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EP1561541

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EP About this file: EP1561541

EP1561541 - Chemical mechanical polishing pad and polishing process [Right-click to bookmark this link]
Former [2005/32]	Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process
	[2007/48]
Status	No opposition filed within time limit Status updated on 06.03.2009 Database last updated on 21.05.2024
Most recent event Tooltip	06.03.2009	No opposition filed within time limit	published on 08.04.2009 [2009/15]
Applicant(s)	For all designated states JSR Corporation 6-10, Tsukiji 5-chome, Chuo-ku Tokyo 104-0045 / JP
	[2008/18]
Former [2005/32]	For all designated states JSR Corporation 6-10, Tsukiji 5-chome, Chuo-ku Tokyo 104-0045 / JP
Inventor(s)	01 / Okamoto, Takahiro JSR Corporation 5-6-10, Tsukiji Chuo-ku Tokyo 104-0045 / JP
	02 / Miyauchi, Hiroyuki JSR Corporation 5-6-10, Tsukiji Chuo-ku Tokyo 104-0045 / JP
	03 / Kawahara, Kouji JSR Corporation 5-6-10, Tsukiji Chuo-ku Tokyo 104-0045 / JP
	04 / Shiho, Hiroshi JSR Corporation 5-6-10, Tsukiji Chuo-ku Tokyo 104-0045 / JP
	05 / Hasegawa, Kou JSR Corporation 5-6-10, Tsukiji Chuo-ku Tokyo 104-0045 / JP
	06 / Kawahashi, Nobuo JSR Corporation 5-6-10, Tsukiji Chuo-ku Tokyo 104-0045 / JP
	[2005/32]
Representative(s)	TBK Bavariaring 4-6 80336 München / DE
	[N/P]
Former [2008/22]	TBK-Patent Bavariaring 4-6 80336 München / DE
Former [2005/33]	TBK-Patent Bavariaring 4-6 80336 München / DE
Former [2005/32]	Leson, Thomas Johannes Alois, Dipl.-Ing. Tiedtke-Bühling-Kinne & Partner GbR, TBK-Patent, Bavariaring 4-6 80336 München / DE
Application number, filing date	05002400.9	04.02.2005
	[2005/32]
Priority number, date	JP20040029393	05.02.2004 Original published format: JP 2004029393
	JP20040173410	11.06.2004 Original published format: JP 2004173410
	JP20040215931	23.07.2004 Original published format: JP 2004215931
	[2005/32]
Filing language	EN
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	EP1561541
	Date:	10.08.2005
	Language:	EN
	[2005/32]
	Type:	B1 Patent specification
	No.:	EP1561541
	Date:	30.04.2008
	Language:	EN
	[2008/18]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	25.05.2005
Classification	IPC:	B24B37/04, B24D13/14, B24D18/00	[2005/32]
	CPC:	B24B37/24 (EP,US); E03B3/15 (KR); B24D18/00 (EP,US); G01F1/05 (KR)
Designated contracting states	DE, FR, IT [2006/18]
Former [2005/32]	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR
Title	German:	Chemisch-mechanisches Polierkissen und Polierverfahren	[2007/48]
	English:	Chemical mechanical polishing pad and polishing process	[2007/48]
	French:	Tampon à polir et procédé de polissage chimico-mécanique	[2007/48]
	Former [2005/32]	Chemisch-mechanisches Polierkissen, Verfahren zu seiner Herstellung, und chemisch-mechanisches Polierverfahren
	Former [2005/32]	Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process
	Former [2005/32]	Tampon à polir chimico-mécanique, procédé de sa fabrication et procédé de polissage chimico-mécanique
Examination procedure	19.09.2005	Examination requested [2005/46]
	06.02.2006	Despatch of a communication from the examining division (Time limit: M04)
	14.06.2006	Reply to a communication from the examining division
	06.12.2006	Despatch of a communication from the examining division (Time limit: M04)
	11.04.2007	Reply to a communication from the examining division
	31.08.2007	Despatch of a communication from the examining division (Time limit: M04)
	17.10.2007	Reply to a communication from the examining division
	07.11.2007	Communication of intention to grant the patent
	17.03.2008	Fee for grant paid
	17.03.2008	Fee for publishing/printing paid
Opposition(s)	02.02.2009	No opposition filed within time limit [2009/15]
Fees paid	Renewal fee
	28.02.2007	Renewal fee patent year 03
	29.02.2008	Renewal fee patent year 04
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	JP2001334455 [ ];
		[X]US6234875 (PENDERGRASS JR DANIEL B [US]) [X] 1,2 * column 3, lines 8-28 * * column 7, lines 23-43 *;
		[DX]EP1164559 (JSR CORP [JP]) [DX] 1,3,4,7,8 * paragraphs [0017] , [0019] , [0025] *;
		[A]US6354915 (JAMES DAVID B [US], et al) [A] 2 * column 4, line 62 - column 5, line 18 *;
		[X]EP1252973 (JSR CORP [JP]) [X] 1,3-8 * paragraphs [0014] - [0018] - [0035] , [0036] *;
		[X]EP1295680 (JSR CORP [JP]) [X] 1-8 * paragraphs [0013] , [0014] , [0024] , [0032] , [0034] *;
		[PX]EP1470893 (JSR CORP [JP]) [PX] 1-8 * paragraphs [0014] - [0017] - [0023] , [0024] *
		[ ] - PATENT ABSTRACTS OF JAPAN, (20020804), vol. 2002, no. 04, & JP2001334455 A 20011204 (JSR CORP) [ ] * abstract *

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