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Extract from the Register of European Patents

EP About this file: EP1722403

EP1722403 - Fabrication method for a thin film semiconductor device [Right-click to bookmark this link]
Former [2006/46]Fabrication method for a thin film smiconductor device
[2012/10]
StatusNo opposition filed within time limit
Status updated on  31.05.2013
Database last updated on 18.10.2024
Most recent event   Tooltip31.05.2013No opposition filed within time limitpublished on 03.07.2013  [2013/27]
Applicant(s)For all designated states
Seiko Epson Corporation
4-1, Nishishinjuku 2-chome Shinjuku-ku
Tokyo 163-0811 / JP
[2012/30]
Former [2006/46]For all designated states
SEIKO EPSON CORPORATION
4-1, Nishishinjuku 2-Chome Shinjuku-ku
Tokyo 163-0811 / JP
Inventor(s)01 / Miyasaka, Mitsutoshi
c/o SEIKO EPSON CORPORATION
3-5, Owa 3-chome
Suwa-shi, Nagano-ken 392-8502 / JP
 [2012/30]
Former [2006/46]01 / Miyasaka, Mitsutoshi
c/o SEIKO EPSON CORPORATION 3-5, Owa 3-chome
Suwa-shi, Nagano-ken 392-8502 / JP
Representative(s)MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB
Paul-Heyse-Strasse 29
80336 München / DE
[N/P]
Former [2012/30]MERH-IP Matias Erny Reichl Hoffmann
Paul-Heyse-Strasse 29
80336 München / DE
Former [2010/10]MERH-IP Matias Erny Reichl Hoffmann
Paul-Heyse-Strasse 29
80336 München / DE
Former [2006/46]Hoffmann, Eckart
Patentanwalt, Bahnhofstrasse 103
82166 Gräfelfing / DE
Application number, filing date06018098.115.06.1995
[2006/46]
Priority number, dateJP1994013337415.06.1994         Original published format: JP 13337494
JP1995007214429.03.1995         Original published format: JP 7214495
[2006/46]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1722403
Date:15.11.2006
Language:EN
[2006/46]
Type: A3 Search report 
No.:EP1722403
Date:30.05.2007
[2007/22]
Type: B1 Patent specification 
No.:EP1722403
Date:25.07.2012
Language:EN
[2012/30]
Search report(s)(Supplementary) European search report - dispatched on:EP03.05.2007
ClassificationIPC:H01L21/336, H01L29/49, H01L21/205, H01L29/786
[2012/08]
CPC:
H01L29/66757 (EP,US); H01L29/768 (KR); F16C29/00 (EP,US);
H01L21/0237 (EP,US); H01L21/02521 (EP,US); H01L21/02532 (EP,US);
H01L21/02576 (EP,US); H01L21/02579 (EP,US); H01L21/0262 (EP,US);
H01L21/02661 (EP,US); H01L21/28079 (EP,US); H01L21/3105 (EP,US);
H01L29/4908 (EP,US); H01L29/78675 (EP,US); F16C2360/45 (EP,US);
G02F1/13454 (EP,US); G02F2202/104 (EP,US) (-)
Former IPC [2006/46]H01L21/205, // H01L21/336, H01L29/49
Designated contracting statesDE,   FR,   GB [2006/46]
TitleGerman:Herstellungsmethode für eine Dünnfilmhalbleiteranordnung[2006/46]
English:Fabrication method for a thin film semiconductor device[2012/10]
French:Méthode de fabrication d'un dispositif semiconducteur à couche mince[2006/46]
Former [2006/46]Fabrication method for a thin film smiconductor device
Examination procedure07.11.2007Examination requested  [2007/51]
21.12.2007Despatch of a communication from the examining division (Time limit: M04)
18.04.2008Reply to a communication from the examining division
21.04.2011Despatch of a communication from the examining division (Time limit: M04)
19.05.2011Reply to a communication from the examining division
22.02.2012Communication of intention to grant the patent
06.06.2012Fee for grant paid
06.06.2012Fee for publishing/printing paid
Parent application(s)   TooltipEP03008849.6  / EP1335419
EP95921972.6  / EP0714140
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP19950921972) is  20.03.2000
Opposition(s)26.04.2013No opposition filed within time limit [2013/27]
Fees paidRenewal fee
30.08.2006Renewal fee patent year 03
30.08.2006Renewal fee patent year 04
30.08.2006Renewal fee patent year 05
30.08.2006Renewal fee patent year 06
30.08.2006Renewal fee patent year 07
30.08.2006Renewal fee patent year 08
30.08.2006Renewal fee patent year 09
30.08.2006Renewal fee patent year 10
30.08.2006Renewal fee patent year 11
30.08.2006Renewal fee patent year 12
27.06.2007Renewal fee patent year 13
31.03.2008Renewal fee patent year 14
26.06.2009Renewal fee patent year 15
31.03.2010Renewal fee patent year 16
30.06.2011Renewal fee patent year 17
31.03.2012Renewal fee patent year 18
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Documents cited:Search[DA]EP0526779  (IBM [US]) [DA] 1 * the whole document *;
 [DA]EP0592227  (SHARP KK [JP]) [DA] 1 * the whole document *;
 [A]  - HORNG NAN CHERN ET AL, "The effects of H2-O2-plasma treatment on the characteristics of polysilicon thin-film transistors", IEEE TRANSACTIONS ON ELECTRON DEVICES USA, (199312), vol. 40, no. 12, ISSN 0018-9383, pages 2301 - 2306, XP002429955 [A] 1 * the whole document *

DOI:   http://dx.doi.org/10.1109/16.249479
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