Extract from the Register of European Patents

EP About this file: EP1976358

EP1976358 - Assembly of at least one voltage semiconductor module and a conductor board [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  28.02.2014
Database last updated on 28.03.2026
Most recent event   Tooltip28.02.2014No opposition filed within time limitpublished on 02.04.2014  [2014/14]
Applicant(s)For all designated states
IXYS CH GmbH
Mattenstrasse 6
2555 Brügg / CH
[2009/18]
Former [2008/40]For all designated states
IXYS Semiconductor GmbH
Edisonstrasse 15
D-68623 Lampertheim / DE
Inventor(s)01 / Zschieschang, Olaf
Lise-Meitner-Strasse 3
68519 Viernheim / DE
02 / Laschek-Enders, Andreas
Wilhelm-Kilian-Strasse 8
64625 Bensheim / DE
 [2008/40]
Representative(s)Oppermann, Frank, et al
OANDO Oppermann & Oppermann
Thurn-und-Taxis-Platz 6
60313 Frankfurt am Main / DE
[N/P]
Former [2013/17]Oppermann, Frank, et al
OANDO Oppermann & Oppermann LLP
John-F.-Kennedy-Straße 4
65189 Wiesbaden / DE
Former [2012/14]Oppermann, Frank, et al
Oppermann & Oppermann LLP
John-F.-Kennedy-Straße 4
65189 Wiesbaden / DE
Former [2008/40]Luderschmidt, Schüler & Partner
Patentanwälte John-F.-Kennedy-Strasse 4
65189 Wiesbaden / DE
Application number, filing date08004261.707.03.2008
[2008/40]
Priority number, dateDE2007101478928.03.2007         Original published format: DE102007014789
[2008/40]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP1976358
Date:01.10.2008
Language:DE
[2008/40]
Type: A3 Search report 
No.:EP1976358
Date:07.07.2010
[2010/27]
Type: B1 Patent specification 
No.:EP1976358
Date:24.04.2013
Language:DE
[2013/17]
Search report(s)(Supplementary) European search report - dispatched on:EP09.06.2010
ClassificationIPC:H05K7/20
[2008/40]
CPC:
H10W40/77 (EP,US); H05K3/303 (EP,US); H05K3/3421 (EP,US);
H10W40/22 (EP,US); H05K2201/0311 (EP,US); H05K2201/10689 (EP,US);
H05K2201/2036 (EP,US); H05K2203/0278 (EP,US); H10W40/641 (EP,US);
H10W74/00 (EP,US); Y02P70/50 (EP,US) (-)
Designated contracting statesDE,   GB [2011/11]
Former [2008/40]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte[2008/40]
English:Assembly of at least one voltage semiconductor module and a conductor board[2008/40]
French:Agencement d'au moins un module semi-conducteur de puissance et une plaque conductrice[2008/40]
Examination procedure07.01.2011Amendment by applicant (claims and/or description)
07.01.2011Examination requested  [2011/08]
08.01.2011Loss of particular rights, legal effect: designated state(s)
15.02.2011Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR
28.09.2012Communication of intention to grant the patent
08.02.2013Fee for grant paid
08.02.2013Fee for publishing/printing paid
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  28.09.2012
Opposition(s)27.01.2014No opposition filed within time limit [2014/14]
Fees paidRenewal fee
13.03.2010Renewal fee patent year 03
29.03.2011Renewal fee patent year 04
27.03.2012Renewal fee patent year 05
09.03.2013Renewal fee patent year 06
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Documents cited:Search[A] US6035523  (MCNEIL GREG D et al.)
 [A] US6180436  (KOORS MARK ANTHONY et al.)
 [A] US2006138452  (KNAPP WOLFGANG et al.)
 [A] US6566879  (VANEK DENIS W et al.)
 [A] US6633485  (SIGL DENNIS R et al.)
 [A] US5483103  (BLICKHAN JOSEPH D et al.)
by applicantEP0513410
 DE19646396
 DE19625240
 US6404065
 WO9429901
 US6035523
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