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Extract from the Register of European Patents

EP About this file: EP1835544

EP1835544 - Semiconductor device and manufacturing method of the same [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  06.03.2009
Database last updated on 07.10.2024
Most recent event   Tooltip22.05.2009Change - representativepublished on 24.06.2009  [2009/26]
Applicant(s)For all designated states
Sanyo Electric Co., Ltd.
2-5-5 Keihanhondori 2-chome Moriguchi-chi
Osaka 570-8677 / JP
For all designated states
Sanyo Semiconductor Co., Ltd.
1-1-1 Sakata Oizumi-machi Ora-gun
Gunma-ken 370-0596 / JP
[N/P]
Former [2007/38]For all designated states
Sanyo Electric Co. Ltd.
2-5-5 Keihanhondori 2-chome Moriguchi-chi
Osaka 570-8677 / JP
For all designated states
Sanyo Semiconductor Co., Ltd.
1-1-1 Sakata Oizumi-machi Ora-gun
Gunma-ken 370-0596 / JP
Inventor(s)01 / Yanagida, Masamichi
28-4-B202 Nishisinmachi, Ota-shi
Gunma 373-0847 / JP
02 / Kameyama, Koujiro
402-4-A101 Uchigashima-cho, Ota-shi
Gunma 373-0813 / JP
03 / Okada, Kikuo
1014 Shichihongi, Kamisato-machi, Kadama-gun
Saitama 369-0306 / JP
 [2007/38]
Representative(s)Glawe, Delfs, Moll
Partnerschaft mbB von
Patent- und Rechtsanwälten
Rothenbaumchaussee 58
20148 Hamburg / DE
[N/P]
Former [2009/26]Glawe, Delfs, Moll
Patent- und Rechtsanwälte Rothenbaumchaussee 58
20148 Hamburg / DE
Former [2007/38]Glawe, Delfs, Moll
Patent- und Rechtsanwälte, Rothenbaumchaussee 58
20148 Hamburg / DE
Application number, filing date07005474.716.03.2007
[2007/38]
Priority number, dateJP2006007264516.03.2006         Original published format: JP 2006072645
JP2006021590608.08.2006         Original published format: JP 2006215906
JP2007004270322.02.2007         Original published format: JP 2007042703
[2007/38]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1835544
Date:19.09.2007
Language:EN
[2007/38]
Type: A3 Search report 
No.:EP1835544
Date:03.09.2008
[2008/36]
Search report(s)(Supplementary) European search report - dispatched on:EP04.08.2008
ClassificationIPC:H01L29/78, H01L29/739, H01L29/417, H01L29/06, H01L29/08, H01L21/336
[2008/36]
CPC:
H01L29/7802 (EP,US); H01L29/73 (KR); H01L29/0653 (EP,US);
H01L29/0657 (EP,US); H01L29/0696 (EP,US); H01L29/0834 (EP,US);
H01L29/0886 (EP,US); H01L29/41716 (EP,US); H01L29/41741 (EP,US);
H01L29/41766 (EP,US); H01L29/66734 (EP,US); H01L29/7395 (EP,US);
H01L29/7397 (EP,US); H01L29/7398 (EP,US); H01L29/7809 (EP,US);
H01L29/7813 (EP,US); H01L2924/10158 (EP,US) (-)
Former IPC [2007/38]H01L29/78, H01L29/739, H01L29/417, H01L29/06, H01L29/08
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2007/38]
Extension statesALNot yet paid
BANot yet paid
HRNot yet paid
MKNot yet paid
RSNot yet paid
TitleGerman:Halbleitervorrichtung und Herstellungsverfahren dafür[2007/38]
English:Semiconductor device and manufacturing method of the same[2007/38]
French:Dispositif semi-conducteur et son procédé de fabrication[2007/38]
Examination procedure26.02.2009Application withdrawn by applicant  [2009/15]
Fees paidRenewal fee
28.03.2008Renewal fee patent year 03
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Documents cited:Search[X]JPS6263472  (SHARP KK) [X] 1,2,4,5,9,12-15,17-20 * abstract * * figure 1 *;
 [X]JP2002016266  (SANKOSHA CO LTD, et al) [X] 1-9,11-20 * abstract * * figures 12-14 *;
 [A]JP2002353452  (TOSHIBA CORP) [A] 12-14,19,20 * figure 1 *;
 [X]US2004082116  (KUB FRANCIS J [US], et al) [X] 1-9,11-20 * figures 1-5,8,10 and associated text *;
 [X]DE10333556  (INFINEON TECHNOLOGIES AG [DE]) [X] 1,2,4-6,9,12-15,17-20 * figures 1,3, and associated text *;
 [X]US2005156283  (TOKUDA NORIFUMI [JP], et al) [X] 1,3,4,7-20 * figures 1,24-37 and associated text *;
 [E]EP1793426  (SHARP KK [JP]) [E] 1,2,4-6,9,12,14,15,18* figure 1 and associated text *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.