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Extract from the Register of European Patents

EP About this file: EP1597946

EP1597946 - METHOD FOR MANUFACTURING AN ELECTRONIC MODULE, AND AN ELECTRONIC MODULE [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  21.01.2011
Database last updated on 14.09.2024
Most recent event   Tooltip21.01.2011Application deemed to be withdrawnpublished on 23.02.2011  [2011/08]
Applicant(s)For all designated states
Imbera Electronics Oy
P.O. Box 74
02151 Espoo / FI
[2005/47]
Inventor(s)01 / TUOMINEN, Risto
Kivisaarentie 5 A 24
FIN-00960 Helsinki / FI
02 / PALM, Petteri
Alkutie 47 As. 1
FIN-00660 Helsinki / FI
 [2008/50]
Former [2005/47]01 / TUOMINEN, Risto
Väinölänkatu 17 B 18
FIN-00610 Helsinki / FI
02 / PALM, Petteri
Alkutie 47 As. 1
FIN-00660 Helsinki / FI
Representative(s)Tiilikainen, Jarkko Tapio
Seppo Laine Oy
Itämerenkatu 3 B
00180 Helsinki / FI
[N/P]
Former [2005/47]Tiilikainen, Jarkko Tapio
Seppo Laine Oy Itämerenkatu 3 B
FIN-00180 Helsinki / FI
Application number, filing date04714344.125.02.2004
[2005/47]
WO2004FI00102
Priority number, dateFI2003000029326.02.2003         Original published format: FI 20030293
[2005/47]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2004077903
Date:10.09.2004
Language:EN
[2004/37]
Type: A1 Application with search report 
No.:EP1597946
Date:23.11.2005
Language:EN
The application published by WIPO in one of the EPO official languages on 10.09.2004 takes the place of the publication of the European patent application.
[2005/47]
Search report(s)International search report - published on:SE10.09.2004
ClassificationIPC:H05K1/18, H01L21/70
[2005/47]
CPC:
H01L25/50 (EP,US); H05K3/32 (KR); H01L24/19 (EP,US);
H05K1/18 (KR); H05K1/188 (EP,US); H01L2223/54426 (EP,US);
H01L2224/04105 (EP,US); H01L2224/20 (EP,US); H01L25/105 (EP,US);
H01L2924/01004 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US);
H01L2924/01079 (EP,US); H01L2924/01082 (EP,US); H01L2924/01327 (EP,US);
H01L2924/3025 (EP,US); H05K3/4611 (EP,US) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   RO,   SE,   SI,   SK,   TR [2005/47]
Extension statesALNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINES ELEKTRONISCHEN MODULS UND ELEKTRONISCHES MODUL[2005/47]
English:METHOD FOR MANUFACTURING AN ELECTRONIC MODULE, AND AN ELECTRONIC MODULE[2005/47]
French:PROCEDE DE FABRICATION D'UN MODULE ELECTRONIQUE ET MODULE ELECTRONIQUE[2005/47]
Entry into regional phase23.08.2005National basic fee paid 
23.08.2005Designation fee(s) paid 
23.08.2005Examination fee paid 
Examination procedure23.08.2005Examination requested  [2005/47]
01.12.2009Despatch of a communication from the examining division (Time limit: M06)
11.06.2010Reply to a communication from the examining division
01.09.2010Application deemed to be withdrawn, date of legal effect  [2011/08]
07.10.2010Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2011/08]
Fees paidRenewal fee
23.08.2005Renewal fee patent year 03
06.02.2007Renewal fee patent year 04
30.01.2008Renewal fee patent year 05
05.02.2009Renewal fee patent year 06
Penalty fee
Additional fee for renewal fee
28.02.201007   M06   Not yet paid
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Cited inInternational search[X]US6038133  (NAKATANI SEIICHI [JP], et al);
 [Y]GB2204184  (BRACEY STANLEY);
 [Y]DE4424396  (IBM [US]);
 [A]US5042145  (BOUCQUET JAN P [BE]);
 [A]US3480836  (ARONSTEIN JESSE)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.