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Extract from the Register of European Patents

EP About this file: EP1665400

EP1665400 - Semiconductor light-emitting diode an its manufacturing method [Right-click to bookmark this link]
Former [2006/23]SEMICONDUCTOR LIGHT-EMITTING DEVICE AND ITS MANUFACTURING METHOD
[2009/01]
StatusNo opposition filed within time limit
Status updated on  12.03.2010
Database last updated on 19.07.2024
Most recent event   Tooltip07.10.2011Lapse of the patent in a contracting state
New state(s): CY, TR		published on 09.11.2011  [2011/45]
Applicant(s)For all designated states
Panasonic Electric Works Co., Ltd.
1048 Oaza Kadoma Kadoma-shi
Osaka / JP
[2009/08]
Former [2006/23]For all designated states
MATSUSHITA ELECTRIC WORKS, LTD.
1048, Oaza-Kadoma
Kadoma-shi, Osaka 571-8686 / JP
Inventor(s)01 / TANAKA, Kenichiro, c/o Matsushita Elec. Works Ltd.
1048, Oaza-Kadoma
Kadoma-shi, Osaka 5718686 / JP
02 / KUBO, Masao, c/o Matsushita Electric Works, Ltd.
1048, Oaza-Kadoma
Kadoma-shi, Osaka 5718686 / JP
 [2006/23]
Representative(s)Mackenzie, Andrew Bryan, et al
Scott & York
Intellectual Property Limited
45 Grosvenor Road
St. Albans Hertfordshire AL1 3AW / GB
[N/P]
Former [2006/50]Mackenzie, Andrew Bryan, et al
Scott & York Intellectual Property Limited 45 Grosvenor Road
St. Albans, Hertfordshire AL1 3AW / GB
Former [2006/23]Mackenzie, Andrew Bryan, et al
Marks & Clerk 45 Grosvenor Road
St. Albans, Hertfordshire AL1 3AW / GB
Application number, filing date04773551.924.09.2004
[2006/23]
WO2004JP14464
Priority number, dateJP2003033106024.09.2003         Original published format: JP 2003331060
[2006/23]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO2005029599
Date:31.03.2005
Language:EN
[2005/13]
Type: A2 Application without search report 
No.:EP1665400
Date:07.06.2006
Language:EN
The application published by WIPO in one of the EPO official languages on 31.03.2005 takes the place of the publication of the European patent application.
[2006/23]
Type: B1 Patent specification 
No.:EP1665400
Date:06.05.2009
Language:EN
[2009/19]
Search report(s)International search report - published on:EP17.11.2005
ClassificationIPC:H01L33/00
[2006/23]
CPC:
H01L33/486 (EP,US); H01L24/18 (US); H01L24/82 (EP,US);
H01L33/62 (EP,US); H01L21/568 (EP,US); H01L2224/04105 (EP,US);
H01L2224/18 (EP,US); H01L2224/32245 (EP,US); H01L2224/73267 (EP,US);
H01L2224/82005 (EP,US); H01L2224/92244 (EP,US); H01L24/24 (EP);
H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01013 (EP,US);
H01L2924/01015 (EP,US); H01L2924/01018 (EP,US); H01L2924/01019 (EP,US);
H01L2924/01024 (EP,US); H01L2924/01025 (EP,US); H01L2924/01027 (EP,US);
H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01047 (EP,US);
H01L2924/01074 (EP,US); H01L2924/01075 (EP,US); H01L2924/01078 (EP,US);
H01L2924/014 (EP,US); H01L2924/12041 (EP,US); H01L2924/12042 (EP,US);
H01L2933/0066 (EP,US); H01L33/0093 (EP,US) (-)
C-Set:
H01L2924/12042, H01L2924/00 (EP,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2006/23]
Extension statesALNot yet paid
HRNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
TitleGerman:Lichtemittierende Halbleiterdiode und Herstellungsverfahren dafür[2009/01]
English:Semiconductor light-emitting diode an its manufacturing method[2009/01]
French:Diode luminescente à semi-conducteur et son procédé de fabrication[2009/01]
Former [2006/23]LICHTEMITTIERENDES HALBLEITERBAUELEMENT UND HERSTELLUNGSVERFAHREN DAFÜR
Former [2006/23]SEMICONDUCTOR LIGHT-EMITTING DEVICE AND ITS MANUFACTURING METHOD
