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Extract from the Register of European Patents

EP About this file: EP2047511

EP2047511 - METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A DEVICE MANUFACTURED BY THE METHOD [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  06.06.2014
Database last updated on 16.09.2024
Most recent event   Tooltip06.06.2014Application deemed to be withdrawnpublished on 09.07.2014  [2014/28]
Applicant(s)For all designated states
NXP B.V.
High Tech Campus 60
5656 AG Eindhoven / NL
[2009/50]
Former [2009/16]For all designated states
NXP B.V.
High Tech Campus 60
5656 AG Eindhoven / NL
Inventor(s)01 / SONSKY, Jan
c/o NXP Semiconductors IP Department Cross Oak Lane
Redhill Surrey RH1 5HA / GB
02 / VAN NOORT, Wibo, D.
c/o NXP Semiconductors IP Department Cross Oak Lane
Redhill Surrey RH1 5HA / GB
03 / VAN DALEN, Rob
c/o NXP Semiconductors IP Department Cross Oak Lane
Redhill Surrey RH1 5HA / GB
 [2009/16]
Representative(s)Crawford, Andrew, et al
NXP SEMICONDUCTORS UK LTD
Intellectual Property & Licensing
Red Central
60 High Street
Redhill, Surrey RH1 1SH / GB
[2014/09]
Former [2009/16]White, Andrew Gordon
NXP Semiconductors IP Department Betchworth House 57-65 Station Road Redhill
Surrey RH1 1DL / GB
Application number, filing date07825935.519.07.2007
[2009/16]
WO2007IB52884
Priority number, dateEP2006011774024.07.2006         Original published format: EP 06117740
[2009/16]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO2008012737
Date:31.01.2008
Language:EN
[2008/05]
Type: A2 Application without search report 
No.:EP2047511
Date:15.04.2009
Language:EN
The application published by WIPO in one of the EPO official languages on 31.01.2008 takes the place of the publication of the European patent application.
[2009/16]
Search report(s)International search report - published on:EP10.04.2008
ClassificationIPC:H01L29/78, H01L21/331, H01L21/336, H01L29/423, H01L29/737, H01L29/06, H01L29/165
[2009/16]
CPC:
H01L29/7802 (EP,KR,US); H01L29/0623 (EP,KR,US); H01L29/0653 (EP,KR,US);
H01L29/165 (EP,KR,US); H01L29/66712 (EP,KR,US); H01L29/73 (EP,KR,US);
H01L29/7813 (KR) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2009/16]
Extension statesALNot yet paid
BANot yet paid
HRNot yet paid
MKNot yet paid
RSNot yet paid
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINER HALBLEITERVORRICHTUNG UND MIT DIESEM VERFAHREN HERGESTELLTE VORRICHTUNG[2009/16]
English:METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A DEVICE MANUFACTURED BY THE METHOD[2009/16]
French:PROCÉDÉ DE FABRICATION D'UN DISPOSITIF SEMI-CONDUCTEUR ET DISPOSITIF FABRIQUÉ SELON CE PROCÉDÉ[2009/16]
Entry into regional phase24.02.2009National basic fee paid 
24.02.2009Designation fee(s) paid 
24.02.2009Examination fee paid 
Examination procedure24.02.2009Examination requested  [2009/16]
07.08.2009Despatch of a communication from the examining division (Time limit: M06)
22.01.2010Reply to a communication from the examining division
14.04.2011Despatch of a communication from the examining division (Time limit: M04)
05.08.2011Reply to a communication from the examining division
01.02.2014Application deemed to be withdrawn, date of legal effect  [2014/28]
04.02.2014Despatch of a communication from the examining division (Time limit: M04)
25.02.2014Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2014/28]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  07.08.2009
Fees paidRenewal fee
31.07.2009Renewal fee patent year 03
02.08.2010Renewal fee patent year 04
01.08.2011Renewal fee patent year 05
31.07.2012Renewal fee patent year 06
Penalty fee
Additional fee for renewal fee
31.07.201307   M06   Not yet paid
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Cited inInternational search[X]WO03044861  (KONINKL PHILIPS ELECTRONICS NV [NL], et al) [X] 8,10,11 * page 6, line 27 - page 7, line 1; figure 1 *;
 [X]US2004014451  (SAPP STEVEN [US], et al) [X] 8,9,12 * paragraphs [0035] - [0052]; figures 2-5 *;
 [A]US2004104448  (MARTY MICHEL [FR], et al) [A] 1-12 * the whole document *;
 [A]US2005277260  (COHEN GUY M [US], et al) [A] 1-12* the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.