EP1609184 - ARRANGEMENT COMPOSED OF AN ELECTRICAL COMPONENT ON A SUBSTRATE, AND METHOD FOR THE PRODUCTION OF SAID ARRANGEMENT [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 01.02.2019 Database last updated on 05.07.2024 | |
Former | Examination is in progress Status updated on 28.10.2018 | Most recent event Tooltip | 01.02.2019 | Application deemed to be withdrawn | published on 06.03.2019 [2019/10] | Applicant(s) | For all designated states Siemens Aktiengesellschaft Werner-von-Siemens-Straße 1 80333 München / DE | For all designated states Infineon Technologies AG Am Campeon 1-12 85579 Neubiberg / DE | [2017/35] |
Former [2013/11] | For all designated states Siemens Aktiengesellschaft Wittelsbacherplatz 2 80333 München / DE | ||
For all designated states Infineon Technologies AG Am Campeon 1-12 85579 Neubiberg / DE | |||
Former [2010/22] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 80333 München / DE | ||
For all designated states Infineon Technologies AG Am Campeon 1-12 85579 Neubiberg / DE | |||
Former [2008/31] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 80333 München / DE | ||
For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81669 München / DE | |||
Former [2008/30] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 80333 München / DE | ||
For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81669 München / DE | |||
Former [2006/32] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 80333 München / DE | ||
For all designated states Infineon Technologies AG St. Martin-Strasse 53 81669 München / DE | |||
Former [2005/52] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 80333 München / DE | ||
For all designated states eupec Europäische Gesellschaft für Leistungshalbleiter mbH Max-Planck-Strasse 5 58581 Warstein / DE | Inventor(s) | 01 /
AUERBACH, Franz Schmückersweg 6 59494 Soest / DE | 02 /
GUTSMANN, Bernd Filiederstr. 19 28844 Weyhe / DE | 03 /
LICHT, Thomas Ostterrasse 5 59581 Warstein / DE | 04 /
SELIGER, Norbert Gnesener Str. 24 81929 München / DE | 05 /
WEIDNER, Karl Zauserweg 6 81245 München / DE | 06 /
ZAPF, Jörg Dalandstr. 1 81927 München / DE | [2006/10] |
Former [2005/52] | 01 /
AUERBACH, Franz Schmückersweg 6 59494 Soest / DE | ||
02 /
GUTSMANN, Bernd Ringstr. 31 59581 Warstein / DE | |||
03 /
LICHT, Thomas Ostterrasse 5 59581 Warstein / DE | |||
04 /
SELIGER, Norbert Gnesener Str. 24 81929 München / DE | |||
05 /
WEIDNER, Karl Zauserweg 6 81245 München / DE | |||
06 /
ZAPF, Jörg Dalandstr. 1 81927 München / DE | Application number, filing date | 04718634.1 | 09.03.2004 | [2005/52] | WO2004EP02424 | Priority number, date | DE20031014172 | 28.03.2003 Original published format: DE 10314172 | [2005/52] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | WO2004086502 | Date: | 07.10.2004 | Language: | DE | [2004/41] | Type: | A1 Application with search report | No.: | EP1609184 | Date: | 28.12.2005 | Language: | DE | The application published by WIPO in one of the EPO official languages on 07.10.2004 takes the place of the publication of the European patent application. | [2005/52] | Search report(s) | International search report - published on: | EP | 07.10.2004 | Classification | IPC: | H01L23/538, H01L23/498, H01L23/66 | [2005/52] | CPC: |
H01L23/552 (EP,US);
H01L23/49844 (EP,US);
H01L23/5389 (EP,US);
H01L24/24 (EP,US);
H01L24/36 (US);
H01L24/40 (EP,US);
H01L24/50 (EP,US);
H01L24/82 (EP,US);
H01L24/86 (EP,US);
H01L24/97 (EP,US);
H01L2224/45124 (EP,US);
H01L2224/73267 (EP,US);
H01L2224/97 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01023 (EP,US);
H01L2924/01027 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01058 (EP,US);
H01L2924/01061 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/01327 (EP,US);
H01L2924/014 (EP,US);
H01L2924/09701 (EP,US);
H01L2924/1305 (EP,US);
H01L2924/13055 (EP,US);
H01L2924/13091 (EP,US);
H01L2924/30107 (EP,US);
H01L2924/3025 (EP,US)
(-)
| C-Set: |
H01L2224/45124, H01L2924/00 (US,EP);
H01L2224/97, H01L2224/82 (EP,US);
H01L2924/00014, H01L2224/37099 (EP,US);
