-
EP1775757
European procedure
Extract from the Register of European Patents
EP About this file: EP1775757
| EP1775757 - A method for bonding wafers [Right-click to bookmark this link] | |||
| Former [2007/16] | A method and an apparatus for bonding wafers | ||
| [2012/25] | Status | No opposition filed within time limit Status updated on 09.08.2013 Database last updated on 09.09.2024 | Most recent event Tooltip | 09.08.2013 | No opposition filed within time limit | published on 11.09.2013 [2013/37] | Applicant(s) | For all designated states Thallner, Erich Bubing 71 4782 St. Florian / AT | [2012/40] |
| Former [2007/16] | For all designated states Thallner, Erich, Dipl.-Ing. Bubing 71 4782 St. Florian / AT | Inventor(s) | 01 /
see applicant ... | [2007/16] | Representative(s) | Schweiger, Johannes, et al Becker & Müller, Berkenbrink Patentanwälte Turmstrasse 22 40878 Ratingen / DE | [N/P] |
| Former [2007/16] | Schweiger, Johannes, et al Becker & Müller, Berkenbrink Patentanwälte Turmstrasse 22 40878 Ratingen / DE | Application number, filing date | 05022314.8 | 13.10.2005 | [2007/16] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP1775757 | Date: | 18.04.2007 | Language: | DE | [2007/16] | Type: | B1 Patent specification | No.: | EP1775757 | Date: | 03.10.2012 | Language: | DE | [2012/40] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.03.2006 | Classification | IPC: | H01L21/20, H01L21/18 | [2012/25] | CPC: |
H01L21/2007 (EP,US);
H01L21/187 (EP,US)
|
| Former IPC [2007/16] | H01L21/18 | Designated contracting states | AT, DE [2007/52] |
| Former [2007/16] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Verfahren zum Bonden von Wafern | [2012/25] | English: | A method for bonding wafers | [2012/25] | French: | Un procédé pour joindre des wafers | [2012/25] |
| Former [2007/16] | Verfahren und eine Vorrichtung zum Bonden von Wafern | ||
| Former [2007/16] | A method and an apparatus for bonding wafers | ||
| Former [2007/16] | Un appareil et un procédé pour joindre des wafers | Examination procedure | 10.05.2006 | Amendment by applicant (claims and/or description) | 12.05.2007 | Examination requested [2007/26] | 19.10.2007 | Loss of particular rights, legal effect: designated state(s) | 26.11.2007 | Despatch of communication of loss of particular rights: designated state(s) BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | 28.05.2008 | Despatch of a communication from the examining division (Time limit: M06) | 05.12.2008 | Reply to a communication from the examining division | 22.09.2009 | Despatch of a communication from the examining division (Time limit: M06) | 24.03.2010 | Reply to a communication from the examining division | 13.07.2010 | Despatch of a communication from the examining division (Time limit: M06) | 22.12.2010 | Reply to a communication from the examining division | 15.05.2012 | Date of oral proceedings | 28.06.2012 | Minutes of oral proceedings despatched | 04.07.2012 | Communication of intention to grant the patent | 16.08.2012 | Fee for grant paid | 16.08.2012 | Fee for publishing/printing paid | Divisional application(s) | EP10005551.6 / EP2216802 | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 28.05.2008 | Opposition(s) | 04.07.2013 | No opposition filed within time limit [2013/37] | Fees paid | Renewal fee | 04.10.2007 | Renewal fee patent year 03 | 20.08.2008 | Renewal fee patent year 04 | 02.09.2009 | Renewal fee patent year 05 | 11.09.2010 | Renewal fee patent year 06 | 28.10.2011 | Renewal fee patent year 07 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]JPH04342110 ; | [X]US4339295 (BORETOS JOHN W, et al) [X] 12 * abstract *; | [X]GB2263015 (MUKERJEE ROBIN [GB]) [X] 12 * abstract *; | [X]US5421953 (NAGAKUBO MASAO [JP], et al) [X] 1,3,7,9,10 * abstract *; | [XY]US5904860 (NAGAKUBO MASAO [JP], et al) [X] 12 * abstract * [Y] 6,11; | [X]US6548176 (GWO DZ-HUNG [US]) [X] 1-5,7-10 * abstract *; | [X]US2004009649 (KUB FRANCIS J [US], et al) [X] 12* abstract *; | [X]US6905945 (BARMATZ MARTIN B [US], et al) [X] 12 * abstract * | [XY] - PATENT ABSTRACTS OF JAPAN, (19930415), vol. 017, no. 193, Database accession no. (E - 1351), & JP04342110 A 19921127 (FUJITSU LTD) [X] 1,3,7,9,10 * abstract * [Y] 6,11 | Examination | JPH04342110 | - PLOSZL A ET AL, "Wafer direct bonding: tailoring adhesion between brittle materials", MATERIALS SCIENCE AND ENGINEERING R: REPORTS, ELSEVIER SEQUOIA S.A., LAUSANNE, CH LNKD- DOI:10.1016/S0927-796X(98)00017-5, (19990310), vol. 25, no. 1-2, ISSN 0927-796X, pages 1 - 88, XP004167445 DOI: http://dx.doi.org/10.1016/S0927-796X(98)00017-5 | - PATENT ABSTRACTS OF JAPAN, (19930415), vol. 017, no. 193, Database accession no. (E - 1351), & JP04342110 A 19921127 (FUJITSU LTD) | by applicant | JPH04342110 | US5421953 | US6548176 |