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Extract from the Register of European Patents

EP About this file: EP1821589

EP1821589 - Electronic component mounting apparatus [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  13.04.2012
Database last updated on 02.09.2024
Most recent event   Tooltip13.04.2012No opposition filed within time limitpublished on 16.05.2012  [2012/20]
Applicant(s)For all designated states
Hitachi High-Tech Instruments Co., Ltd.
1-1-1, Sakata, Oizumi-machi Ora-gun
Gunma-ken, 370-0596 / JP
[2007/34]
Inventor(s)01 / Watanabe, Akio
860-2 Takara-cho, Ota-shi
Gunma 373-0042 / JP
02 / Kawai, Akihiro
1940-12 Sanwa-cho, Isesaki-shi
Gunma 372-0011 / JP
03 / Ono, Tetsuji
3-25-1-9-213 Sengoku, Oizumi-machi, Ora-gun
Gunma 370-0533 / JP
04 / Kameda, Makio
3061-1-Part1-1F Uenodai, Fukaya-shi
Saitama 366-0801 / JP
05 / Oyama, Kazuyoshi
446-2 Kamishibutare-cho, Ashikaga-shi
Tochigi 326-0335 / JP
 [2007/34]
Representative(s)Glawe, Delfs, Moll
Partnerschaft mbB von
Patent- und Rechtsanwälten
Rothenbaumchaussee 58
20148 Hamburg / DE
[N/P]
Former [2009/26]Glawe, Delfs, Moll
Patent- und Rechtsanwälte Rothenbaumchaussee 58
20148 Hamburg / DE
Former [2007/34]Glawe, Delfs, Moll
Patent- und Rechtsanwälte, Rothenbaumchaussee 58
20148 Hamburg / DE
Application number, filing date06013575.330.06.2006
[2007/34]
Priority number, dateJP2005019211630.06.2005         Original published format: JP 2005192116
[2007/34]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1821589
Date:22.08.2007
Language:EN
[2007/34]
Type: B1 Patent specification 
No.:EP1821589
Date:08.06.2011
Language:EN
[2011/23]
Search report(s)(Supplementary) European search report - dispatched on:EP16.05.2007
ClassificationIPC:H05K13/02, H05K13/04, H05K13/08
[2007/34]
CPC:
H05K13/0215 (EP,US); H05K13/02 (KR); H05K13/0419 (EP,US);
H05K13/081 (EP,US); Y10T29/4913 (EP,US); Y10T29/49131 (EP,US);
Y10T29/49133 (EP,US); Y10T29/49146 (EP,US); Y10T29/53174 (EP,US);
Y10T29/53178 (EP,US) (-)
Designated contracting statesDE,   NL [2008/18]
Former [2007/34]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Elektronische Bauteile-Bestückungsvorrichtung[2007/34]
English:Electronic component mounting apparatus[2007/34]
French:Appareil pour monter des composants électroniques[2007/34]
Examination procedure31.01.2008Examination requested  [2008/11]
23.02.2008Loss of particular rights, legal effect: designated state(s)
10.03.2008Despatch of a communication from the examining division (Time limit: M04)
07.04.2008Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, PL, PT, RO, SE, SI, SK, TR
07.07.2008Reply to a communication from the examining division
29.12.2010Communication of intention to grant the patent
27.04.2011Fee for grant paid
27.04.2011Fee for publishing/printing paid
Divisional application(s)EP10012562.4  / EP2273863
EP10012564.0  / EP2273864
The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  10.03.2008
Opposition(s)09.03.2012No opposition filed within time limit [2012/20]
Fees paidRenewal fee
25.03.2008Renewal fee patent year 03
24.06.2009Renewal fee patent year 04
31.03.2010Renewal fee patent year 05
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Documents cited:Search[A]EP1494522  (HITACHI HIGH TECH INSTR CO LTD [JP]) [A] 1,4,7 * paragraph [0001] * * paragraph [0010] - paragraph [0053] * * figures 1-13 *;
 [PA]US2005210664  (KITAJIMA TAKAHIRO [JP], et al) [PA] 1,4,7 * paragraph [0002] * * paragraph [0022] - paragraph [0056] ** figures 1-14 *
ExaminationEP0967851
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