12042, H01L2924/00 (US,EP) (-)
Designated contracting states	DE, FR [2011/13]
Former [2004/34]	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR
Title	German:	Elektronikteil-Gehäusungsstruktur und ihre Herstellungsmethode	[2004/34]
	English:	Electronic parts packaging structure and method of manufacturing the same	[2004/34]
	French:	Structure d'empaquetage d'un élément électronique et méthode de fabrication associèe	[2004/34]
Examination procedure	17.01.2011	Examination requested [2011/09]
	21.01.2011	Amendment by applicant (claims and/or description)
	22.01.2011	Loss of particular rights, legal effect: designated state(s)
	01.03.2011	Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR
	28.06.2011	Despatch of a communication from the examining division (Time limit: M06)
	10.01.2012	Application deemed to be withdrawn, date of legal effect [2012/28]
	14.02.2012	Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2012/28]
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 28.06.2011
Fees paid	Renewal fee
	14.02.2006	Renewal fee patent year 03
	14.02.2007	Renewal fee patent year 04
	13.02.2008	Renewal fee patent year 05
	13.02.2009	Renewal fee patent year 06
	16.02.2010	Renewal fee patent year 07
	15.02.2011	Renewal fee patent year 08
	Penalty fee
	Additional fee for renewal fee
	29.02.2012	09 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[A]JPH04315458 (SONY CORP) [A] 1,2,6,13,14,18 * abstract *;
		[A]EP0635885 (HUGHES AIRCRAFT CO [US]) [A] 3,4,15,16 * figure -; claim - *;
		[A]US5561085 (GOROWITZ BERNARD [US], et al) [A] 2,7-10,14,19-21 * column 10, lines 12-52; figures 1,3d *;
		[A]EP1041631 (NGK SPARK PLUG CO [JP]) [A] 6,9,18,21 * the whole document *;
		[XY]US2001002727 (SHIRAISHI TSUKASA [JP], et al) [X] 1,5,9,10,12,13,17,21,22 * figure 5 * [Y] 6,18;
		[Y]US2001004130 (HIGASHI MITSUTOSHI [JP], et al) [Y] 11 * figure 3 *;
		[Y]JP2002184796 (MATSUSHITA ELECTRIC IND CO LTD) [Y] 1,5-13,17-22 * figure - *;
		[X]WO02054451 (THALES SA [FR], et al) [X] 7,9,19,21 * the whole document *;
		[Y]EP1225629 (MATSUSHITA ELECTRIC IND CO LTD [JP]) [Y] 6,18 * page 8, line 37 - line 48; figures 3F,3G,7 *;
		[A]US2002117743 (NAKATANI SEIICHI [JP], et al) [A] 1,5,6,9-13,17,18,21,22 * the whole document *;
		[Y]EP1259103 (IBIDEN CO LTD [JP]) [Y] 1,5-13,17-22 * figure - *;
		[Y]US6518649 (IWANE TOMOHIKO [JP], et al) [Y] 5,17 * the whole document *;
		[YP]US6582991 (MAEDA KENJI [JP], et al) [YP] 1,5-13,17-22* figure - *

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