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EP1732215
European procedure
Extract from the Register of European Patents
EP About this file: EP1732215
| EP1732215 - Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 01.02.2013 Database last updated on 28.06.2024 | Most recent event Tooltip | 01.02.2013 | No opposition filed within time limit | published on 06.03.2013 [2013/10] | Applicant(s) | For all designated states Seiko Epson Corporation 4-1, Nishishinjuku 2-chome, Shinjuku-ku Tokyo 163-0811 / JP | [2012/13] |
| Former [2006/50] | For all designated states SEIKO EPSON CORPORATION 4-1, Nishishinjuku 2-chome, Shinjuku-ku Tokyo 160-0811 / JP | Inventor(s) | 01 /
Ito, Haruki c/o Seiko Epson Corporation 3-5, Owa 3-chome Suwa-shi, Nagano-ken / JP | 02 /
Hashimoto, Nobuaki c/o Seiko Epson Corporation 3-5, Owa 3-chome Suwa-shi, Nagano-ken / JP | [2012/13] |
| Former [2006/50] | 01 /
Ito, Haruki c/o Seiko Epson Corporation, 3-5, Owa 3-chome Suwa-shi, Nagano-ken / JP | ||
| 02 /
Hashimoto, Nobuaki c/o Seiko Epson Corporation, 3-5, Owa 3-chome Suwa-shi, Nagano-ken / JP | Representative(s) | Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastrasse 30 81925 München / DE | [N/P] |
| Former [2012/13] | HOFFMANN EITLE Patent- und Rechtsanwälte Arabellastrasse 4 81925 München / DE | ||
| Former [2006/50] | HOFFMANN EITLE Patent- und Rechtsanwälte Arabellastrasse 4 81925 München / DE | Application number, filing date | 06011084.8 | 30.05.2006 | [2006/50] | Priority number, date | JP20050168373 | 08.06.2005 Original published format: JP 2005168373 | [2006/50] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1732215 | Date: | 13.12.2006 | Language: | EN | [2006/50] | Type: | A3 Search report | No.: | EP1732215 | Date: | 14.02.2007 | [2007/07] | Type: | B1 Patent specification | No.: | EP1732215 | Date: | 28.03.2012 | Language: | EN | [2012/13] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 16.01.2007 | Classification | IPC: | H03H9/05, H03H9/10, H03H3/08, H01L23/48, H01L23/482 | [2011/44] | CPC: |
H01L23/481 (EP,US);
H01L23/02 (KR);
H01L23/4824 (EP,US);
H01L23/50 (US);
H01L23/522 (US);
H01L24/05 (EP);
H03H9/0547 (EP,US);
H03H9/0552 (EP,US);
H03H9/1071 (EP,US);
H01L2224/02379 (EP);
H01L2224/05001 (EP,US);
H01L2224/05009 (EP,US);
H01L2224/05022 (EP,US);
H01L2224/05025 (EP,US);
H01L2224/05027 (EP,US);
H01L2224/05124 (EP,US);
H01L2224/05144 (EP,US);
H01L2224/05147 (EP,US);
H01L2224/05155 (EP,US);
H01L2224/05164 (EP,US);
H01L2224/05166 (EP,US);
H01L2224/05171 (EP,US);
H01L2224/05184 (EP,US);
H01L2224/05186 (EP,US);
H01L2224/05548 (EP,US);
H01L2224/05624 (EP,US);
H01L2224/05644 (EP,US);
H01L2224/05647 (EP,US);
H01L2224/05655 (EP,US);
H01L2224/05664 (EP,US);
H01L2224/05666 (EP,US);
H01L2224/05671 (EP,US);
H01L2224/05684 (EP,US);
H01L2224/05686 (EP,US);
H01L2224/06131 (EP);
H01L2224/16 (EP,US);
H01L24/12 (US);
H01L24/13 (EP);
H01L2924/01019 (EP,US);
H01L2924/01046 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
| C-Set: |
H01L2224/05124, H01L2924/013 (EP,US);
H01L2224/05124, H01L2924/013, H01L2924/00014 (US,EP);
H01L2224/05144, H01L2924/00014 (EP,US);
H01L2224/05147, H01L2924/013 (EP,US);
H01L2224/05147, H01L2924/013, H01L2924/00014 (EP,US);
H01L2224/05155, H01L2924/00014 (US,EP);
H01L2224/05155, H01L2924/01023 (US,EP);
H01L2224/05164, H01L2924/00014 (EP,US);
H01L2224/05166, H01L2924/01074 (US,EP);
H01L2224/05166, H01L2924/013 (EP,US);
H01L2224/05166, H01L2924/013, H01L2924/00014 (US,EP);
H01L2224/05171, H01L2924/00014 (US,EP);
H01L2224/05184, H01L2924/00014 (US,EP);
H01L2224/05186, H01L2924/04941 (US,EP);
H01L2224/05624, H01L2924/00014 (US,EP);
H01L2224/05644, H01L2924/00014 (US,EP);
H01L2224/05647, H01L2924/00014 (US,EP);
H01L2224/05655, H01L2924/00014 (US,EP);
H01L2224/05655, H01L2924/01023 (US,EP);
H01L2224/05664, H01L2924/00014 (US,EP);
H01L2224/05666, H01L2924/00014 (US,EP);
H01L2224/05666, H01L2924/01074 (US,EP);
H01L2224/05671, H01L2924/00014 (US,EP);
H01L2224/05684, H01L2924/00014 (US,EP); |
| Former IPC [2006/50] | H03H3/08, H03H9/10 | Designated contracting states | DE, FR, GB [2007/42] |
| Former [2006/50] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Halbleiterbauelement, Herstellungsverfahren für ein Halbleiterbauelement, elektronisches Bauelement, Schaltungssubstrat, und elektronische Vorrichtung | [2006/50] | English: | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus | [2006/50] | French: | Composant semiconducteur, méthode de fabrication d'un composant semiconducteur, composant électronique, substrat pour circuits, appareil électronique | [2006/50] | Examination procedure | 16.04.2007 | Examination requested [2007/22] | 21.05.2007 | Despatch of a communication from the examining division (Time limit: M04) | 01.10.2007 | Reply to a communication from the examining division | 28.10.2011 | Communication of intention to grant the patent | 09.02.2012 | Fee for grant paid | 09.02.2012 | Fee for publishing/printing paid | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 21.05.2007 | Opposition(s) | 03.01.2013 | No opposition filed within time limit [2013/10] | Fees paid | Renewal fee | 26.03.2008 | Renewal fee patent year 03 | 26.05.2009 | Renewal fee patent year 04 | 24.03.2010 | Renewal fee patent year 05 | 24.05.2011 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP1143614 (TOSHIBA KK [JP]) [A] 1-15 * figures 1-15 ** paragraphs [0019] - [0021] *; | [PX]EP1635457 (SEIKO EPSON CORP [JP]) [PX] 1-15 * abstract *; | [PX]CN1750394 (SEIKO EPSON CORP [JP]) [PX] 1-15 * figure 1 * |