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EP1933377
European procedure
Extract from the Register of European Patents
EP About this file: EP1933377
| EP1933377 - Semiconductor device and method for manufacturing the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 24.02.2012 Database last updated on 15.06.2024 | Most recent event Tooltip | 24.02.2012 | No opposition filed within time limit | published on 28.03.2012 [2012/13] | Applicant(s) | For all designated states SHINKO ELECTRIC INDUSTRIES CO., LTD. 80 Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | [2008/25] | Inventor(s) | 01 /
Machida, Yoshihiro c/o Shinko Electric Industries Co., Ltd. 80, Oshimada-machi Nagano-shi Nagano 381-2287 / JP | 02 /
Yamano, Takaharu c/o Shinko Electric Industries Co., Ltd. 80, Oshimada-machi Nagano-shi Nagano 381-2287 / JP | [2008/25] | Representative(s) | Zimmermann, Gerd Heinrich, et al Zimmermann & Partner Patentanwälte mbB Postfach 330 920 80069 München / DE | [N/P] |
| Former [2008/25] | Zimmermann, Gerd Heinrich, et al Zimmermann & Partner, P.O. Box 330 920 80069 München / DE | Application number, filing date | 07020813.7 | 24.10.2007 | [2008/25] | Priority number, date | JP20060289149 | 24.10.2006 Original published format: JP 2006289149 | [2008/25] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1933377 | Date: | 18.06.2008 | Language: | EN | [2008/25] | Type: | A3 Search report | No.: | EP1933377 | Date: | 21.10.2009 | [2009/43] | Type: | B1 Patent specification | No.: | EP1933377 | Date: | 20.04.2011 | Language: | EN | [2011/16] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 22.09.2009 | Classification | IPC: | H01L21/60, H01L23/485 | [2008/25] | CPC: |
H01L23/3114 (EP,US);
H01L23/48 (KR);
H01L21/6835 (EP,US);
H01L23/28 (KR);
H01L23/485 (EP,US);
H01L23/525 (EP,US);
H01L24/11 (EP,US);
H01L24/12 (EP,US);
H01L2221/68359 (EP,US);
H01L2221/68363 (EP,US);
H01L2221/68377 (EP,US);
H01L2224/0231 (EP,US);
H01L2224/02319 (EP,US);
H01L2224/02333 (EP,US);
H01L2224/0401 (EP,US);
H01L2224/13099 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01019 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01037 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
| Designated contracting states | DE [2010/26] |
| Former [2008/25] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Halbleiterbauelement und Herstellungsverfahren dafür | [2008/25] | English: | Semiconductor device and method for manufacturing the same | [2008/25] | French: | Dispositif semi-conducteur et son procédé de fabrication | [2008/25] | Examination procedure | 21.04.2010 | Amendment by applicant (claims and/or description) | 21.04.2010 | Examination requested [2010/22] | 22.04.2010 | Loss of particular rights, legal effect: designated state(s) | 27.05.2010 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR | 23.11.2010 | Communication of intention to grant the patent | 01.03.2011 | Fee for grant paid | 01.03.2011 | Fee for publishing/printing paid | Opposition(s) | 23.01.2012 | No opposition filed within time limit [2012/13] | Fees paid | Renewal fee | 28.10.2009 | Renewal fee patent year 03 | 02.11.2010 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US6096577 (HASHIMOTO NOBUAKI [JP]) [A] 2-4* column 4, line 40 - column 5, line 12; figures 1a,1b *; | [A]US2002175409 (TSUBOSAKI KUNIHIRO [JP]) [A] 1,5 * paragraph [0052] - paragraph [0100]; figures 5,6 *; | [A]US2004115868 (ONO YOSHIHIRO [JP]) [A] 1,5 * the whole document *; | [XA]US2004159958 (FUNAKI TSUKIO [JP]) [X] 6 * paragraph [0066] - paragraph [0068]; figure 1 * * paragraph [0077] - paragraph [0078] * * the whole document * [A] | by applicant | US2004159958 |