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Extract from the Register of European Patents

EP About this file: EP2037498

EP2037498 - High performance highly heat resistant semiconductor module [Right-click to bookmark this link]
StatusThe application has been refused
Status updated on  07.05.2010
Database last updated on 11.09.2024
Most recent event   Tooltip07.05.2010Refusal of applicationpublished on 09.06.2010  [2010/23]
Applicant(s)For all designated states
SIEMENS AKTIENGESELLSCHAFT
Werner-von-Siemens-Str. 1
DE-80333 München / DE
[N/P]
Former [2009/12]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
80333 München / DE
Inventor(s)01 / Birner, Martin
Weiher 34
92242 Hirschau / DE
02 / Schierling, Hubert, Dr.
Pommernstrasse 18 G
91052 Erlangen / DE
 [2009/12]
Application number, filing date07017801.711.09.2007
[2009/12]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP2037498
Date:18.03.2009
Language:DE
[2009/12]
Search report(s)(Supplementary) European search report - dispatched on:EP06.03.2008
ClassificationIPC:H01L23/42
[2009/12]
CPC:
H01L23/42 (EP); H01L2224/40227 (EP); H01L2224/48227 (EP);
H01L23/22 (EP); H01L25/072 (EP); H01L2924/00014 (EP)
C-Set:
H01L2924/00014, H01L2224/37099 (EP)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2009/12]
TitleGerman:Hochwärmebeständiges Leistungshalbleitermodul[2009/12]
English:High performance highly heat resistant semiconductor module[2009/12]
French:Module semi-conducteur de puissance résistant à une chaleur importante[2009/12]
Examination procedure21.08.2009Examination requested  [2009/40]
21.09.2009Despatch of a communication from the examining division (Time limit: M04)
18.12.2009Reply to a communication from the examining division
25.01.2010Despatch of communication that the application is refused, reason: substantive examination [2010/23]
04.02.2010Application refused, date of legal effect [2010/23]
Fees paidRenewal fee
18.09.2009Renewal fee patent year 03
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Documents cited:Search[XY]GB1047778  (SIEMENS AG) [X] 1,4,6,9 * page 1, line 82 - page 2, line 108; figures 1-3 * [Y] 2,3,5,7,8,10;
 [XA]DE1439456  (SIEMENS AG [DE]) [X] 1-3,6-8 * page 2, paragraph 2 - page 7, paragraph 2; figure 1 * [A] 4,5,9,10;
 [XA]US3462654  (WEINSTEIN HAROLD) [X] 1,4,6,9 * column 2, line 16 - line 72; figure 3 * [A] 2,3,5,7,8,10;
 [A]DE2255837  (HERAEUS GMBH W C) [A] 1-10 * page 4, paragraph 3 - page 5, paragraph 3; figures 1,2 *;
 [A]DE19922928  (DENSO CORP [JP]) [A] 1-10 * column 5, line 50 - column 6, line 64; figure 1 *;
 [XAY]DE10123232  (INFINEON TECHNOLOGIES AG [DE]) [X] 1,6 * paragraph [0041] - paragraph [0046]; figure 1 * [A] 4,9 [Y] 2,3,5,7,8,10;
 [A]WO03075626  (SIEMENS AG [DE]) [A] 1-10* page 5, line 14 - page 8, line 36; figures 1-4 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.