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Extract from the Register of European Patents

EP About this file: EP1834011

EP1834011 - ETCHANT SOLUTIONS AND ADDITIVES THEREFOR [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  22.10.2010
Database last updated on 14.09.2024
Most recent event   Tooltip22.10.2010Application deemed to be withdrawnpublished on 24.11.2010  [2010/47]
Applicant(s)For all designated states
Koninklijke Philips Electronics N.V.
Groenewoudseweg 1
5621 BA Eindhoven / NL
[N/P]
Former [2007/38]For all designated states
Koninklijke Philips Electronics N.V.
Groenewoudseweg 1
5621 BA Eindhoven / NL
Inventor(s)01 / BURDINSKI, Dirk
c/o Prof. Holstlaan 6
NL-5656 AA Eindhoven / NL
02 / BRANS, Harold
c/o Prof. Holstlaan 6
NL-5656 AA Eindhoven / NL
 [2007/38]
Representative(s)Schouten, Marcus Maria
NXP B.V.
Intellectual Property & Licensing
High Tech Campus 60
5656 AG Eindhoven / NL
[N/P]
Former [2007/38]Schouten, Marcus Maria
Philips Intellectual Property & Standards P.O. Box 220
5600 AE Eindhoven / NL
Application number, filing date05821559.130.11.2005
[2007/38]
WO2005IB53989
Priority number, dateEP2004010630306.12.2004         Original published format: EP 04106303
EP2005010215518.03.2005         Original published format: EP 05102155
[2007/38]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO2006061741
Date:15.06.2006
Language:EN
[2006/24]
Type: A2 Application without search report 
No.:EP1834011
Date:19.09.2007
Language:EN
The application published by WIPO in one of the EPO official languages on 15.06.2006 takes the place of the publication of the European patent application.
[2007/38]
Search report(s)International search report - published on:EP17.01.2008
ClassificationIPC:C23F/
[2007/38]
CPC:
C23F1/30 (EP,US); C09K13/06 (KR); B82Y10/00 (EP,US);
B82Y30/00 (EP,US); B82Y40/00 (EP,US); C09K13/04 (KR);
C23F1/02 (EP,US); C23F1/26 (EP,US); G03F7/0002 (EP,US) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2007/38]
Extension statesALNot yet paid
BANot yet paid
HRNot yet paid
MKNot yet paid
YUNot yet paid
TitleGerman:BEIZLÖSUNGEN UND ZUSATZSTOFFE DAFÜR[2007/38]
English:ETCHANT SOLUTIONS AND ADDITIVES THEREFOR[2007/38]
French:SOLUTIONS D'AGENT DE GRAVURE ET ADDITIFS CORRESPONDANTS[2007/38]
Entry into regional phase06.07.2007National basic fee paid 
17.07.2008Designation fee(s) paid 
17.07.2008Examination fee paid 
Examination procedure17.07.2008Examination requested  [2008/35]
19.02.2009Despatch of a communication from the examining division (Time limit: M04)
19.05.2009Reply to a communication from the examining division
01.06.2010Application deemed to be withdrawn, date of legal effect  [2010/47]
06.07.2010Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2010/47]
Fees paidRenewal fee
30.11.2007Renewal fee patent year 03
28.03.2008Renewal fee patent year 04
Penalty fee
Additional fee for renewal fee
30.11.200905   M06   Not yet paid
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Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[XY]US3598741  (KANNO SHOZO) [X] 7,8 * column 1, lines 21-29 * * column 2, line 58 - column 3, line 2 * * column 3, lines 31-36 * * column 8, lines 17-23; example 6 * [Y] 10-15;
 [X]US4215005  (MEY JOHN E VANDER [US]) [X] 7 * column 1, lines 13-17 * * column 2, line 61 - column 3, line 8 * * column 10; example IV * * column 10, line 44; table IV *;
 [Y]US2004200575  (BIETSCH ALEXANDER [CH], et al) [Y] 10-15 * page 1, paragraphs 2,10-16 * * page 6, paragraph 75 - page 7, paragraph 76; figures 4A,4B *;
 [PA]WO2005045524  (KONINKL PHILIPS ELECTRONICS NV [NL], et al) [PA] 1-15 * page 17 - page 18; example 4 *;
 [A]US3677848  (STOLLER ARTHUR IRWIN, et al) [A] 1-15 * column 2, lines 31-46 * * claims 1,5 *;
 [A]DE10043148  (VOLKSWAGEN AG [DE]) [A] 1-15 * page 2, paragraph 6 - page 3, paragraph 10 * * page 3, paragraphs 14-16 *;
 [A]US3836410  (DU BOIS D) [A] 1-15 * column 3, lines 21-53 *
by applicantUS5512131
 WO03099463
 US3639185
 US3773670
 US4212907
 US4780176
 US4747907
 US4995942
 US5518131
 US6221269
 US4629539
 US4642168
 US5639344
 US5885888
 US4497687
 US4846918
 US4927700
 US5266152
 US5376214
 US5324496
 US4230522
 US5626775
 EP0774778
 US4345969
 US4220706
 US2004200575
 US4632727
 US3935118
 US4032379
 US2003010241
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The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.