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EP2001047
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EP About this file: EP2001047
| EP2001047 - Semiconductor device [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 17.04.2015 Database last updated on 19.10.2024 | Most recent event Tooltip | 17.04.2015 | Application deemed to be withdrawn | published on 20.05.2015 [2015/21] | Applicant(s) | For all designated states Semiconductor Energy Laboratory Co, Ltd. 398, Hase Atsugi-shi, Kanagawa, 243-0036 / JP | [N/P] |
| Former [2008/50] | For all designated states Semiconductor Energy Laboratory Co, Ltd. 398, Hase Atsugi-shi, Kanagawa 243-0036 / JP | Inventor(s) | 01 /
Ohtani, Hisashi Semiconductor Energy Lab. Co.,Ltd. 398, Hase Atsugi-shi Kanagawa-ken 243-0036 / JP | 02 /
Sugiyama, Eiji Semiconductor Energy Lab. Co.,Ltd. 398, Hase Atsugi-shi Kanagawa-ken 243-0036 / JP | [2008/50] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstraße 4 80802 München / DE | [N/P] |
| Former [2008/50] | Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät Leopoldstrasse 4 80802 München / DE | Application number, filing date | 08009111.9 | 16.05.2008 | [2008/50] | Priority number, date | JP20070151168 | 07.06.2007 Original published format: JP 2007151168 | [2008/50] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2001047 | Date: | 10.12.2008 | Language: | EN | [2008/50] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.10.2008 | Classification | IPC: | H01L21/56, H01L23/29, H01L23/31 | [2008/50] | CPC: |
H01L23/295 (EP,US);
H01L23/14 (KR);
H01L21/56 (EP,US);
H01L23/18 (KR);
H01L23/3157 (EP,US);
H01L2924/0002 (EP,US);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE, FI, FR, GB, NL [2009/34] |
| Former [2008/50] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR | Title | German: | Halbleiterbauelement | [2008/50] | English: | Semiconductor device | [2008/50] | French: | Dispositif semi-conducteur | [2008/50] | Examination procedure | 19.05.2009 | Examination requested [2009/27] | 11.06.2009 | Loss of particular rights, legal effect: designated state(s) | 22.06.2009 | Despatch of a communication from the examining division (Time limit: M04) | 17.07.2009 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NO, PL, PT, RO, SE, SI, SK, TR | 26.10.2009 | Reply to a communication from the examining division | 02.12.2014 | Application deemed to be withdrawn, date of legal effect [2015/21] | 07.01.2015 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2015/21] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 22.06.2009 | Fees paid | Renewal fee | 31.03.2010 | Renewal fee patent year 03 | 11.05.2011 | Renewal fee patent year 04 | 29.03.2012 | Renewal fee patent year 05 | 10.05.2013 | Renewal fee patent year 06 | Penalty fee | Additional fee for renewal fee | 31.05.2014 | 07 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]EP1758438 (SHINKO ELECTRIC IND CO [JP]) [Y] 1-13 * paragraph [0021] - paragraph [0058]; figures 1,16 *; | [Y]WO9609158 (AMP AKZO LINLAM VOF [NL], et al) [Y] 1-13 * page 5, line 1 - page 12, line 30; figures 1-3 *; | [A]US2007004125 (WATANABE YASUKO [JP], et al) [A] 1-13 * paragraph [0040] - paragraph [0070]; figures 1-3 *; | [A]US2004016939 (AKIBA MASAYUKI [JP], et al) [A] 1-13 * paragraph [0027] - paragraph [0038]; figure 2 *; | [A]EP0939441 (CANON KK [JP]) [A] 1-13 * paragraph [0021] - paragraph [0047]; figure 1 *; | [E]EP1970951 (SEMICONDUCTOR ENERGY LAB [JP]) [E] 1-13 * paragraph [0021] - paragraph [0067]; figures 1,8,9 * | by applicant | JP3364081B | JP3406727B | JP2003174153 | JP2007151168 |