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Extract from the Register of European Patents

EP About this file: EP1577942

EP1577942 - Device with through-hole interconnection and method for manufacturing the same [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  25.10.2013
Database last updated on 11.05.2024
Most recent event   Tooltip25.10.2013Withdrawal of applicationpublished on 27.11.2013  [2013/48]
Applicant(s)For all designated states
FUJIKURA LTD.
5-1 Kiba 1-chome
Kohtoh-ku
Tokyo-to / JP
[N/P]
Former [2005/38]For all designated states
FUJIKURA LTD.
5-1 Kiba 1-chome Kohtoh-ku
Tokyo-to / JP
Inventor(s)01 / Yamamoto, Satoshi
c/o Fujikura Ltd. 5-1, Kiba 1-chome
Kohtoh-ku Tokyo / JP
02 / Suemasu, Tatsuo
c/o Fujikura Ltd. 5-1, Kiba 1-chome
Kohtoh-ku Tokyo / JP
 [2005/38]
Representative(s)Plasseraud IP
66, rue de la Chaussée d'Antin
75440 Paris Cedex 09 / FR
[N/P]
Former [2012/36]Cabinet Plasseraud
52, rue de la Victoire
75440 Paris Cedex 09 / FR
Former [2005/38]Burbaud, Eric
Cabinet Plasseraud 65/67 rue de la Victoire
75440 Paris Cedex 09 / FR
Application number, filing date05290559.314.03.2005
[2005/38]
Priority number, dateJP2004007432516.03.2004         Original published format: JP 2004074325
JP2004030191915.10.2004         Original published format: JP 2004301919
[2005/38]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1577942
Date:21.09.2005
Language:EN
[2005/38]
Type: A3 Search report 
No.:EP1577942
Date:14.09.2011
Language:EN
[2011/37]
Search report(s)(Supplementary) European search report - dispatched on:EP16.08.2011
ClassificationIPC:H01L21/768, H01L27/146, H01L31/02
[2005/38]
CPC:
H01L21/76898 (EP,US); H01L27/14634 (EP,US); H01L27/14636 (EP,US);
H05K3/4038 (EP,US); H01L2224/02372 (EP,US); H01L2224/02377 (EP);
H01L2224/05001 (EP,US); H01L2224/05008 (EP,US); H01L2224/05009 (EP,US);
H01L2224/05024 (EP,US); H01L2224/05111 (EP,US); H01L2224/05124 (EP,US);
H01L2224/05144 (EP,US); H01L2224/05147 (EP,US); H01L2224/05155 (EP,US);
H01L2224/05166 (EP,US); H01L2224/05171 (EP,US); H01L2224/05548 (EP,US);
H01L2224/05569 (EP,US); H01L2224/11 (EP,US); H01L2224/13009 (EP);
H01L2224/13024 (EP); H01L24/05 (EP); H01L24/13 (EP);
H01L2924/00014 (EP,US); H05K1/0306 (EP,US); H05K2201/0394 (EP,US);
H05K2201/09572 (EP,US); H05K3/388 (EP,US) (-)
C-Set:
H01L2224/05111, H01L2924/00014 (US,EP);
H01L2224/05124, H01L2924/00014 (US,EP);
H01L2224/05144, H01L2924/00014 (US,EP);
H01L2224/05147, H01L2924/00014 (EP,US);
H01L2224/05155, H01L2924/00014 (EP,US);
H01L2224/05166, H01L2924/00014 (EP,US);
H01L2224/05171, H01L2924/00014 (EP,US);
H01L2924/00014, H01L2224/05599 (US,EP)
(-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2005/38]
TitleGerman:Vorrichtung mit Durchkontaktierung und Verfahren zur Herstellung derselben[2005/38]
English:Device with through-hole interconnection and method for manufacturing the same[2005/38]
French:Dispositif avec interconnexion à trou traversant et procédé pour sa fabrication[2005/38]
Examination procedure14.03.2005Examination requested  [2005/38]
24.10.2013Application withdrawn by applicant  [2013/48]
Fees paidRenewal fee
06.03.2007Renewal fee patent year 03
30.01.2008Renewal fee patent year 04
06.02.2009Renewal fee patent year 05
21.01.2010Renewal fee patent year 06
13.01.2011Renewal fee patent year 07
30.01.2012Renewal fee patent year 08
23.01.2013Renewal fee patent year 09
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Documents cited:Search[X]US6352923  (HSUAN MIN-CHIH [TW], et al) [X] 1,4,5,10,11,15,18* column 2, line 61 - column 4, line 49; figures 2f-h,3 *;
 [X]EP1376678  (SANYO ELECTRIC CO [JP]) [X] 1-9,11,12,14,15,18 * paragraph [0046] - paragraph [0063] * * paragraph [0071] - paragraph [0074]; figures 10a-14a,15a,16,17b *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.