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Extract from the Register of European Patents

EP About this file: EP1861868

EP1861868 - METHOD AND APPARATUS FOR MONITORING PLASMA CONDITIONS IN AN ETCHING PLASMA PROCESSING FACILITY [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  20.05.2011
Database last updated on 24.04.2024
Most recent event   Tooltip20.05.2011Withdrawal of applicationpublished on 22.06.2011  [2011/25]
Applicant(s)For all designated states
ADVANCED TECHNOLOGY MATERIALS, INC.
7 Commerce Drive
Danbury, CT 06810-4169 / US
[2007/49]
Inventor(s)01 / CHEN, Ing-Shin
6 Sleepy Hollow Drive
Danbury, CT 06810 / US
02 / NEUNER, Jeffrey, W.
141 Old Hawleyville Road
Bethel, CT 06801 / US
03 / DIMEO, Frank, Jr.
1809 Gilson Street
Falls Church, VA 22043-1129 / US
04 / CHEN, Philip, S.H.
26 Budd Drive
Bethel, CT 06801 / US
05 / WELCH, James
45 Sandy Lane
Wolcott, CT 06716 / US
06 / ROEDER, Jeffrey, F.
4 Longmeadow Hill Road
Brookfield, CT 06804 / US
 [2007/49]
Representative(s)ABG Intellectual Property Law, S.L.
Avenida de Burgos, 16D
Edificio Euromor
28036 Madrid / ES
[N/P]
Former [2008/36]ABG Patentes, S.L.
Avenida de Burgos 16D Edificio Euromor
28036 Madrid / ES
Former [2007/49]ABG Patentes, S.L.
Avenida de Burgos, 16D 4th floor Edificio Euromor
28036 Madrid / ES
Application number, filing date06738395.015.03.2006
[2007/49]
WO2006US09330
Priority number, dateUS2005008143916.03.2005         Original published format: US 81439
[2007/49]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO2006101897
Date:28.09.2006
Language:EN
[2006/39]
Type: A2 Application without search report 
No.:EP1861868
Date:05.12.2007
Language:EN
The application published by WIPO in one of the EPO official languages on 28.09.2006 takes the place of the publication of the European patent application.
[2007/49]
Search report(s)International search report - published on:US06.11.2008
(Supplementary) European search report - dispatched on:EP22.10.2010
ClassificationIPC:H01L21/302
[2010/04]
CPC:
B81C1/00587 (EP,US); H01L22/00 (KR); B81C99/0065 (EP,US);
C23C16/4405 (EP,US); H01J37/32935 (EP,US); H01L21/3065 (KR);
B81C2201/0138 (EP,US); G01N27/16 (EP,US) (-)
Former IPC [2007/49]H01L21/302, G01L21/30, C23F1/00
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2007/49]
Extension statesALNot yet paid
BANot yet paid
HRNot yet paid
MKNot yet paid
YUNot yet paid
TitleGerman:VERFAHREN UND VORRICHTUNG ZUR ÜBERWACHUNG DES PLASMAZUSTANDES IN EINER PLASMA-ÄTZBEARBEITUNGSANLAGE[2007/49]
English:METHOD AND APPARATUS FOR MONITORING PLASMA CONDITIONS IN AN ETCHING PLASMA PROCESSING FACILITY[2007/49]
French:PROCEDE ET DISPOSITIF DE SURVEILLANCE DES CONDITIONS PLASMATIQUES DANS UNE INSTALLATION DE TRAITEMENT POUR GRAVURE AU PLASMA[2007/49]
Entry into regional phase10.10.2007National basic fee paid 
10.10.2007Search fee paid 
10.10.2007Designation fee(s) paid 
10.10.2007Examination fee paid 
Examination procedure10.10.2007Amendment by applicant (claims and/or description)
10.10.2007Examination requested  [2007/49]
13.08.2008Request for preliminary examination filed
International Preliminary Examining Authority: US
16.05.2011Application withdrawn by applicant  [2011/25]
Fees paidRenewal fee
14.03.2008Renewal fee patent year 03
13.03.2009Renewal fee patent year 04
26.03.2010Renewal fee patent year 05
24.03.2011Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]US1798977  (ERICKSON ALBERT N) [X] 1,3-5,10-14,16 * figure 5 *;
 [X]GB636647  (RALPH POOLE) [X] 1-5,10-14,16 * figure 2 *;
 [X]US3522010  (ARCHER LEE A) [X] 1,3-5,10-14,16 * figures 1-3 *;
 [XP]WO2005072161  (ADVANCED TECH MATERIALS [US], et al) [XP] 1,3-18 * figures 9A,9B *;
 [XP]WO2005081931  (ADVANCED TECH MATERIALS [US], et al) [XP] 1,3,4,6-18 * figures 10,11 *;
 [XP]  - CHEN ING-SHIN ET AL, "Application of a downstream calorimetric probe to reactive plasma", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, US LNKD- DOI:10.1063/1.2140088, (20051201), vol. 87, no. 23, ISSN 0003-6951, pages 231501 - 231501, XP012076724 [XP] 1,3-18 * figure 2 *

DOI:   http://dx.doi.org/10.1063/1.2140088
International search[X]US5885361  (KIKUCHI JUN [JP], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.