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Extract from the Register of European Patents

EP About this file: EP1675218

EP1675218 - Connector device [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  12.09.2008
Database last updated on 03.08.2024
Most recent event   Tooltip12.09.2008No opposition filed within time limitpublished on 15.10.2008  [2008/42]
Applicant(s)For all designated states
SIEMENS AKTIENGESELLSCHAFT
Werner-von-Siemens-Str. 1
DE-80333 München / DE
[N/P]
Former [2008/31]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
80333 München / DE
Former [2006/26]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
80333 München / DE
Inventor(s)01 / Eckert, Gunther
Am Dorfweiher 8 A
93142 Maxhütte-Haidhof / DE
02 / Höhe, Stefan
Am Hohen Ranken 12
93161 Sinzing / DE
03 / Weber, Christoph
Muldenstr. 25
84061 Ergoldsbach / DE
 [2006/26]
Application number, filing date05111747.106.12.2005
[2006/26]
Priority number, dateDE2004106285027.12.2004         Original published format: DE102004062850
[2006/26]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP1675218
Date:28.06.2006
Language:DE
[2006/26]
Type: B1 Patent specification 
No.:EP1675218
Date:07.11.2007
Language:DE
[2007/45]
Search report(s)(Supplementary) European search report - dispatched on:EP04.05.2006
ClassificationIPC:H01R4/48
[2006/26]
CPC:
H01R4/483 (EP); H01R4/4821 (EP)
Designated contracting statesDE,   ES,   FR,   IT [2007/10]
Former [2006/26]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Anschlussvorrichtung[2006/26]
English:Connector device[2006/26]
French:Dispositif de connexion[2006/26]
Examination procedure27.12.2006Examination requested  [2007/07]
29.12.2006Loss of particular rights, legal effect: designated state(s)
13.04.2007Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, FI, GB, GR, HU, IE, IS, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR
25.05.2007Communication of intention to grant the patent
19.09.2007Fee for grant paid
19.09.2007Fee for publishing/printing paid
Opposition(s)08.08.2008No opposition filed within time limit [2008/42]
Fees paidPenalty fee
Penalty fee Rule 85a EPC 1973
01.02.2007AT   M01   Not yet paid
01.02.2007BE   M01   Not yet paid
01.02.2007BG   M01   Not yet paid
01.02.2007CH   M01   Not yet paid
01.02.2007CY   M01   Not yet paid
01.02.2007CZ   M01   Not yet paid
01.02.2007DK   M01   Not yet paid
01.02.2007EE   M01   Not yet paid
01.02.2007FI   M01   Not yet paid
01.02.2007GB   M01   Not yet paid
01.02.2007GR   M01   Not yet paid
01.02.2007HU   M01   Not yet paid
01.02.2007IE   M01   Not yet paid
01.02.2007IS   M01   Not yet paid
01.02.2007LT   M01   Not yet paid
01.02.2007LU   M01   Not yet paid
01.02.2007LV   M01   Not yet paid
01.02.2007MC   M01   Not yet paid
01.02.2007NL   M01   Not yet paid
01.02.2007PL   M01   Not yet paid
01.02.2007PT   M01   Not yet paid
01.02.2007RO   M01   Not yet paid
01.02.2007SE   M01   Not yet paid
01.02.2007SI   M01   Not yet paid
01.02.2007SK   M01   Not yet paid
01.02.2007TR   M01   Not yet paid
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Documents cited:Search[A]DE2922477  (SIEMENS AG);
 [A]EP0955692  (WECO WESTER EBBINGHAUS GMBH & [DE]);
 [A]EP1309036  (OMRON TATEISI ELECTRONICS CO [JP]);
 [A]EP1383203  (TYCO ELECTRONICS CORP [US])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.