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Extract from the Register of European Patents

EP About this file: EP1906460

EP1906460 - Semiconductor body and semiconductor chip with a semiconductor body [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  05.06.2015
Database last updated on 21.05.2024
Most recent event   Tooltip05.06.2015Application deemed to be withdrawnpublished on 08.07.2015  [2015/28]
Applicant(s)For all designated states
OSRAM Opto Semiconductors GmbH
Leibnizstrasse 4
93055 Regensburg / DE
[2008/14]
Inventor(s)01 / Wirth, Ralph, Dr.
Kapellenweg 3
93098 Mintraching / DE
 [2008/32]
Former [2008/14]01 / Wirth, Ralph, Dr.
Herzog-Ludwig-Strasse 12
93186 Pattendorf-Adlersberg / DE
Representative(s)Epping - Hermann - Fischer
Patentanwaltsgesellschaft mbH
Schlossschmidstrasse 5
80639 München / DE
[N/P]
Former [2008/30]Epping - Hermann - Fischer
Patentanwaltsgesellschaft mbH Ridlerstrasse 55
80339 München / DE
Former [2008/14]Epping - Hermann - Fischer
Patentanwaltsgesellschaft mbH Ridlerstrasse 55
80339 München / DE
Application number, filing date07013824.313.07.2007
[2008/14]
Priority number, dateDE2006104570027.09.2006         Original published format: DE102006045700
DE2006105774707.12.2006         Original published format: DE102006057747
[2008/14]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP1906460
Date:02.04.2008
Language:DE
[2008/14]
Type: A3 Search report 
No.:EP1906460
Date:06.04.2011
[2011/14]
Search report(s)(Supplementary) European search report - dispatched on:EP08.03.2011
ClassificationIPC:H01L33/00
[2008/14]
CPC:
H01L33/145 (EP,US); H01L33/42 (EP,US); H01L2924/0002 (EP,US);
H01L33/405 (EP,US)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesDE,   FR,   GB [2011/50]
Former [2008/14]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MT,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Halbleiterkörper und Halbleiterchip mit einem Halbleiterkörper[2008/14]
English:Semiconductor body and semiconductor chip with a semiconductor body[2008/14]
French:Corps semi-conducteur et puce semi-conductrice dotée d'un corps semi-conducteur[2008/14]
Examination procedure06.10.2011Amendment by applicant (claims and/or description)
06.10.2011Examination requested  [2011/46]
07.10.2011Loss of particular rights, legal effect: designated state(s)
14.11.2011Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR
03.02.2015Application deemed to be withdrawn, date of legal effect  [2015/28]
02.03.2015Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2015/28]
Fees paidRenewal fee
24.07.2009Renewal fee patent year 03
27.07.2010Renewal fee patent year 04
25.07.2011Renewal fee patent year 05
25.07.2012Renewal fee patent year 06
24.07.2013Renewal fee patent year 07
Penalty fee
Additional fee for renewal fee
31.07.201408   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[Y]US2003003613  (HSIEH MIN-HSUN [TW], et al) [Y] 1-4,6,7,9-11,13-15,17-21 * paragraph [0018]; figure 1 *;
 [Y]US6515308  (KNEISSL MICHAEL A [US], et al) [Y] 1-4,6,7,9-11,13,19 * abstract *;
 [Y]US2004061101  (NOTO NOBUHIKO [JP], et al) [Y] 1,5,6 * paragraphs [0003] , [0004] , [0008] , [0009] , [0021] *;
 [Y]US2004159843  (EDMOND JOHN ADAM [US], et al) [Y] 1,5,6 * figure 1 *;
 [Y]US2005205875  (SHEI SHIH-CHANG [TW], et al) [Y] 14,15,17,18,20,21* paragraphs [0019] , [0020] , [0024] *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.