EP1681911 - Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 30.05.2008 Database last updated on 03.09.2024 | Most recent event Tooltip | 25.02.2011 | Lapse of the patent in a contracting state New state(s): IT | published on 30.03.2011 [2011/13] | Applicant(s) | For all designated states CPUMATE INC. NO. 13, Wucyuan 5th Rd., Wugu Township Taipei County 248 / TW | [2006/29] | Inventor(s) | 01 /
Lin, Kuo-Len NO.13, Wucyuan 5th Rd. Wugu Township Taipei County 248 / TW | 02 /
Tsui, Hui-Min NO.13, Wucyuan 5th Rd. Wugu Township Taipei County 248 / TW | 03 /
Hsu, Ken NO.13, Wucyuan 5th Rd. Wugu Township Taipei County 248 / TW | [2006/29] | Representative(s) | Urner, Peter Ter Meer Steinmeister & Partner Patentanwälte mbB Mauerkircherstrasse 45 81679 München / DE | [N/P] |
Former [2006/29] | Urner, Peter TER MEER STEINMEISTER & PARTNER GbR, Patentanwälte, Mauerkircherstrasse 45 81679 München / DE | Application number, filing date | 05000860.6 | 17.01.2005 | [2006/29] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1681911 | Date: | 19.07.2006 | Language: | EN | [2006/29] | Type: | B1 Patent specification | No.: | EP1681911 | Date: | 25.07.2007 | Language: | EN | [2007/30] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 08.07.2005 | Classification | IPC: | H05K7/20, F28D15/02, H01L23/46 | [2006/29] | CPC: |
F28D15/0233 (EP);
F28D15/0275 (EP);
H01L23/427 (EP);
H01L2924/0002 (EP)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR [2006/29] | Title | German: | Wärmeableitvorrichtung mit isothermischer Plattenanordnung von gewünschter Form und Herstellungsverfahren | [2006/29] | English: | Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same | [2006/29] | French: | Dissipateur de chaleur avec ensemble de plaques isothermique de forme prédeterminée et son procédé de fabrication | [2006/29] | Examination procedure | 29.09.2005 | Examination requested [2006/29] | 11.08.2006 | Communication of intention to grant the patent | 11.12.2006 | Fee for grant paid | 11.12.2006 | Fee for publishing/printing paid | Opposition(s) | 28.04.2008 | No opposition filed within time limit [2008/27] | Fees paid | Renewal fee | 19.01.2007 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 25.07.2007 | CH | 25.07.2007 | CY | 25.07.2007 | EE | 25.07.2007 | FI | 25.07.2007 | LI | 25.07.2007 | LT | 25.07.2007 | RO | 25.07.2007 | SI | 25.07.2007 | SK | 25.07.2007 | TR | 25.07.2007 | BG | 25.10.2007 | SE | 25.10.2007 | IS | 25.11.2007 | PT | 26.12.2007 | IE | 17.01.2008 | LU | 17.01.2008 | HU | 26.01.2008 | IT | 31.01.2008 | MC | 31.01.2008 | [2011/13] |
Former [2010/38] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
CY | 25.07.2007 | ||
EE | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
RO | 25.07.2007 | ||
SI | 25.07.2007 | ||
SK | 25.07.2007 | ||
TR | 25.07.2007 | ||
BG | 25.10.2007 | ||
SE | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
IE | 17.01.2008 | ||
LU | 17.01.2008 | ||
HU | 26.01.2008 | ||
MC | 31.01.2008 | ||
Former [2010/36] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
CY | 25.07.2007 | ||
EE | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
RO | 25.07.2007 | ||
SI | 25.07.2007 | ||
SK | 25.07.2007 | ||
BG | 25.10.2007 | ||
SE | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
IE | 17.01.2008 | ||
LU | 17.01.2008 | ||
HU | 26.01.2008 | ||
MC | 31.01.2008 | ||
Former [2010/33] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
CY | 25.07.2007 | ||
EE | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
RO | 25.07.2007 | ||
SI | 25.07.2007 | ||
SK | 25.07.2007 | ||
BG | 25.10.2007 | ||
SE | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
IE | 17.01.2008 | ||
LU | 17.01.2008 | ||
MC | 31.01.2008 | ||
Former [2009/36] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
CY | 25.07.2007 | ||
EE | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
RO | 25.07.2007 | ||
SI | 25.07.2007 | ||
SK | 25.07.2007 | ||
BG | 25.10.2007 | ||
SE | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
IE | 17.01.2008 | ||
MC | 31.01.2008 | ||
Former [2009/29] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
EE | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
RO | 25.07.2007 | ||
SI | 25.07.2007 | ||
SK | 25.07.2007 | ||
BG | 25.10.2007 | ||
SE | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
IE | 17.01.2008 | ||
MC | 31.01.2008 | ||
Former [2009/11] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
EE | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
RO | 25.07.2007 | ||
SK | 25.07.2007 | ||
BG | 25.10.2007 | ||
SE | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
IE | 17.01.2008 | ||
MC | 31.01.2008 | ||
Former [2009/08] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
RO | 25.07.2007 | ||
SK | 25.07.2007 | ||
BG | 25.10.2007 | ||
SE | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
IE | 17.01.2008 | ||
MC | 31.01.2008 | ||
Former [2008/40] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
RO | 25.07.2007 | ||
SK | 25.07.2007 | ||
BG | 25.10.2007 | ||
SE | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
MC | 31.01.2008 | ||
Former [2008/28] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
RO | 25.07.2007 | ||
SK | 25.07.2007 | ||
BG | 25.10.2007 | ||
SE | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
Former [2008/26] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
SK | 25.07.2007 | ||
BG | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
Former [2008/14] | AT | 25.07.2007 | |
CH | 25.07.2007 | ||
FI | 25.07.2007 | ||
LI | 25.07.2007 | ||
LT | 25.07.2007 | ||
BG | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
Former [2008/11] | FI | 25.07.2007 | |
LT | 25.07.2007 | ||
BG | 25.10.2007 | ||
IS | 25.11.2007 | ||
PT | 26.12.2007 | ||
Former [2008/07] | LT | 25.07.2007 | Documents cited: | Search | [A]JP2001223308 ; | [A]NL9400082 (WALL MARTINUS C VAN DER [NL]) [A] 1,5,6 * page 2, line 8 - page 3, line 12 * * figures 1-3 *; | [A]US2003011990 (LAI CHENG TIEN [TW], et al) [A] 1,5,6 * paragraph [0014] - paragraph [0019] * * figures 1,2 * | [A] - PATENT ABSTRACTS OF JAPAN, (20010412), vol. 2000, no. 25, & JP2001223308 A 20010817 (TS HEATRONICS CO LTD) [A] 1,5,6 * abstract * |