EP1981083 - Method for manufacturing an SOI substrate [Right-click to bookmark this link] | Status | The application has been refused Status updated on 06.09.2013 Database last updated on 19.10.2024 | Most recent event Tooltip | 06.09.2013 | Refusal of application | published on 09.10.2013 [2013/41] | Applicant(s) | For all designated states Shin-Etsu Chemical Company, Ltd. 6-1, Ohtemachi 2-chome, Chiyoda-ku Tokyo 100-0004 / JP | [2008/42] | Inventor(s) | 01 /
Kawai, Makoto Shin-Etsu Chemical Co., Ltd. 2-13-1, Isobe Annaka-shi, Gunma-ken / JP | 02 /
Kubota, Yoshihiro Shin-Etsu Chemical Co., Ltd. 2-13-1, Isobe Annaka-shi, Gunma-ken / JP | 03 /
Ito, Atsuo Shin-Etsu Chemical Co., Ltd. 2-13-1, Isobe Annaka-shi, Gunma-ken / JP | 04 /
Tanaka, Koichi Shin-Etsu Chemical Co., Ltd. 2-13-1, Isobe Annaka-shi, Gunma-ken / JP | 05 /
Tobisaka, Yuuji Shin-Etsu Chemical Co., Ltd. 2-13-1, Isobe Annaka-shi, Gunma-ken / JP | 06 /
Akiyama, Shoji Shin-Etsu Chemical Co., Ltd. 2-13-1, Isobe Annaka-shi, Gunma-ken / JP | [2008/42] | Representative(s) | Wibbelmann, Jobst Wuesthoff & Wuesthoff Patentanwälte und Rechtsanwalt PartG mbB Schweigerstrasse 2 81541 München / DE | [N/P] |
Former [2008/42] | Wibbelmann, Jobst Wuesthoff & Wuesthoff Patent- und Rechtsanwälte Schweigerstrasse 2 81541 München / DE | Application number, filing date | 08005514.8 | 25.03.2008 | [2008/42] | Priority number, date | JP20070105176 | 12.04.2007 Original published format: JP 2007105176 | [2008/42] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1981083 | Date: | 15.10.2008 | Language: | EN | [2008/42] | Type: | A3 Search report | No.: | EP1981083 | Date: | 14.10.2009 | [2009/42] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 14.09.2009 | Classification | IPC: | H01L27/12, H01L21/762, H01L21/04 | [2008/42] | CPC: |
H01L21/76254 (EP,US);
H01L21/2007 (US);
H01L29/78603 (EP,US)
| Designated contracting states | BE, DE, FR, GB [2010/25] |
Former [2008/42] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR | Title | German: | Verfahren zur Herstellung eines SOI-Substrats | [2008/42] | English: | Method for manufacturing an SOI substrate | [2008/42] | French: | Procédé de fabrication d'un substrat SOI | [2008/42] | Examination procedure | 16.12.2009 | Amendment by applicant (claims and/or description) | 16.12.2009 | Examination requested [2010/04] | 03.02.2010 | Despatch of a communication from the examining division (Time limit: M04) | 15.04.2010 | Loss of particular rights, legal effect: designated state(s) | 25.05.2010 | Despatch of communication of loss of particular rights: designated state(s) AT, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR | 26.05.2010 | Reply to a communication from the examining division | 17.05.2013 | Cancellation of oral proceeding that was planned for 27.06.2013 | 23.05.2013 | Despatch of communication that the application is refused, reason: substantive examination [2013/41] | 02.06.2013 | Application refused, date of legal effect [2013/41] | 27.06.2013 | Date of oral proceedings (cancelled) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 03.02.2010 | Fees paid | Renewal fee | 15.03.2010 | Renewal fee patent year 03 | 15.03.2011 | Renewal fee patent year 04 | 14.03.2012 | Renewal fee patent year 05 | 11.03.2013 | Renewal fee patent year 06 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0697713 (TOSHIBA KK [JP]) [A] 1-6 * column 4, line 34 - column 5, line 22 * * column 10, line 54 - column 11, line 20 *; | [Y]US5843832 (FARMER KENNETH R [US], et al) [Y] 4 * column 5, line 50 - column 6, line 6 *; | [XY]EP0961312 (CANON KK [JP]) [X] 1-3,5,6 * abstract * * column 9, paragraph 57 * * column 10, paragraphs 63,68 * * column 12, paragraph 85 * * column 13, paragraph 93 - column 15, paragraph 105 * * column 17, paragraph 121 - column 18, paragraph 125 * [Y] 4; | [A]US2002153563 (OGURA ATSUSHI [JP]) [A] 1-6 * page 4, paragraphs 64-71 *; | [A]EP1513193 (SUMITOMO MITSUBISHI SILICON [JP]) [A] 1-6 * page 9, paragraph 86 - page 10, paragraph 97 *; | [A]US2005245048 (GRAF DIETER [DE], et al) [A] 1-6* page 3, paragraphs 39,40 * | by applicant | JPH0348201B | JPH0618926 | JPH11145438 | JPH11163363 | JP2002110998 | JP2003282885 | - SMART CUT TECHNOLOGY: INDUSTRIAL STATUS of SOI WAFER PRODUCTION and NEW MATERIAL DEVELOPMENTS, ELECTROCHEMICAL SOCIETY, (1999), vol. 99, pages 93 - 106 |