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EP1990103
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EP About this file: EP1990103
| EP1990103 - Process for wafer backside polymer removal and wafer front side photoresist removal [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 29.04.2011 Database last updated on 22.05.2024 | Most recent event Tooltip | 29.04.2011 | Application deemed to be withdrawn | published on 01.06.2011 [2011/22] | Applicant(s) | For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, CA 95054 / US | [N/P] |
| Former [2008/46] | For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, CA 95054 / US | Inventor(s) | 01 /
Collins, Kenneth S. 7214 Glenview Drive San Jose, CA 95120 / US | 02 /
Hanawa, Hiroji 696 Spruce Drive Sunnyvale, CA 94086 / US | 03 /
Nguyen, Andrew 3148 Hostetter Road San Jose, CA 95132 / US | 04 /
Rauf, Shahid 6167 Corte Padre Pleasanton, CA 94566 / US | 05 /
Balakrishna, Ajit 555 E. Washington Avenue No. 301 Sunnyvale, CA 94086 / US | 06 /
Todorow, Valentin N. 2473 Emerson Street Palo Alto, CA 94301 / US | 07 /
Ramaswamy, Kartik 1646 Tawnygate Way San Jose, CA 95124 / US | 08 /
Salinas, Martin J. 591 N. Clover Avenue San Jose, CA 95128 / US | 09 /
Yousif, Imad 2103 Wendover Lane San Jose, CA 95121 / US | 10 /
Merry, Walter R. 982 West Iowa Avenue Sunnyvale, CA 94086 / US | 11 /
Rui, Ying 896 Coolidge Avenue Sunnyvale, CA 94086 / US | 12 /
Rice, Michael R. 1025 Via Di Salerno Pleasanton, CA 94566 / US | [2008/46] | Representative(s) | Zimmermann & Partner Patentanwälte mbB Postfach 330 920 80069 München / DE | [N/P] |
| Former [2008/46] | Zimmermann & Partner Isartorplatz 1 80331 München / DE | Application number, filing date | 08155806.6 | 07.05.2008 | [2008/46] | Priority number, date | US20070801409 | 08.05.2007 Original published format: US 801409 | [2008/46] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1990103 | Date: | 12.11.2008 | Language: | EN | [2008/46] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.09.2008 | Classification | IPC: | B08B7/00, H01J37/32, H01L21/00 | [2008/46] | CPC: |
B08B7/00 (EP,US);
H01L21/3065 (KR);
B08B7/0035 (EP,US);
H01J37/32357 (EP,US);
H01J37/3244 (EP,US);
H01L21/0206 (EP,US);
H01L21/02063 (EP,US);
H01L21/0209 (EP,US);
H01L21/304 (KR);
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2008/46] | Title | German: | Verfahren für Wafer-Rückseitenpolymerentfernung mithilfe einer Wafer-Voderseiten-Fotolackentfernung | [2008/46] | English: | Process for wafer backside polymer removal and wafer front side photoresist removal | [2008/46] | French: | Procédé pour l'élimination de polymère sur l'envers d'une tranche et suppression photosensible sur l'endroit de la tranche | [2008/46] | Examination procedure | 05.11.2008 | Examination requested [2009/16] | 01.12.2010 | Application deemed to be withdrawn, date of legal effect [2011/22] | 07.01.2011 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2011/22] | Fees paid | Penalty fee | Additional fee for renewal fee | 31.05.2010 | 03 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4892753 (WANG DAVID N [US], et al) [A] 1-15* claims 1,5 *; | [A]EP0488393 (TOKYO ELECTRON LTD [JP]) [A] 1-15 * figure 2; claim 1 *; | [A]US5858878 (TODA AKIHITO [JP]) [A] 1-15 * figure 2 * |