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EP1649502
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EP About this file: EP1649502
| EP1649502 - MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING ON BARRIER METALS [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 20.07.2012 Database last updated on 19.10.2024 | Most recent event Tooltip | 20.07.2012 | Application deemed to be withdrawn | published on 22.08.2012 [2012/34] | Applicant(s) | For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, CA 95054 / US | [N/P] |
| Former [2006/17] | For all designated states APPLIED MATERIALS, INC. 3050 Bowers Avenue Santa Clara, California 95054 / US | Inventor(s) | 01 /
SUN, Zhi-Wen 126 Destry Ct. San Jose, CA 95136 / US | 02 /
HE, Renren 1561 Oak Point Terrace Sunnyvale, CA 94087 / US | 03 /
WANG, You 22653 Queens Oak Ct. Cupertino, CA 95014 / US | 04 /
WANG, Michael X. 794 Cereza Dr. Palo Alto, CA 94306 / US | [2006/17] | Representative(s) | Bayliss, Geoffrey Cyril BOULT WADE TENNANT Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | [N/P] |
| Former [2009/52] | Bayliss, Geoffrey Cyril Boult Wade Tennant Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | ||
| Former [2006/17] | Bayliss, Geoffrey Cyril BOULT WADE TENNANT, Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | Application number, filing date | 04777705.7 | 08.07.2004 | [2006/17] | WO2004US21771 | Priority number, date | US20030616097 | 08.07.2003 Original published format: US 616097 | [2006/17] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2005008759 | Date: | 27.01.2005 | Language: | EN | [2005/04] | Type: | A1 Application with search report | No.: | EP1649502 | Date: | 26.04.2006 | Language: | EN | The application published by WIPO in one of the EPO official languages on 27.01.2005 takes the place of the publication of the European patent application. | [2006/17] | Search report(s) | International search report - published on: | EP | 27.01.2005 | Classification | IPC: | H01L21/288, H01L21/768, C25D3/38 | [2006/17] | CPC: |
H01L21/76864 (EP,US);
C25D3/38 (EP,US);
C25D5/10 (EP,US);
C25D7/123 (EP,US);
H01L21/2885 (EP,US);
H01L21/76868 (EP,US);
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR [2006/17] | Extension states | AL | Not yet paid | HR | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | Title | German: | MEHRSCHRITTIGER ELEKTROABLAGERUNGSPROZESS ZUR DIREKTKUPFERGALVANISIERUNG AUF BARRIERENMETALLEN | [2006/17] | English: | MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING ON BARRIER METALS | [2006/17] | French: | PROCEDE D'ELECTRODEPOSITION A PLUSIEURS ETAPES POUR CUIVRAGE DIRECT SUR DES METAUX BARRIERE | [2006/17] | Entry into regional phase | 01.02.2006 | National basic fee paid | 01.02.2006 | Designation fee(s) paid | 01.02.2006 | Examination fee paid | Examination procedure | 01.02.2006 | Amendment by applicant (claims and/or description) | 01.02.2006 | Examination requested [2006/17] | 19.02.2010 | Despatch of a communication from the examining division (Time limit: M04) | 19.10.2010 | Reply to a communication from the examining division | 17.10.2011 | Despatch of a communication from the examining division (Time limit: M04) | 28.02.2012 | Application deemed to be withdrawn, date of legal effect [2012/34] | 04.04.2012 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2012/34] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 19.02.2010 | Request for further processing for: | The application is deemed to be withdrawn due to failure to reply to the examination report | 19.10.2010 | Request for further processing filed | 19.10.2010 | Full payment received (date of receipt of payment) Request granted | 29.10.2010 | Decision despatched | Fees paid | Renewal fee | 01.02.2006 | Renewal fee patent year 03 | 04.07.2007 | Renewal fee patent year 04 | 10.07.2008 | Renewal fee patent year 05 | 08.07.2009 | Renewal fee patent year 06 | 08.07.2010 | Renewal fee patent year 07 | 07.07.2011 | Renewal fee patent year 08 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [Y]US2002027081 (NAGAI MIZUKI [JP], et al) [Y] 1-33 * paragraphs [0117] - [0132] *; | [Y]US6277263 (CHEN LINLIN [US]) [Y] 1-33 * the whole document *; | [Y]US6350364 (JANG SYUN-MING [TW]) [Y] 8-10,20-22,31-33 * the whole document * | Examination | WO03060959 | by applicant | US6277263 |