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Extract from the Register of European Patents

EP About this file: EP1843392

EP1843392 - Electronics assembly having heat sink substrate disposed in cooling vessel [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  20.02.2009
Database last updated on 28.05.2024
Most recent event   Tooltip20.02.2009Application deemed to be withdrawnpublished on 25.03.2009  [2009/13]
Applicant(s)For all designated states
Delphi Technologies, Inc.
P.O. Box 5052
Troy, MI 48007 / US
[N/P]
Former [2007/41]For all designated states
Delphi Technologies, Inc.
P.O. Box 5052
Troy, Michigan 48007 / US
Inventor(s)01 / Ruiz, Javier
20641 Gavin Avenue
Noblesville, IN 46060 / US
 [2007/41]
Representative(s)Denton, Michael John, et al
Delphi France SAS
Bât. le Raspail - ZAC Paris Nord 2
22, avenue des Nations
CS 65059 Villepinte
95972 Roissy CDG Cedex / FR
[N/P]
Former [2008/34]Denton, Michael John, et al
Delphi European Headquarters 64 avenue de la Pleine de France Paris Nord II B.P. 65059, Tremblay en France
95972 Roissy Charles de Gaulle Cedex / FR
Former [2007/41]Denton, Michael John, et al
Delphi European Headquarters, 64 avenue de la Plaine de France, Paris Nord II, B.P. 65059, Tremblay en France
95972 Roissy Charles de Gaulle Cedex / FR
Application number, filing date07075214.220.03.2007
[2007/41]
Priority number, dateUS2006039834405.04.2006         Original published format: US 398344
[2007/41]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1843392
Date:10.10.2007
Language:EN
[2007/41]
Search report(s)(Supplementary) European search report - dispatched on:EP01.08.2007
ClassificationIPC:H01L23/473
[2007/41]
CPC:
H01L23/473 (EP,US); H01L2924/0002 (EP,US); H01L2924/09701 (EP,US)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2007/41]
TitleGerman:Elektronikaufbau mit einem in einem Kühlbehälter angebrachten Wärmesenkensubstrat[2007/41]
English:Electronics assembly having heat sink substrate disposed in cooling vessel[2007/41]
French:Ensemble électronique doté d'un substrat de dissipateur de chaleur dans un récipient de refroidissement[2007/41]
Examination procedure10.04.2008Examination requested  [2008/22]
21.05.2008Despatch of a communication from the examining division (Time limit: M04)
01.10.2008Application deemed to be withdrawn, date of legal effect  [2009/13]
04.11.2008Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2009/13]
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Documents cited:Search[XA]US5455458  (QUON WILLIAM [US], et al) [X] 1-3,9-11 * column 2, line 26 - column 3, line 22; figure 1 * [A] 4-8;
 [XA]DE19645636  (TELEFUNKEN MICROELECTRON [DE]) [X] 1-5,7-9 * column 3, line 29 - column 4, line 55; figure 1 * [A] 6,10,11;
 [XA]JP2001168256  (SUMITOMO ELECTRIC INDUSTRIES) [X] 1-3,6,8-10 * abstract * [A] 4,5,7,11;
 [XA]EP1124259  (ABB SEMICONDUCTORS AG [CH]) [X] 1,3,7 * paragraph [0013] - paragraph [0023]; figures 1,2 * [A] 2,4-6,8-11;
 [A]FR2807285  (SEEM SEMRAC [FR]) [A] 1-11* page 4, line 25 - page 6, line 22; figure 3 *;
 [XA]US6367543  (CALAMAN DOUGLAS P [US], et al) [X] 1,3 * column 4, line 4 - column 5, line 10; figures 1-5 * [A] 2,4-11;
 [XA]EP1271646  (ALSTOM [FR]) [X] 1-3 * paragraph [0011] - paragraph [0013]; figure 1 * [A] 4-11
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.