EP2017634 - Inspection apparatus and inspection method [Right-click to bookmark this link] | |||
Former [2009/04] | Inspection apparatus, probe card and inspection method | ||
[2010/11] | Status | No opposition filed within time limit Status updated on 29.07.2011 Database last updated on 16.07.2024 | Most recent event Tooltip | 29.07.2011 | No opposition filed within time limit | published on 31.08.2011 [2011/35] | Applicant(s) | For all designated states Tokyo Electron Limited Akasaka Biz Tower 3-1 Akasaka 5-chome Minato-ku Tokyo 107-6325 / JP | [2009/04] | Inventor(s) | 01 /
Komatsu, Shigekazu c/oTOKYO ELECTRON AT LIMITED 2381-1 Kitagejo, Fujii-cho Nirasaki-shi, Yamanashi 407-8511 / JP | 02 /
Shinozaki, Dai c/oTOKYO ELECTRON AT LIMITED 30-7 Sumiyoshi-cho 2-chome Fuchu-shi, Tokyo 183-8705 / JP | 03 /
Sakamoto, Katsuaki 1290 Shimokuzawa Sagamihara-shi, Kanagawa 229-1134 / JP | [2009/04] | Representative(s) | Manitz Finsterwald Patent- und Rechtsanwaltspartnerschaft mbB Postfach 31 02 20 80102 München / DE | [N/P] |
Former [2009/04] | Manitz, Finsterwald & Partner GbR Postfach 31 02 20 80102 München / DE | Application number, filing date | 08012480.3 | 10.07.2008 | [2009/04] | Priority number, date | JP20070189500 | 20.07.2007 Original published format: JP 2007189500 | [2009/04] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2017634 | Date: | 21.01.2009 | Language: | EN | [2009/04] | Type: | B1 Patent specification | No.: | EP2017634 | Date: | 22.09.2010 | Language: | EN | [2010/38] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 16.10.2008 | Classification | IPC: | G01R31/319, G01R31/3161, G01R31/28, G01R1/067 | [2009/04] | CPC: |
G01R31/2886 (EP,US);
H01L22/00 (KR);
G01R1/073 (KR);
G01R31/31926 (EP,US);
G01R1/06766 (EP,US)
| Designated contracting states | DE, GB, IT [2009/39] |
Former [2009/04] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR | Title | German: | Prüfvorrichtung und Prüfverfahren | [2010/11] | English: | Inspection apparatus and inspection method | [2010/11] | French: | Appareil et procédé d'inspection | [2010/11] |
Former [2009/04] | Prüfvorrichtung, Nadelkarte und Prüfverfahren | ||
Former [2009/04] | Inspection apparatus, probe card and inspection method | ||
Former [2009/04] | Appareil et procédé d'inspection et carte de sonde | Examination procedure | 03.09.2008 | Examination requested [2009/04] | 22.07.2009 | Loss of particular rights, legal effect: designated state(s) | 10.08.2009 | Despatch of a communication from the examining division (Time limit: M06) | 25.08.2009 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GR, HR, HU, IE, IS, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR | 26.01.2010 | Reply to a communication from the examining division | 31.03.2010 | Communication of intention to grant the patent | 03.08.2010 | Fee for grant paid | 03.08.2010 | Fee for publishing/printing paid | Opposition(s) | 23.06.2011 | No opposition filed within time limit [2011/35] | Fees paid | Renewal fee | 30.07.2010 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2004174177 (IINO SHINJI [JP], et al) [X] 1-12 * column A; figures 1-22B; claims 1-15 * * paragraphs [0010] - [0046] * * paragraphs [0071] - [0090] *; | [X]US6529011 (OKUBO HIROSHI [JP]) [X] 1-12 * column A; figures 1-7; claims 1-18 * * column 1, line 60 - column 3, line 27 * * column 3, line 52 - column 7, line 19 *; | [X]EP1574866 (TOKYO ELECTRON LTD [JP]) [X] 1-12 * column A; figures 1,2; claims 1-8 * * paragraphs [0006] - [0010] * * paragraphs [0012] - [0026] *; | [PA]EP1939640 (TOKYO ELECTRON LTD [JP]) [PA] 1-12 * column A; figures 1-10; claims 1-8 * * paragraphs [0002] - [0004] * * paragraphs [0016] - [0048] * | by applicant | JP2005005331 | JP2002139542 | JP3642456B | US2004174177 | US6529011 | EP1574866 | EP1939640 |