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Extract from the Register of European Patents

EP About this file: EP1575083

EP1575083 - Method of manufacturing a semiconductor device and semiconductor device obtainable with such a method [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  18.11.2011
Database last updated on 24.04.2024
Most recent event   Tooltip18.11.2011Application deemed to be withdrawnpublished on 21.12.2011  [2011/51]
Applicant(s)For all designated states
IMEC
Kapeldreef 75
3001 Leuven / BE
For all designated states
NXP B.V.
High Tech Campus 60
5656 AG Eindhoven / NL
[2009/33]
Former [2009/11]For all designated states
Interuniversitair Micro-Elektronica Centrum
Kapeldreef 75
3001 Leuven / BE
For all designated states
NXP B.V.
High Tech Campus 60
5656 AG Eindhoven / NL
Former [2005/37]For all designated states
Interuniversitair Micro-Elektronica Centrum
Kapeldreef 75
3001 Leuven / BE
For all designated states
Koninklijke Philips Electronics, N.V.
Groenewoudseweg 1
5621 BA Eindhoven / NL
Inventor(s)01 / Pawlak, Bartlomiej Jan
Ijzerenmolenstraat 152/53
3001 Leuven / BE
 [2005/37]
Representative(s)Bird, Ariane, et al
Bird Goën & Co
Wetenschapspark Arenberg
Gaston Geenslaan 9
3001 Heverlee / BE
[N/P]
Former [2005/37]Bird, Ariane, et al
Bird Goen & Co, Klein Dalenstraat 42A
3020 Winksele / BE
Application number, filing date05003848.823.02.2005
[2005/37]
Priority number, dateEP2004010101312.03.2004         Original published format: EP 04101013
[2005/37]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1575083
Date:14.09.2005
Language:EN
[2005/37]
Type: A3 Search report 
No.:EP1575083
Date:03.09.2008
[2008/36]
Search report(s)(Supplementary) European search report - dispatched on:EP06.08.2008
ClassificationIPC:H01L21/336, H01L21/8238, H01L27/07, H01L27/092
[2005/37]
CPC:
H01L29/7834 (EP); H01L21/823807 (EP); H01L21/823814 (EP);
H01L21/823828 (EP); H01L29/66484 (EP); H01L29/66795 (EP);
H01L29/7831 (EP); H01L29/785 (EP) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2005/37]
TitleGerman:Methode zur Herstellung eines Halbleiterbauelementes und mit dieser Methode herstellbares Halbleiterbauelement[2005/37]
English:Method of manufacturing a semiconductor device and semiconductor device obtainable with such a method[2005/37]
French:Méthode pour la fabrication d'un dispositif semiconducteur pouvant être obtenu avec une telle méthode[2005/37]
Examination procedure06.11.2008Amendment by applicant (claims and/or description)
06.11.2008Examination requested  [2008/51]
04.02.2011Despatch of a communication from the examining division (Time limit: M04)
15.06.2011Application deemed to be withdrawn, date of legal effect  [2011/51]
21.07.2011Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2011/51]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  04.02.2011
Fees paidRenewal fee
15.01.2007Renewal fee patent year 03
13.02.2008Renewal fee patent year 04
24.02.2009Renewal fee patent year 05
24.02.2010Renewal fee patent year 06
Penalty fee
Additional fee for renewal fee
28.02.201107   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XY]US5391506  (TADA YOSHIHIDE [JP], et al) [X] 1,4-6,8-11 * figure 8 * [Y] 2,3;
 [A]US2002011612  (HIEDA KATSUHIKO [JP]) [A] 6 * figure 58 *;
 [A]US6458662  (YU BIN [US]) [A] 2,3 * column 3, line 54 - column 4, line 8; figures 4,5 *;
 [Y]US2002153587  (ADKISSON JAMES W [US], et al) [Y] 2,3 * paragraph [0070]; figure 18B *;
 [DA]US2002192911  (PARKE STEPHEN A [US]) [DA] 1-11* figure 8D *;
 [X]US2003227036  (SUGIYAMA NAOHARU [JP], et al) [X] 1,4-6,8-11 * paragraph [0140]; figure 26 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.