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Extract from the Register of European Patents

EP About this file: EP1685074

EP1685074 - METHOD OF FORMING MICROSTRUCTURES ON A SUBSTRATE AND A MICROSTRUCTURED ASSEMBLY USED FOR SAME [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  06.07.2012
Database last updated on 24.04.2024
Most recent event   Tooltip06.07.2012Application deemed to be withdrawnpublished on 08.08.2012  [2012/32]
Applicant(s)For all designated states
3M Innovative Properties Company
3M Center
P.O. Box 33427
St. Paul, MN 55133-3427 / US
[N/P]
Former [2008/31]For all designated states
3M Innovative Properties Company
3M Center P.O.Box 33427
St. Paul MN 55133-3427 / US
Former [2006/31]For all designated states
3M Innovative Properties Company
3M Center, P.O. Box 33427
Saint Paul, Minnesota 55133-3427 / US
Inventor(s)01 / YOKOYAMA, Chikafumi
3M Center Post Office Box 33427
Saint Paul, Minnesota 55133-3427 / US
02 / SUGIMOTO, Takaki
3M Center, Post Office Box 33427
Saint Paul, Minnesota 55133-3427 / US
 [2006/31]
Representative(s)Vossius & Partner Patentanwälte Rechtsanwälte mbB
Siebertstrasse 3
81675 München / DE
[N/P]
Former [2008/35]Vossius & Partner
Siebertstrasse 3
81675 München / DE
Former [2006/31]Vossius & Partner
Siebertstrasse 4
81675 München / DE
Application number, filing date04816912.208.10.2004
[2006/31]
WO2004US33170
Priority number, dateUS2003069820031.10.2003         Original published format: US 698200
[2006/31]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO2005042427
Date:12.05.2005
Language:EN
[2005/19]
Type: A2 Application without search report 
No.:EP1685074
Date:02.08.2006
Language:EN
The application published by WIPO in one of the EPO official languages on 12.05.2005 takes the place of the publication of the European patent application.
[2006/31]
Search report(s)International search report - published on:EP07.07.2005
ClassificationIPC:C03C17/00
[2006/31]
CPC:
C03C17/008 (EP,US); H01J9/24 (KR); B29C33/424 (EP,US);
B32B17/06 (EP,KR,US); H01J11/12 (EP,US); H01J11/36 (EP,KR,US);
H01J9/242 (EP,US); B29C33/10 (EP,US); B29L2031/3475 (EP,US);
C03C2218/119 (EP,US); C09K2323/021 (EP,US); H01J2211/36 (EP,US);
H01J2211/361 (EP,US); Y10T428/24355 (EP,US); Y10T428/24628 (EP,US) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2006/31]
Extension statesALNot yet paid
HRNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
TitleGerman:VERFAHREN ZUR AUSBILDUNG VON MIKROSTRUKTUREN AUF EINEM SUBSTRAT UND DAFÜR VERWENDETE MIKROSTRUKTURIERTE ANORDNUNG[2006/31]
English:METHOD OF FORMING MICROSTRUCTURES ON A SUBSTRATE AND A MICROSTRUCTURED ASSEMBLY USED FOR SAME[2006/31]
French:PROCEDE DE FORMATION DE MICROSTRUCTURES SUR UN SUBSTRAT ET ENSEMBLE MICROSTRUCTURE UTILISANT UN TEL PROCEDE[2006/31]
Entry into regional phase12.05.2006National basic fee paid 
12.05.2006Designation fee(s) paid 
12.05.2006Examination fee paid 
Examination procedure12.05.2006Examination requested  [2006/31]
23.05.2006Amendment by applicant (claims and/or description)
09.08.2007Despatch of a communication from the examining division (Time limit: M04)
06.11.2007Reply to a communication from the examining division
15.04.2008Despatch of a communication from the examining division (Time limit: M06)
27.10.2008Reply to a communication from the examining division
08.02.2010Despatch of a communication from the examining division (Time limit: M04)
15.06.2010Reply to a communication from the examining division
04.10.2011Communication of intention to grant the patent
15.02.2012Application deemed to be withdrawn, date of legal effect  [2012/32]
20.03.2012Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time  [2012/32]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  09.08.2007
Fees paidRenewal fee
27.10.2006Renewal fee patent year 03
29.10.2007Renewal fee patent year 04
27.03.2008Renewal fee patent year 05
26.10.2009Renewal fee patent year 06
12.10.2010Renewal fee patent year 07
Penalty fee
Additional fee for renewal fee
31.10.201108   M06   Not yet paid
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Cited inInternational search[X]JP2000137442  ;
 [X]JP2002055624  ;
 [A]WO0120636  (3M INNOVATIVE PROPERTIES CO [US], et al) [A] 1-19* claim - *;
 [A]US2003098528  (CHIU RAYMOND CHI-HING [US], et al) [A] 1-19 * paragraphs [0046] , [0051]; claim 16 *;
 [X]  - PATENT ABSTRACTS OF JAPAN, (20001006), vol. 2000, no. 08, & JP2000137442 A 20000516 (SUMITOMO CHEM CO LTD) [X] 18,19 * abstract *
 [X]  - DATABASE WPI, 0, Derwent World Patents Index, vol. 2002, no. 41, Database accession no. 2002-377190, XP002326562 & JP2002055624 A 20020220 (SUMITOMO RUBBER IND LTD) [X] 18,19 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.