blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News flashes

New version of the European Patent Register - SPC information for Unitary Patents.

2024-03-06

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP1609184

EP1609184 - ARRANGEMENT COMPOSED OF AN ELECTRICAL COMPONENT ON A SUBSTRATE, AND METHOD FOR THE PRODUCTION OF SAID ARRANGEMENT [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  01.02.2019
Database last updated on 05.07.2024
FormerExamination is in progress
Status updated on  28.10.2018
Most recent event   Tooltip01.02.2019Application deemed to be withdrawnpublished on 06.03.2019  [2019/10]
Applicant(s)For all designated states
Siemens Aktiengesellschaft
Werner-von-Siemens-Straße 1
80333 München / DE
For all designated states
Infineon Technologies AG
Am Campeon 1-12
85579 Neubiberg / DE
[2017/35]
Former [2013/11]For all designated states
Siemens Aktiengesellschaft
Wittelsbacherplatz 2
80333 München / DE
For all designated states
Infineon Technologies AG
Am Campeon 1-12
85579 Neubiberg / DE
Former [2010/22]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
80333 München / DE
For all designated states
Infineon Technologies AG
Am Campeon 1-12
85579 Neubiberg / DE
Former [2008/31]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
80333 München / DE
For all designated states
Infineon Technologies AG
St.-Martin-Strasse 53
81669 München / DE
Former [2008/30]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
80333 München / DE
For all designated states
Infineon Technologies AG
St.-Martin-Strasse 53
81669 München / DE
Former [2006/32]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
80333 München / DE
For all designated states
Infineon Technologies AG
St. Martin-Strasse 53
81669 München / DE
Former [2005/52]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
80333 München / DE
For all designated states
eupec Europäische Gesellschaft für Leistungshalbleiter mbH
Max-Planck-Strasse 5
58581 Warstein / DE
Inventor(s)01 / AUERBACH, Franz
Schmückersweg 6
59494 Soest / DE
02 / GUTSMANN, Bernd
Filiederstr. 19
28844 Weyhe / DE
03 / LICHT, Thomas
Ostterrasse 5
59581 Warstein / DE
04 / SELIGER, Norbert
Gnesener Str. 24
81929 München / DE
05 / WEIDNER, Karl
Zauserweg 6
81245 München / DE
06 / ZAPF, Jörg
Dalandstr. 1
81927 München / DE
 [2006/10]
Former [2005/52]01 / AUERBACH, Franz
Schmückersweg 6
59494 Soest / DE
02 / GUTSMANN, Bernd
Ringstr. 31
59581 Warstein / DE
03 / LICHT, Thomas
Ostterrasse 5
59581 Warstein / DE
04 / SELIGER, Norbert
Gnesener Str. 24
81929 München / DE
05 / WEIDNER, Karl
Zauserweg 6
81245 München / DE
06 / ZAPF, Jörg
Dalandstr. 1
81927 München / DE
Application number, filing date04718634.109.03.2004
[2005/52]
WO2004EP02424
Priority number, dateDE2003101417228.03.2003         Original published format: DE 10314172
[2005/52]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report
No.:WO2004086502
Date:07.10.2004
Language:DE
[2004/41]
Type: A1 Application with search report 
No.:EP1609184
Date:28.12.2005
Language:DE
The application published by WIPO in one of the EPO official languages on 07.10.2004 takes the place of the publication of the European patent application.
[2005/52]
Search report(s)International search report - published on:EP07.10.2004
ClassificationIPC:H01L23/538, H01L23/498, H01L23/66
[2005/52]
CPC:
H01L23/552 (EP,US); H01L23/49844 (EP,US); H01L23/5389 (EP,US);
H01L24/24 (EP,US); H01L24/36 (US); H01L24/40 (EP,US);
H01L24/50 (EP,US); H01L24/82 (EP,US); H01L24/86 (EP,US);
H01L24/97 (EP,US); H01L2224/45124 (EP,US); H01L2224/73267 (EP,US);
H01L2224/97 (EP,US); H01L2924/00014 (EP,US); H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01023 (EP,US);
H01L2924/01027 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US);
H01L2924/01058 (EP,US); H01L2924/01061 (EP,US); H01L2924/01074 (EP,US);
H01L2924/01078 (EP,US); H01L2924/01082 (EP,US); H01L2924/01327 (EP,US);
H01L2924/014 (EP,US); H01L2924/09701 (EP,US); H01L2924/1305 (EP,US);
H01L2924/13055 (EP,US); H01L2924/13091 (EP,US); H01L2924/30107 (EP,US);
H01L2924/3025 (EP,US) (-)
C-Set:
H01L2224/45124, H01L2924/00 (US,EP);
H01L2224/97, H01L2224/82 (EP,US);