H01L2924/00014, H01L2224/48 (US,EP); | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR [2005/52] | Extension states | AL | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | Title | German: | ANORDNUNG AUS EINEM ELEKTRISCHEN BAUELEMENT AUF EINEM SUBSTRAT UND VERFAHREN ZUM HERSTELLEN DER ANORDNUNG | [2005/52] | English: | ARRANGEMENT COMPOSED OF AN ELECTRICAL COMPONENT ON A SUBSTRATE, AND METHOD FOR THE PRODUCTION OF SAID ARRANGEMENT | [2005/52] | French: | ENSEMBLE CONSTITUE D'UN COMPOSANT ELECTRIQUE SUR UN SUBSTRAT ET SON PROCEDE DE PRODUCTION | [2005/52] | Entry into regional phase | 15.09.2005 | National basic fee paid | 15.09.2005 | Designation fee(s) paid | 15.09.2005 | Examination fee paid | Examination procedure | 15.09.2005 | Examination requested [2005/52] | 17.12.2008 | Despatch of a communication from the examining division (Time limit: M04) | 17.12.2008 | Despatch of a communication from the examining division (Time limit: M06) | 25.06.2009 | Reply to a communication from the examining division | 09.07.2018 | Cancellation of oral proceeding that was planned for 10.07.2018 | 10.07.2018 | Date of oral proceedings (cancelled) | 02.10.2018 | Application deemed to be withdrawn, date of legal effect [2019/10] | 29.10.2018 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2019/10] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 17.12.2008 | Fees paid | Renewal fee | 22.03.2006 | Renewal fee patent year 03 | 22.03.2007 | Renewal fee patent year 04 | 20.03.2008 | Renewal fee patent year 05 | 20.03.2009 | Renewal fee patent year 06 | 29.03.2010 | Renewal fee patent year 07 | 21.03.2011 | Renewal fee patent year 08 | 19.03.2012 | Renewal fee patent year 09 | 19.03.2013 | Renewal fee patent year 10 | 20.03.2014 | Renewal fee patent year 11 | 20.03.2015 | Renewal fee patent year 12 | 21.03.2016 | Renewal fee patent year 13 | 20.03.2017 | Renewal fee patent year 14 | Penalty fee | Additional fee for renewal fee | 31.03.2018 | 15   M06   Not yet paid |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [X]US3978578 (MURPHY JAMES C) [X] 1,6-19 * column 1, lines 47-63 * * column 2, line 16 - column 3, line 20; figures 1,2a-2c * * column 3, line 59 - column 4, line 17; figure 3 *; | [X]FR2382101 (LABO ELECTRONIQUE PHYSIQUE [FR]) [X] 1-8,21 * page 1, lines 16-34 * * page 2, lines 22-36 * * page 3, line 12 - page 4, line 4; figure 1 * * page 4, line 27 - page 5, line 6; figure 3 * * page 6, lines 1-15 *; | [YA]US4937707 (MCBRIDE DONALD G [US], et al) [Y] 21 * column 2, lines 25-43 * * column 3, lines 32-53; figures 1,2 * * column 4, line 4 - column 5, line 20 * [A] 1-21; | [X]EP0380906 (IBM [US]) [X] 1-8,21 * column 1, lines 9-50 * * column 5, lines 32-57; figures 3,4 * * column 7, line 33 - column 8, line 29; figures 7,8 *; | [A]US5027192 (KLOUCEK FRANZ [CH]) [A] 3 * column 1, line 21 - column 2, line 25 * * column 2, line 60 - column 3, line 36; figure 1 * * column 4, line 44 - column 5, line 31; figures 4a,4b * * column 5, lines 32-56; figure 5 *; | [XY]EP0473929 (IBM [US]) [X] 1-9,12,14,19,20 * column 4, line 12 - column 5, line 37; figure 1 * * column 5, line 58 - column 6, line 27 * * column 9, line 28 - column 10, line 20; figures 8-10 * * column 1, lines 1-12 * [Y] 21; | [A]WO9506946 (MOTOROLA INC [US]) [A] 3 * page 1, lines 25-35 * * page 2, line 25 - page 3, line 17 * * page 3, line 32 - page 4, line 7 * * page 5, lines 22-29; figure 2 ** page 6, line 32 - page 7, line 15; figure 3 *; | [X]US5452182 (EICHELBERGER CHARLES W [US], et al) [X] 1,2,6-8 * column 5, line 15 - column 6, line 39 * * column 7, line 47 - column 9, line 9; figure 1 * * column 9, lines 43-68; figure 2 * * column 11, lines 28-41 * * column 14, line 63 - column 15, line 55; figures 15,16 *; | [X]US5856913 (HEILBRONNER HEINRICH [DE]) [X] 1,2,4-8 * column 2, lines 28-56 * * column 2, line 66 - column 4, line 31; figures 1,2 *; | [A] - ANONYMOUS, "Improved Method for C-4 Chip Join", IBM TECHNICAL DISCLOSURE BULLETIN, New York, US, (19881101), vol. 31, no. 6, pages 335 - 336, XP002288386 [A] 1-21 * page 335 - page 336; figures 1,2 * | Examination | US4783695 | WO0221595 |