EP1744395 - Microwave power combiners/splitters on high-loss dielectric substrates [Right-click to bookmark this link] | Status | The application has been refused Status updated on 18.03.2011 Database last updated on 30.10.2024 | Most recent event Tooltip | 18.03.2011 | Refusal of application | published on 20.04.2011 [2011/16] | Applicant(s) | For all designated states Nokia Siemens Networks S.p.A. S.S. 11 Padana Superiore Km 158 20060 Cassina de'Pecchi (MI) / IT | [2008/44] |
Former [2007/03] | For all designated states Siemens S.p.A. Viale Piero e Alberto Pirelli 10 20126 Milano / IT | Inventor(s) | 01 /
Buoli, Carlo Via M.L. King 4 20060 Bussero / IT | 02 /
Fusaroli, Stefano Via XXV Aprile, 27 20040 Cavenago Brianza (MI) / IT | 03 /
Gadaleta, Vito Marco Via R. Schuman 15 70126 Bari / IT | 04 /
Morgia, Fabio Via Bessarione 32 20139 Milano / IT | 05 /
Turillo, Tommaso Via Anguissola N2 20063 Cernusco Sul Naviglio (MI) / IT | [2007/03] | Representative(s) | Weidel, Gottfried, et al Nokia Siemens Networks GmbH & Co. KG COO RTP IPR / Patent Administration 80240 München / DE | [2008/44] | Application number, filing date | 05425501.3 | 12.07.2005 | [2007/03] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1744395 | Date: | 17.01.2007 | Language: | EN | [2007/03] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.12.2005 | Classification | IPC: | H01P5/107, H01P5/16 | [2007/03] | CPC: |
H01P5/16 (EP);
H01P5/107 (EP)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR [2007/03] | Title | German: | Leistungsteiler/Leistungskombinierer auf einem Substrat mit hohem dielektrischen Verlust. | [2007/03] | English: | Microwave power combiners/splitters on high-loss dielectric substrates | [2007/03] | French: | Combinateur/diviseur de puissance sur un substrat diélectrique à pertes élevées. | [2007/03] | Examination procedure | 17.07.2007 | Examination requested [2007/35] | 17.08.2007 | Despatch of a communication from the examining division (Time limit: M04) | 21.09.2007 | Reply to a communication from the examining division | 07.05.2008 | Despatch of a communication from the examining division (Time limit: M04) | 09.09.2008 | Reply to a communication from the examining division | 14.04.2009 | Despatch of a communication from the examining division (Time limit: M04) | 24.07.2009 | Reply to a communication from the examining division | 22.11.2010 | Cancellation of oral proceeding that was planned for 02.12.2010 | 30.11.2010 | Despatch of communication that the application is refused, reason: substantive examination [2011/16] | 02.12.2010 | Date of oral proceedings (cancelled) | 10.12.2010 | Application refused, date of legal effect [2011/16] | Fees paid | Renewal fee | 31.07.2007 | Renewal fee patent year 03 | 15.07.2008 | Renewal fee patent year 04 | 20.07.2009 | Renewal fee patent year 05 | 27.07.2010 | Renewal fee patent year 06 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [DY]WO03092115 (XYTRANS INC [US]) [DY] 1-7 * page 10, line 27 - page 14, line 7; figures 7-10 *; | [DY]EP1367668 (SIEMENS INF & COMM NETWORKS [IT]) [DY] 1-7 * paragraph [0020]; figure 5c *; | [A] - BUOLI C ET AL, THICK META PLATE INSERTION MAKE FR4 MULTILAYER BOARD A SIMPLE CARRIER FOR RF POWER CIRCUITS, 31ST EUROPEAN MICROWAVE CONFERENCE PROCEEDINGS. LONDON, SEPT. 25 - 27, 2001, PROCEEDINGS OF THE EUROPEAN MICROWAVE CONFERENCE, LONDON : CMP, GB, PAGE(S) 157-160, (20010925), ISBN 0-86213-148-0, XP001044769 [A] 1-7 * the whole document * | [A] - BASHIRULLAH R ET AL, A SLOTTED-WAVEGUIDE POWER AMPLIFIER FOR SPATIAL POWER-COMBINING APPLICATIONS, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, PAGE(S) 1142-1147, (200007), ISSN 0018-9480, XP000975122 [A] 1-7 * page 1142; figure 2 * DOI: http://dx.doi.org/10.1109/22.848497 | [A] - WU Y-S ET AL, Waveguide-to-microstrip power splitter, PAGE(S) 475-478, (19900508), XP010004427 [A] 1-7 * page 475, column L; figures 1,2,6 * |