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EP2133909
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EP About this file: EP2133909
| EP2133909 - SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 20.10.2017 Database last updated on 14.06.2024 | |
| Former | Examination is in progress Status updated on 03.02.2017 | Most recent event Tooltip | 20.10.2017 | Application deemed to be withdrawn | published on 22.11.2017 [2017/47] | Applicant(s) | For all designated states Kabushiki Kaisha Toshiba 1-1 Shibaura 1-chome Minato-ku Tokyo 105-8001 / JP | [2009/51] | Representative(s) | Moreland, David, et al Marks & Clerk LLP The Beacon 176 St Vincent Street Glasgow G2 5SG / GB | [N/P] |
| Former [2009/51] | Maury, Richard Philip Marks & Clerk LLP 90 Long Acre London WC2E 9RA / GB | Application number, filing date | 07832928.1 | 03.12.2007 | [2009/51] | WO2007JP73308 | Priority number, date | JP20070096851 | 02.04.2007 Original published format: JP 2007096851 | [2009/51] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2008120418 | Date: | 09.10.2008 | Language: | JA | [2008/41] | Type: | A1 Application with search report | No.: | EP2133909 | Date: | 16.12.2009 | Language: | EN | [2009/51] | Search report(s) | International search report - published on: | JP | 09.10.2008 | (Supplementary) European search report - dispatched on: | EP | 15.02.2011 | Classification | IPC: | H01L21/338, H01L29/812, H01L21/768, H01L23/48 | [2011/11] | CPC: |
H01L29/772 (EP,US);
H01L27/095 (KR);
H01L21/18 (KR);
H01L21/76898 (EP,US);
H01L23/481 (EP,US);
H01L29/41758 (EP,US);
H01L29/812 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/49175 (EP,US);
H01L2924/1305 (EP,US)
(-)
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2924/1305, H01L2924/00 (US,EP) |
| Former IPC [2009/51] | H01L21/338, H01L21/3205, H01L23/52, H01L29/812 | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR [2009/51] | Title | German: | HALBLEITERANORDNUNG UND VERFAHREN ZU IHRER HERSTELLUNG | [2009/51] | English: | SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD | [2009/51] | French: | DISPOSITIF A SEMI-CONDUCTEUR ET SON PROCEDE DE FABRICATION | [2009/51] | Entry into regional phase | 15.05.2009 | Translation filed | 15.05.2009 | National basic fee paid | 15.05.2009 | Search fee paid | 15.05.2009 | Designation fee(s) paid | 15.05.2009 | Examination fee paid | Examination procedure | 15.05.2009 | Examination requested [2009/51] | 11.07.2011 | Amendment by applicant (claims and/or description) | 03.02.2017 | Despatch of a communication from the examining division (Time limit: M04) | 14.06.2017 | Application deemed to be withdrawn, date of legal effect [2017/47] | 06.07.2017 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2017/47] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 03.02.2017 | Fees paid | Renewal fee | 11.12.2009 | Renewal fee patent year 03 | 15.12.2010 | Renewal fee patent year 04 | 12.12.2011 | Renewal fee patent year 05 | 11.12.2012 | Renewal fee patent year 06 | 12.12.2013 | Renewal fee patent year 07 | 11.12.2014 | Renewal fee patent year 08 | 10.12.2015 | Renewal fee patent year 09 | 13.12.2016 | Renewal fee patent year 10 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]US5343071 (KAZIOR THOMAS E [US], et al) [X] 1,2 * column 3, paragraph 6 - column 25, paragraph 14; figure 1 * [I] 4,5; | [Y]US2006046471 (KIRBY KYLE K [US], et al) [Y] 1-6 * paragraphs [0009] , [0010] , [0036] - [0044]; figures 1-4 *; | [Y]US5770513 (OKANIWA KAZUHIRO [JP]) [Y] 1-6 * column 1, lines 19-41; figures 15-18 * * column 9, lines 1-65 *; | [Y]EP1693891 (IMEC INTER UNI MICRO ELECTR [BE]) [Y] 1,2,4,5 * figures 3-5 * | [Y] - KIAT T N ET AL, "A SUB-SURFACE METALLIZATION POST-PROCESS IC MODULE FOR RF TECHNOLOGY", PROCEEDINGS OF THE 2000 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING. ( BCTM ). MINNEAPOLIS, MN, SEPT. 24 - 26, 2000; [IEEE BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING], NEW YORK, NY : IEEE, US, (20000924), ISBN 978-0-7803-6385-4, pages 195 - 198, XP000977230 [Y] 3,6 * figure 1 * | International search | [X]JPS62211962 (FUJITSU LTD); | [X]JPS63278368 (NEC CORP); | [X]JPH06326064 (NEC CORP); | [A]JPH02307219 (OKI ELECTRIC IND CO LTD) |