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EP1600258
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EP About this file: EP1600258
| EP1600258 - Method and apparatus for polishing substrate [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 02.11.2007 Database last updated on 22.05.2024 | Most recent event Tooltip | 11.07.2008 | Change - representative | published on 13.08.2008 [2008/33] | Applicant(s) | For all designated states EBARA CORPORATION 11-1, Haneda Asahi-cho Ohta-ku Tokyo 144-8510 / JP | [N/P] |
| Former [2005/48] | For all designated states EBARA CORPORATION 11-1, Haneda Asahi-cho Ohta-ku Tokyo 144-8510 / JP | Inventor(s) | 01 /
Sotozaki, Hiroshi c/o EBARA CORP. 11-1 Haneda Asahi-cho Ohta-ku Tokyo 144-8510 / JP | 02 /
Ato, Koji c/o EBARA CORP. 11-1 Haneda Asahi-cho Ohta-ku Tokyo 144-8510 / JP | [2005/48] | Representative(s) | Wagner, Karl H. Wagner & Geyer Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstrasse 5 80538 München / DE | [N/P] |
| Former [2008/33] | Wagner, Karl H. Wagner & Geyer Partnerschaft Patent- und Rechtsanwälte Gewürzmühlstrasse 5 80538 München / DE | ||
| Former [2005/48] | Wagner, Karl H. WAGNER & GEYER Patentanwälte Gewürzmühlstrasse 5 80538 München / DE | Application number, filing date | 05015086.1 | 08.11.1999 | [2005/48] | Priority number, date | JP19980316522 | 06.11.1998 Original published format: JP 31652298 | JP19990138705 | 19.05.1999 Original published format: JP 13870599 | JP19990236776 | 24.08.1999 Original published format: JP 23677699 | [2005/48] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1600258 | Date: | 30.11.2005 | Language: | EN | [2005/48] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 07.10.2005 | Classification | IPC: | B24B37/04, // H01L21/304 | [2005/48] | CPC: |
B24B37/345 (EP,US);
H01L21/304 (KR);
B24B51/00 (EP,US);
H01L21/02057 (EP,US);
H01L21/67046 (EP,US);
H01L21/67051 (EP,US);
| Designated contracting states | DE, FR [2005/48] | Title | German: | Verfahren und Vorrichtung zum Polieren von Substraten | [2005/48] | English: | Method and apparatus for polishing substrate | [2005/48] | French: | Procédé et dispositif pour le polissage de substrats | [2005/48] | Examination procedure | 12.07.2005 | Examination requested [2005/48] | 26.04.2006 | Despatch of a communication from the examining division (Time limit: M04) | 05.09.2006 | Reply to a communication from the examining division | 01.12.2006 | Despatch of a communication from the examining division (Time limit: M06) | 12.06.2007 | Application deemed to be withdrawn, date of legal effect [2007/49] | 16.07.2007 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2007/49] | Parent application(s) Tooltip | EP99122248.0 / EP0999012 | Fees paid | Renewal fee | 12.07.2005 | Renewal fee patent year 03 | 12.07.2005 | Renewal fee patent year 04 | 12.07.2005 | Renewal fee patent year 05 | 12.07.2005 | Renewal fee patent year 06 | 12.07.2005 | Renewal fee patent year 07 | 29.11.2006 | Renewal fee patent year 08 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4141180 (GILL JR GERALD L, et al) [A] 7,8 * column 2, line 44 - line 52 * * abstract * * figure 1 *; | [Y]EP0757378 (SHINETSU HANDOTAI KK [JP]) [Y] 7,8 * column 2, line 17 - line 26 * * abstract * * figures 1,4 *; | [XY]EP0761387 (EBARA CORP [JP]) [X] 1-6 * page 2, line 51 - page 3, line 15 * * page 4, line 42 - page 5, line 7 * * page 6, line 57 - page 7, line 1 * * figures 1,2,4A,4B * [Y] 7,8; | [A]EP0774323 (APPLIED MATERIALS INC [US]) [A] 7,8 * column 3, line 11 - line 18 *; | [A]US5655954 (OISHI TOSHIO [JP], et al) [A] 1-4,7,8 * column 6, line 7 - line 14 *; | [A]US5725414 (MOINPOUR MONSOUR [US], et al) [A] 1-4,7,8 * column 1, line 32 - line 39 *; | [L]EP0999012 (EBARA CORP [JP]) [L] 9* the whole document * |