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Extract from the Register of European Patents

EP About this file: EP2017634

EP2017634 - Inspection apparatus and inspection method [Right-click to bookmark this link]
Former [2009/04]Inspection apparatus, probe card and inspection method
[2010/11]
StatusNo opposition filed within time limit
Status updated on  29.07.2011
Database last updated on 16.07.2024
Most recent event   Tooltip29.07.2011No opposition filed within time limitpublished on 31.08.2011  [2011/35]
Applicant(s)For all designated states
Tokyo Electron Limited
Akasaka Biz Tower 3-1 Akasaka 5-chome Minato-ku
Tokyo 107-6325 / JP
[2009/04]
Inventor(s)01 / Komatsu, Shigekazu c/oTOKYO ELECTRON AT LIMITED
2381-1 Kitagejo, Fujii-cho
Nirasaki-shi, Yamanashi 407-8511 / JP
02 / Shinozaki, Dai c/oTOKYO ELECTRON AT LIMITED
30-7 Sumiyoshi-cho 2-chome
Fuchu-shi, Tokyo 183-8705 / JP
03 / Sakamoto, Katsuaki
1290 Shimokuzawa
Sagamihara-shi, Kanagawa 229-1134 / JP
 [2009/04]
Representative(s)Manitz Finsterwald Patent- und Rechtsanwaltspartnerschaft mbB
Postfach 31 02 20
80102 München / DE
[N/P]
Former [2009/04]Manitz, Finsterwald & Partner GbR
Postfach 31 02 20
80102 München / DE
Application number, filing date08012480.310.07.2008
[2009/04]
Priority number, dateJP2007018950020.07.2007         Original published format: JP 2007189500
[2009/04]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2017634
Date:21.01.2009
Language:EN
[2009/04]
Type: B1 Patent specification 
No.:EP2017634
Date:22.09.2010
Language:EN
[2010/38]
Search report(s)(Supplementary) European search report - dispatched on:EP16.10.2008
ClassificationIPC:G01R31/319, G01R31/3161, G01R31/28, G01R1/067
[2009/04]
CPC:
G01R31/2886 (EP,US); H01L22/00 (KR); G01R1/073 (KR);
G01R31/31926 (EP,US); G01R1/06766 (EP,US)
Designated contracting statesDE,   GB,   IT [2009/39]
Former [2009/04]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Prüfvorrichtung und Prüfverfahren[2010/11]
English:Inspection apparatus and inspection method[2010/11]
French:Appareil et procédé d'inspection[2010/11]
Former [2009/04]Prüfvorrichtung, Nadelkarte und Prüfverfahren
Former [2009/04]Inspection apparatus, probe card and inspection method
Former [2009/04]Appareil et procédé d'inspection et carte de sonde
Examination procedure03.09.2008Examination requested  [2009/04]
22.07.2009Loss of particular rights, legal effect: designated state(s)
10.08.2009Despatch of a communication from the examining division (Time limit: M06)
25.08.2009Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GR, HR, HU, IE, IS, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR
26.01.2010Reply to a communication from the examining division
31.03.2010Communication of intention to grant the patent
03.08.2010Fee for grant paid
03.08.2010Fee for publishing/printing paid
Opposition(s)23.06.2011No opposition filed within time limit [2011/35]
Fees paidRenewal fee
30.07.2010Renewal fee patent year 03
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Documents cited:Search[X]US2004174177  (IINO SHINJI [JP], et al) [X] 1-12 * column A; figures 1-22B; claims 1-15 * * paragraphs [0010] - [0046] * * paragraphs [0071] - [0090] *;
 [X]US6529011  (OKUBO HIROSHI [JP]) [X] 1-12 * column A; figures 1-7; claims 1-18 * * column 1, line 60 - column 3, line 27 * * column 3, line 52 - column 7, line 19 *;
 [X]EP1574866  (TOKYO ELECTRON LTD [JP]) [X] 1-12 * column A; figures 1,2; claims 1-8 * * paragraphs [0006] - [0010] * * paragraphs [0012] - [0026] *;
 [PA]EP1939640  (TOKYO ELECTRON LTD [JP]) [PA] 1-12 * column A; figures 1-10; claims 1-8 * * paragraphs [0002] - [0004] * * paragraphs [0016] - [0048] *
by applicantJP2005005331
 JP2002139542
 JP3642456B
 US2004174177
 US6529011
 EP1574866
 EP1939640
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.