EP1945562 - WAFER LEVEL PACKAGING PROCESS [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 12.07.2013 Database last updated on 08.10.2024 | Most recent event Tooltip | 12.07.2013 | Application deemed to be withdrawn | published on 14.08.2013 [2013/33] | Applicant(s) | For all designated states MAXIM INTEGRATED PRODUCTS, INC. 120 San Gabriel Drive Sunnyvale, California 94086 / US | [2008/30] | Inventor(s) | 01 /
SRIDHAR, Uppili 14041 Preston Road, Apt. 1901E Dallas, TX 75254 / US | 02 /
ZOU, Quanbo 2401 Ohio Drive, Apt. 901 Plano, TX 75093 / US | [2008/30] | Representative(s) | Zenz Patentanwälte Partnerschaft mbB Gutenbergstraße 39 45128 Essen / DE | [N/P] |
Former [2010/46] | Zenz Patent- und Rechtsanwälte Rüttenscheider Strasse 2 45128 Essen / DE | ||
Former [2008/30] | Lilie, Philipp ZENZ Patent- und Rechtsanwälte Huyssenallee 58-64 45128 Essen / DE | Application number, filing date | 06826782.2 | 25.10.2006 | [2008/30] | WO2006US41853 | Priority number, date | US20050265810 | 03.11.2005 Original published format: US 265810 | [2008/30] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | WO2007055924 | Date: | 18.05.2007 | Language: | EN | [2007/20] | Type: | A2 Application without search report | No.: | EP1945562 | Date: | 23.07.2008 | Language: | EN | The application published by WIPO in one of the EPO official languages on 18.05.2007 takes the place of the publication of the European patent application. | [2008/30] | Search report(s) | International search report - published on: | EP | 19.07.2007 | Classification | IPC: | B81C1/00 | [2008/30] | CPC: |
B81C1/00301 (EP,US);
H01L21/76898 (EP);
B81B2207/096 (EP,US);
H01L2224/11 (EP,US)
| Designated contracting states | BE, DE, FI, FR, GB, IT [2008/49] |
Former [2008/30] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | VERKAPSELUNGSVERFAHREN AUF WAFEREBENE | [2008/30] | English: | WAFER LEVEL PACKAGING PROCESS | [2008/30] | French: | PROCEDE DE BOITIER SUR TRANCHE | [2008/30] | Entry into regional phase | 03.06.2008 | National basic fee paid | 03.06.2008 | Designation fee(s) paid | 03.06.2008 | Examination fee paid | Examination procedure | 03.06.2008 | Examination requested [2008/30] | 04.06.2008 | Loss of particular rights, legal effect: designated state(s) | 15.07.2008 | Despatch of communication of loss of particular rights: designated state(s) AT, BG, CH, CY, CZ, DK, EE, ES, GR, HU, IE, IS, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | 06.04.2009 | Despatch of a communication from the examining division (Time limit: M06) | 05.10.2009 | Reply to a communication from the examining division | 09.10.2012 | Despatch of a communication from the examining division (Time limit: M04) | 20.02.2013 | Application deemed to be withdrawn, date of legal effect [2013/33] | 28.03.2013 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2013/33] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 06.04.2009 | Fees paid | Renewal fee | 31.10.2008 | Renewal fee patent year 03 | 02.11.2009 | Renewal fee patent year 04 | 02.11.2010 | Renewal fee patent year 05 | 31.10.2011 | Renewal fee patent year 06 | 31.10.2012 | Renewal fee patent year 07 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [X]US6225145 (CHOI CHANG AUCK [KR], et al) [X] 1-23 * figures 1,2a-2m *; | [X]WO2005006432 (EPCOS AG [DE], et al) [X] 24-29 * figures 1-3(b) *; | [X]WO03024865 (SCHOTT GLAS [DE], et al) [X] 1,24 * figures 2a-3d *; | [X]US2002113321 (SINIAGUINE OLEG [US]) [X] 24-29 * figures 2a-6 *; | [X]US6777263 (GAN QING [US], et al) [X] 1 * figures 7-9 *; | [A]US2004087043 (LEE CHENKUO [TW], et al) [A] 1-23 * figures 5a-5n *; | [A]EP1071126 (AGILENT TECHNOLOGIES INC [US]) [A] 1-23 * figures 2a-2h * |