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EP1745864
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EP About this file: EP1745864
| EP1745864 - Method of removing residues formed during the manufacture of MEMS systems [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 03.07.2015 Database last updated on 24.07.2024 | Most recent event Tooltip | 03.07.2015 | Application deemed to be withdrawn | published on 05.08.2015 [2015/32] | Applicant(s) | For all designated states Teledyne Dalsa Semiconductor Inc. 605 McMurray Road Waterloo, ON N2V 2E9 / CA | [2012/11] |
| Former [2007/04] | For all designated states Dalsa Semiconductor Inc. 605 McMurray Road Waterloo, Ontario N2V 2E9 / CA | Inventor(s) | 01 /
FORTIN, Vincent 585 rue du Chapelier Bromont Québec J2L 1A7 / CA | 02 /
OUELLET, Jean 115 Lussier St-Alphonse de Granby Québec J0E 2A0 / CA | [2007/04] | Representative(s) | Talbot-Ponsonby, Daniel Frederick Marks & Clerk LLP 2nd Floor, Wytham Court 11 West Way Oxford OX2 0JB / GB | [N/P] |
| Former [2012/35] | Talbot-Ponsonby, Daniel Frederick Marks & Clerk LLP 4220 Nash Court Oxford Business Park South Oxford Oxfordshire OX4 2RU / GB | ||
| Former [2007/04] | Harding, Richard Patrick Marks & Clerk, 4220 Nash Court, Oxford Business Park South Oxford OX4 2RU / GB | Application number, filing date | 06117395.1 | 18.07.2006 | [2007/04] | Priority number, date | US20050699852P | 18.07.2005 Original published format: US 699852 P | [2007/04] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1745864 | Date: | 24.01.2007 | Language: | EN | [2007/04] | Type: | A3 Search report | No.: | EP1745864 | Date: | 25.04.2007 | [2007/17] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 22.03.2007 | Classification | IPC: | B08B3/08, B08B7/00, H01L21/306 | [2007/04] | CPC: |
B81C1/00928 (EP,US);
B08B3/08 (EP,US);
B08B7/00 (EP,US);
B81C1/00849 (EP,US);
H01L21/02068 (EP,US)
| Designated contracting states | DE, FR, GB [2008/01] |
| Former [2007/04] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Verfahren zum Entfernen von während der Herstellung von MEMS Systemen entstehenden Rückständen | [2007/04] | English: | Method of removing residues formed during the manufacture of MEMS systems | [2007/04] | French: | Procédé d'élimination de résidus formés lors de la fabrication de systèmes MEMS | [2007/04] | Examination procedure | 21.02.2007 | Examination requested [2007/15] | 28.06.2007 | Despatch of a communication from the examining division (Time limit: M04) | 26.10.2007 | Loss of particular rights, legal effect: designated state(s) | 30.10.2007 | Reply to a communication from the examining division | 14.12.2007 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | 22.01.2010 | Despatch of a communication from the examining division (Time limit: M04) | 26.05.2010 | Reply to a communication from the examining division | 27.08.2014 | Despatch of a communication from the examining division (Time limit: M06) | 07.03.2015 | Application deemed to be withdrawn, date of legal effect [2015/32] | 02.04.2015 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2015/32] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 28.06.2007 | Fees paid | Renewal fee | 31.07.2008 | Renewal fee patent year 03 | 10.07.2009 | Renewal fee patent year 04 | 14.07.2010 | Renewal fee patent year 05 | 12.07.2011 | Renewal fee patent year 06 | 25.07.2012 | Renewal fee patent year 07 | 29.07.2013 | Renewal fee patent year 08 | 28.07.2014 | Renewal fee patent year 09 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [DXY]US5200361 (ONISHI SHIGEO [JP]) [DX] 1,9,10,13,14,17,18 * abstract * * column 1, lines 14-62 * * column 2, line 31 - column 3, line 27 * * column 6, lines 26-39 * [Y] 12,15; | [DX]EP0746016 (SIEMENS AG [DE]) [DX] 1,9,16-18 * abstract * * page 2, lines 5-47 * * page 3, lines 7-36 * * page 4, line 48 - page 5, line 9 *; | [X]US5658417 (WATANABE HIROHITO [JP], et al) [X] 1,9,17,18 * column 1, lines 14-39 * * column 3, lines 51-60 * * abstract *; | [X]WO0007220 (CFMT INC [US]) [X] 1,2,9,17,18 * abstract * * page 4, lines 12-14 * * page 5, line 31 - page 6, line 4 * * page 7, lines 5-16 * * page 14, lines 1-12 * * page 15, lines 8-11 * * page 16, lines 4-21 * * page 17, lines 23-32 * * page 20, lines 1-5 * * page 22, lines 1-16 * * page 25, lines 4-16 * * claim 18 *; | [YA]US6074951 (KLEINHENZ RICHARD L [US], et al) [Y] 12 * abstract * * column 1, lines 30-35 * * column 4, line 61 - column 5, line 9 * [A] 1,2,17,18; | [X]US6740247 (HAN YONG-PIL [KR], et al) [X] 1,9,17,18 * abstract * * column 1, line 64 - column 2, line 13 * * column 2, lines 61-63 * * column 3, lines 26-53 * * column 4, lines 9-27 * * column 4, lines 60-64 * * column 24, lines 34-37 ** column 24, lines 58-62 *; | [X]US2004123879 (YIM EUN-TAEK [KR], et al) [X] 1-18 * abstract * * paragraph [0005] * * paragraphs [0013] , [0014] * * paragraph [0018] * * paragraphs [0069] - [0071] * * claims 1-4 * * figure 6 *; | [XAY]US6869487 (BERGMAN ERIC J [US]) [X] 1,8,9,17,18 * abstract * * column 1, lines 17-27 * * column 1, lines 44-56 * * column 2, line 51 - column 3, line 17 * * column 4, lines 19-55 * * column 12, lines 5-16 * [A] 3-6 [Y] 15 | Examination | JPH05235292 | WO9428426 | US2003080082 | US2004206120 | by applicant | US5089084 | US5200361 | US5662772 | US5922623 | US6240933 | US2001017143 | US2001027799 | US2001029965 | US2004018683 | US2004069320 | US6830628 | US6843857 | US2005142685 | - PROC. SPIE MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY VI, (200009), vol. 4174, pages 130 - 141 | - K.R. WILLIAMS; K. GUPTA; M. WASILIK, "Etch rates for micromachining processing - Part II", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, (200312), vol. 12, no. 6, pages 761 - 778 |