Former [2006/23]DISPOSITIF PHOTOLUMINESCENT ET SON PROCEDE DE FABRICATION
Entry into regional phase09.01.2006National basic fee paid 
09.01.2006Designation fee(s) paid 
09.01.2006Examination fee paid 
Examination procedure13.01.2006Examination requested  [2006/23]
06.07.2007Despatch of a communication from the examining division (Time limit: M04)
09.11.2007Reply to a communication from the examining division
04.12.2008Communication of intention to grant the patent
18.03.2009Fee for grant paid
18.03.2009Fee for publishing/printing paid
Opposition(s)09.02.2010No opposition filed within time limit [2010/15]
Fees paidRenewal fee
11.09.2006Renewal fee patent year 03
12.09.2007Renewal fee patent year 04
15.09.2008Renewal fee patent year 05
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT06.05.2009
BE06.05.2009
CY06.05.2009
CZ06.05.2009
DK06.05.2009
EE06.05.2009
FI06.05.2009
PL06.05.2009
RO06.05.2009
SI06.05.2009
SK06.05.2009
TR06.05.2009
BG06.08.2009
SE06.08.2009
GR07.08.2009
ES17.08.2009
PT06.09.2009
IE24.09.2009
LU24.09.2009
CH30.09.2009
LI30.09.2009
MC30.09.2009
HU07.11.2009
[2011/44]
Former [2011/32]AT06.05.2009
BE06.05.2009
CZ06.05.2009
DK06.05.2009
EE06.05.2009
FI06.05.2009
PL06.05.2009
RO06.05.2009
SI06.05.2009
SK06.05.2009
BG06.08.2009
SE06.08.2009
GR07.08.2009
ES17.08.2009
PT06.09.2009
IE24.09.2009
LU24.09.2009
CH30.09.2009
LI30.09.2009
MC30.09.2009
HU07.11.2009
Former [2011/21]AT06.05.2009
BE06.05.2009
CZ06.05.2009
DK06.05.2009
EE06.05.2009
FI06.05.2009
PL06.05.2009
RO06.05.2009
SI06.05.2009
SK06.05.2009
BG06.08.2009
SE06.08.2009
GR07.08.2009
ES17.08.2009
PT06.09.2009
IE24.09.2009
LU24.09.2009
CH30.09.2009
LI30.09.2009
MC30.09.2009
Former [2010/46]AT06.05.2009
BE06.05.2009
CZ06.05.2009
DK06.05.2009
EE06.05.2009
FI06.05.2009
PL06.05.2009
RO06.05.2009
SI06.05.2009
SK06.05.2009
BG06.08.2009
SE06.08.2009
GR07.08.2009
ES17.08.2009
PT06.09.2009
IE24.09.2009
CH30.09.2009
LI30.09.2009
MC30.09.2009
Former [2010/35]AT06.05.2009
BE06.05.2009
CZ06.05.2009
DK06.05.2009
EE06.05.2009
FI06.05.2009
PL06.05.2009
RO06.05.2009
SI06.05.2009
SK06.05.2009
BG06.08.2009
SE06.08.2009
ES17.08.2009
PT06.09.2009
IE24.09.2009
MC30.09.2009
Former [2010/20]AT06.05.2009
BE06.05.2009
CZ06.05.2009
DK06.05.2009
EE06.05.2009
FI06.05.2009
PL06.05.2009
RO06.05.2009
SI06.05.2009
SK06.05.2009
BG06.08.2009
SE06.08.2009
ES17.08.2009
PT06.09.2009
MC30.09.2009
Former [2010/18]AT06.05.2009
BE06.05.2009
CZ06.05.2009
DK06.05.2009
EE06.05.2009
FI06.05.2009
PL06.05.2009
RO06.05.2009
SI06.05.2009
SK06.05.2009
BG06.08.2009
SE06.08.2009
ES17.08.2009
PT06.09.2009
Former [2010/10]AT06.05.2009
BE06.05.2009
CZ06.05.2009
DK06.05.2009
EE06.05.2009
FI06.05.2009
PL06.05.2009
RO06.05.2009
SI06.05.2009
SK06.05.2009
SE06.08.2009
ES17.08.2009
PT06.09.2009
Former [2010/01]AT06.05.2009
FI06.05.2009
PL06.05.2009
SI06.05.2009
SE06.08.2009
ES17.08.2009
PT06.09.2009
Former [2009/51]AT06.05.2009
FI06.05.2009
SI06.05.2009
SE06.08.2009
ES17.08.2009
PT06.09.2009
Former [2009/46]ES17.08.2009
Cited inInternational search[DA]JP2000196197  ;
 [X]EP0921577  (MATSUSHITA ELECTRONICS CORP [JP]) [X] 1-4 * paragraphs [0103] - [0108]; figures 6A,6B *;
 US6448102  [ ] (KNEISSL MICHAEL A [US], et al);
 [A]WO03044872  (SANYO ELECTRIC CO [JP], et al) [A] 1,5 * abstract *;
 [A]US2003160258  (OOHATA TOYOHARU [JP]) [A] 1,5 * the whole document *;
 EP1460694  [ ] (SANYO ELECTRIC CO [JP], et al)
 [DA]  - PATENT ABSTRACTS OF JAPAN, (20001117), vol. 2000, no. 10, & JP2000196197 A 20000714 (XEROX CORP) [DA] 1,5 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.