H01L2924/00014, H01L2224/37099 (EP,US);
H01L2924/00014, H01L2224/48 (US,EP);
H01L2924/00014, H01L2224/73221 (EP);
H01L2924/1305, H01L2924/00 (US,EP)
(-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2005/52]
Extension statesALNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
TitleGerman:ANORDNUNG AUS EINEM ELEKTRISCHEN BAUELEMENT AUF EINEM SUBSTRAT UND VERFAHREN ZUM HERSTELLEN DER ANORDNUNG[2005/52]
English:ARRANGEMENT COMPOSED OF AN ELECTRICAL COMPONENT ON A SUBSTRATE, AND METHOD FOR THE PRODUCTION OF SAID ARRANGEMENT[2005/52]
French:ENSEMBLE CONSTITUE D'UN COMPOSANT ELECTRIQUE SUR UN SUBSTRAT ET SON PROCEDE DE PRODUCTION[2005/52]
Entry into regional phase15.09.2005National basic fee paid 
15.09.2005Designation fee(s) paid 
15.09.2005Examination fee paid 
Examination procedure15.09.2005Examination requested  [2005/52]
17.12.2008Despatch of a communication from the examining division (Time limit: M04)
17.12.2008Despatch of a communication from the examining division (Time limit: M06)
25.06.2009Reply to a communication from the examining division
09.07.2018Cancellation of oral proceeding that was planned for 10.07.2018
10.07.2018Date of oral proceedings (cancelled)
02.10.2018Application deemed to be withdrawn, date of legal effect  [2019/10]
29.10.2018Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2019/10]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  17.12.2008
Fees paidRenewal fee
22.03.2006Renewal fee patent year 03
22.03.2007Renewal fee patent year 04
20.03.2008Renewal fee patent year 05
20.03.2009Renewal fee patent year 06
29.03.2010Renewal fee patent year 07
21.03.2011Renewal fee patent year 08
19.03.2012Renewal fee patent year 09
19.03.2013Renewal fee patent year 10
20.03.2014Renewal fee patent year 11
20.03.2015Renewal fee patent year 12
21.03.2016Renewal fee patent year 13
20.03.2017Renewal fee patent year 14
Penalty fee
Additional fee for renewal fee
31.03.201815   M06   Not yet paid
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[X]US3978578  (MURPHY JAMES C) [X] 1,6-19 * column 1, lines 47-63 * * column 2, line 16 - column 3, line 20; figures 1,2a-2c * * column 3, line 59 - column 4, line 17; figure 3 *;
 [X]FR2382101  (LABO ELECTRONIQUE PHYSIQUE [FR]) [X] 1-8,21 * page 1, lines 16-34 * * page 2, lines 22-36 * * page 3, line 12 - page 4, line 4; figure 1 * * page 4, line 27 - page 5, line 6; figure 3 * * page 6, lines 1-15 *;
 [YA]US4937707  (MCBRIDE DONALD G [US], et al) [Y] 21 * column 2, lines 25-43 * * column 3, lines 32-53; figures 1,2 * * column 4, line 4 - column 5, line 20 * [A] 1-21;
 [X]EP0380906  (IBM [US]) [X] 1-8,21 * column 1, lines 9-50 * * column 5, lines 32-57; figures 3,4 * * column 7, line 33 - column 8, line 29; figures 7,8 *;
 [A]US5027192  (KLOUCEK FRANZ [CH]) [A] 3 * column 1, line 21 - column 2, line 25 * * column 2, line 60 - column 3, line 36; figure 1 * * column 4, line 44 - column 5, line 31; figures 4a,4b * * column 5, lines 32-56; figure 5 *;
 [XY]EP0473929  (IBM [US]) [X] 1-9,12,14,19,20 * column 4, line 12 - column 5, line 37; figure 1 * * column 5, line 58 - column 6, line 27 * * column 9, line 28 - column 10, line 20; figures 8-10 * * column 1, lines 1-12 * [Y] 21;
 [A]WO9506946  (MOTOROLA INC [US]) [A] 3 * page 1, lines 25-35 * * page 2, line 25 - page 3, line 17 * * page 3, line 32 - page 4, line 7 * * page 5, lines 22-29; figure 2 ** page 6, line 32 - page 7, line 15; figure 3 *;
 [X]US5452182  (EICHELBERGER CHARLES W [US], et al) [X] 1,2,6-8 * column 5, line 15 - column 6, line 39 * * column 7, line 47 - column 9, line 9; figure 1 * * column 9, lines 43-68; figure 2 * * column 11, lines 28-41 * * column 14, line 63 - column 15, line 55; figures 15,16 *;
 [X]US5856913  (HEILBRONNER HEINRICH [DE]) [X] 1,2,4-8 * column 2, lines 28-56 * * column 2, line 66 - column 4, line 31; figures 1,2 *;
 [A]  - ANONYMOUS, "Improved Method for C-4 Chip Join", IBM TECHNICAL DISCLOSURE BULLETIN, New York, US, (19881101), vol. 31, no. 6, pages 335 - 336, XP002288386 [A] 1-21 * page 335 - page 336; figures 1,2 *
ExaminationUS4783695
 WO0221595
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.