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Extract from the Register of European Patents

EP About this file: EP1909329

EP1909329 - SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  07.09.2012
Database last updated on 03.10.2024
Most recent event   Tooltip07.09.2012No opposition filed within time limitpublished on 10.10.2012  [2012/41]
Applicant(s)For all designated states
SANKEN ELECTRIC CO., LTD.
6-3, 3-chome, Kitano Niiza-shi
Saitama 352-8666 / JP
[2008/15]
Inventor(s)01 / TORII, Katsuyuki, c/o Sanken Electric Co., Ltd.
6-3, Kitano 3-chome
Niiza-shi, Saitama 352-8666 / JP
 [2011/44]
Former [2008/15]01 / TORII, Katsuyuki, c/o Sanken Electric Co., Ltd.
6-3, Kitano 3-chome
Niiza-shi, Saitama 352-8666 / JP
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstrasse 4
80802 München / DE
[N/P]
Former [2011/44]Grünecker, Kinkeldey, Stockmair & Schwanhäusser
Leopoldstrasse 4
80802 München / DE
Former [2008/15]Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
Maximilianstrasse 58
80538 München / DE
Application number, filing date06729670.722.03.2006
[2008/15]
WO2006JP305703
Priority number, dateJP2005020768515.07.2005         Original published format: JP 2005207685
[2008/15]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2007010646
Date:25.01.2007
Language:JA
[2007/04]
Type: A1 Application with search report 
No.:EP1909329
Date:09.04.2008
Language:EN
[2008/15]
Type: B1 Patent specification 
No.:EP1909329
Date:02.11.2011
Language:EN
[2011/44]
Search report(s)International search report - published on:JP25.01.2007
(Supplementary) European search report - dispatched on:EP19.08.2008
ClassificationIPC:H01L29/739, H01L27/04, H01L25/04, H01L27/00, H01L27/088, H01L29/78
[2008/15]
CPC:
H01L23/49575 (EP,US); H01L29/739 (KR); H01L24/49 (EP,US);
H01L25/04 (KR); H01L25/071 (EP,US); H01L27/00 (KR);
H01L27/04 (KR); H01L29/7395 (EP,US); H01L2224/05554 (EP,US);
H01L2224/0603 (EP,US); H01L2224/32145 (EP,US); H01L2224/32225 (EP,US);
H01L2224/45124 (EP,US); H01L2224/48091 (EP,US); H01L2224/48137 (EP,US);
H01L2224/48227 (EP,US); H01L2224/48247 (EP,US); H01L2224/49171 (EP,US);
H01L2224/73265 (EP,US); H01L24/45 (EP,US); H01L24/48 (EP,US);
H01L24/73 (EP,US); H01L27/0688 (EP,US); H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01014 (EP,US);
H01L2924/01015 (EP,US); H01L2924/01027 (EP,US); H01L2924/01028 (EP,US);
H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01047 (EP,US);
H01L2924/01082 (EP,US); H01L2924/014 (EP,US); H01L2924/1305 (EP,US);
H01L2924/13055 (EP,US); H01L2924/1306 (EP,US); H01L2924/13091 (EP,US);
H01L2924/181 (EP,US); H01L2924/30107 (EP,US) (-)
C-Set:
H01L2224/45124, H01L2924/00014 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/48247, H01L2924/13091 (US,EP);
H01L2224/49171, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/49171, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32145, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32145, H01L2224/48227, H01L2924/00012 (EP,US);
H01L2224/73265, H01L2224/32145, H01L2224/48247 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (EP,US);
H01L2224/73265, H01L2224/32225, H01L2224/48247, H01L2924/00 (US,EP);
H01L2924/1305, H01L2924/00 (US,EP);
H01L2924/1306, H01L2924/00 (EP,US);
H01L2924/181, H01L2924/00 (US,EP)
(-)
Designated contracting statesDE,   FR [2008/33]
Former [2008/15]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:HALBLEITERBAUELEMENT[2008/15]
English:SEMICONDUCTOR DEVICE[2008/15]
French:DISPOSITIF SEMI-CONDUCTEUR[2008/15]
Entry into regional phase06.02.2008Translation filed 
06.02.2008National basic fee paid 
06.02.2008Search fee paid 
06.02.2008Designation fee(s) paid 
06.02.2008Examination fee paid 
Examination procedure06.02.2008Examination requested  [2008/15]
16.02.2008Loss of particular rights, legal effect: designated state(s)
27.03.2008Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR
18.11.2008Amendment by applicant (claims and/or description)
30.09.2009Despatch of a communication from the examining division (Time limit: M04)
18.01.2010Reply to a communication from the examining division
18.03.2011Communication of intention to grant the patent
20.07.2011Fee for grant paid
20.07.2011Fee for publishing/printing paid
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  30.09.2009
Opposition(s)03.08.2012No opposition filed within time limit [2012/41]
Fees paidRenewal fee
06.02.2008Renewal fee patent year 03
26.02.2009Renewal fee patent year 04
26.02.2010Renewal fee patent year 05
28.01.2011Renewal fee patent year 06
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Documents cited:Search[A]US6081039  (FURNIVAL COURTNEY [US]) [A] 1-5 * abstract *;
 [Y]EP1022785  (ST MICROELECTRONICS SRL [IT]) [Y] 1-5 * abstract *;
 [A]EP1231635  (ST MICROELECTRONICS SRL [IT]) [A] 1-5 * abstract *;
 [A]US6642576  (SHIRASAWA TAKAAKI [JP], et al) [A] 1-5 * abstract *;
 [A]EP1411551  (NISSAN MOTOR [JP]) [A] 1-5* abstract *;
 [Y]WO2005018001  (SANKEN ELECTRIC CO LTD [JP], et al) [Y] 1-5 * abstract *;
 [E]EP1657750  (SANKEN ELECTRIC CO LTD [JP]) [E] 1-5 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.