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Extract from the Register of European Patents

EP About this file: EP1681911

EP1681911 - Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  30.05.2008
Database last updated on 03.09.2024
Most recent event   Tooltip25.02.2011Lapse of the patent in a contracting state
New state(s): IT		published on 30.03.2011  [2011/13]
Applicant(s)For all designated states
CPUMATE INC.
NO. 13, Wucyuan 5th Rd., Wugu Township
Taipei County 248 / TW
[2006/29]
Inventor(s)01 / Lin, Kuo-Len
NO.13, Wucyuan 5th Rd. Wugu Township
Taipei County 248 / TW
02 / Tsui, Hui-Min
NO.13, Wucyuan 5th Rd. Wugu Township
Taipei County 248 / TW
03 / Hsu, Ken
NO.13, Wucyuan 5th Rd. Wugu Township
Taipei County 248 / TW
 [2006/29]
Representative(s)Urner, Peter
Ter Meer Steinmeister & Partner
Patentanwälte mbB
Mauerkircherstrasse 45
81679 München / DE
[N/P]
Former [2006/29]Urner, Peter
TER MEER STEINMEISTER & PARTNER GbR, Patentanwälte, Mauerkircherstrasse 45
81679 München / DE
Application number, filing date05000860.617.01.2005
[2006/29]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1681911
Date:19.07.2006
Language:EN
[2006/29]
Type: B1 Patent specification 
No.:EP1681911
Date:25.07.2007
Language:EN
[2007/30]
Search report(s)(Supplementary) European search report - dispatched on:EP08.07.2005
ClassificationIPC:H05K7/20, F28D15/02, H01L23/46
[2006/29]
CPC:
F28D15/0233 (EP); F28D15/0275 (EP); H01L23/427 (EP);
H01L2924/0002 (EP)
C-Set:
H01L2924/0002, H01L2924/00 (EP)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2006/29]
TitleGerman:Wärmeableitvorrichtung mit isothermischer Plattenanordnung von gewünschter Form und Herstellungsverfahren[2006/29]
English:Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same[2006/29]
French:Dissipateur de chaleur avec ensemble de plaques isothermique de forme prédeterminée et son procédé de fabrication[2006/29]
Examination procedure29.09.2005Examination requested  [2006/29]
11.08.2006Communication of intention to grant the patent
11.12.2006Fee for grant paid
11.12.2006Fee for publishing/printing paid
Opposition(s)28.04.2008No opposition filed within time limit [2008/27]
Fees paidRenewal fee
19.01.2007Renewal fee patent year 03
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT25.07.2007
CH25.07.2007
CY25.07.2007
EE25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SI25.07.2007
SK25.07.2007
TR25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
IE17.01.2008
LU17.01.2008
HU26.01.2008
IT31.01.2008
MC31.01.2008
[2011/13]
Former [2010/38]AT25.07.2007
CH25.07.2007
CY25.07.2007
EE25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SI25.07.2007
SK25.07.2007
TR25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
IE17.01.2008
LU17.01.2008
HU26.01.2008
MC31.01.2008
Former [2010/36]AT25.07.2007
CH25.07.2007
CY25.07.2007
EE25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SI25.07.2007
SK25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
IE17.01.2008
LU17.01.2008
HU26.01.2008
MC31.01.2008
Former [2010/33]AT25.07.2007
CH25.07.2007
CY25.07.2007
EE25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SI25.07.2007
SK25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
IE17.01.2008
LU17.01.2008
MC31.01.2008
Former [2009/36]AT25.07.2007
CH25.07.2007
CY25.07.2007
EE25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SI25.07.2007
SK25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
IE17.01.2008
MC31.01.2008
Former [2009/29]AT25.07.2007
CH25.07.2007
EE25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SI25.07.2007
SK25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
IE17.01.2008
MC31.01.2008
Former [2009/11]AT25.07.2007
CH25.07.2007
EE25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SK25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
IE17.01.2008
MC31.01.2008
Former [2009/08]AT25.07.2007
CH25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SK25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
IE17.01.2008
MC31.01.2008
Former [2008/40]AT25.07.2007
CH25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SK25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
MC31.01.2008
Former [2008/28]AT25.07.2007
CH25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
RO25.07.2007
SK25.07.2007
BG25.10.2007
SE25.10.2007
IS25.11.2007
PT26.12.2007
Former [2008/26]AT25.07.2007
CH25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
SK25.07.2007
BG25.10.2007
IS25.11.2007
PT26.12.2007
Former [2008/14]AT25.07.2007
CH25.07.2007
FI25.07.2007
LI25.07.2007
LT25.07.2007
BG25.10.2007
IS25.11.2007
PT26.12.2007
Former [2008/11]FI25.07.2007
LT25.07.2007
BG25.10.2007
IS25.11.2007
PT26.12.2007
Former [2008/07]LT25.07.2007
Documents cited:Search[A]JP2001223308  ;
 [A]NL9400082  (WALL MARTINUS C VAN DER [NL]) [A] 1,5,6 * page 2, line 8 - page 3, line 12 * * figures 1-3 *;
 [A]US2003011990  (LAI CHENG TIEN [TW], et al) [A] 1,5,6 * paragraph [0014] - paragraph [0019] * * figures 1,2 *
 [A]  - PATENT ABSTRACTS OF JAPAN, (20010412), vol. 2000, no. 25, & JP2001223308 A 20010817 (TS HEATRONICS CO LTD) [A] 1,5,6 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.