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Extract from the Register of European Patents

EP About this file: EP2009681

EP2009681 - Methods for high temperature etching a high-k material gate structure [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  08.07.2011
Database last updated on 19.10.2024
Most recent event   Tooltip08.07.2011Application deemed to be withdrawnpublished on 10.08.2011  [2011/32]
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, CA 95054 / US
[N/P]
Former [2009/01]For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, CA 95054 / US
Inventor(s)01 / Liu, Wei
5035 Moorpark Avenue
San Jose, CA 95129 / US
02 / Matsusue, Ellchi
Toriasu 202 2-20-04 Misatodai Narit
Chiba 286-0013 / JP
03 / Shen, Meihua
694 Perry Common
Fremont, CA 94539 / US
04 / Deshmukh, Shashank
2168 Pettigrew Drive
San Jose, CA 95148 / US
05 / Kawase, Yohei
4-1C-610 Yukarigaoka Sakura-shi
Chiba 285-0858 / JP
06 / Phan, Anh-Kiet Quang
1288 Trestlewood Lane
San Jose, CA 95138 / US
07 / Palagashvili, David
49 Showers Drive K431
Mountain View, CA 94040 / US
08 / Willwerth, Michael D.
3847 Rincon Avenue
Campbell, CA 95008 / US
09 / Shin, Jong I.
3585 Agate Court
Santa Clara, CA 95051 / US
10 / Finch, Barrett
246 Bieber Drive
San Jose, CA 95123 / US
 [2009/01]
Representative(s)Peterreins, Frank
Fish & Richardson P.C.
Highlight Business Towers
Mies-van-der-Rohe-Strasse 8
80807 München / DE
[N/P]
Former [2009/01]Peterreins, Frank
Fish & Richardson P.C. Highlight BusinessTowers Mies-van-der-Rohe-Strasse 8
80807 München / DE
Application number, filing date08158919.425.06.2008
[2009/01]
Priority number, dateUS20070946581P27.06.2007         Original published format: US 946581 P
US20070987159P12.11.2007         Original published format: US 987159 P
[2009/01]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2009681
Date:31.12.2008
Language:EN
[2009/01]
Type: A3 Search report 
No.:EP2009681
Date:28.07.2010
[2010/30]
Search report(s)(Supplementary) European search report - dispatched on:EP30.06.2010
ClassificationIPC:H01L21/311, H01L21/3213
[2010/30]
CPC:
H01L21/31116 (EP,US); H01L21/3065 (KR,US); H01L21/31122 (EP,US);
H01L21/32137 (EP,US); H01L29/40117 (EP,US)
Former IPC [2009/01]H01L21/311
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2009/01]
TitleGerman:Verfahren zum Hochtemperaturätzen einer Gatestruktur aus Material mit hoher Dielektrizitätskonstante[2009/01]
English:Methods for high temperature etching a high-k material gate structure[2009/01]
French:Procédés de gravure à haute température d'une structure de porte en matériel K élevé[2009/01]
Examination procedure21.10.2008Examination requested  [2009/01]
04.01.2011Application deemed to be withdrawn, date of legal effect  [2011/32]
15.03.2011Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2011/32]
Fees paidPenalty fee
Additional fee for renewal fee
30.06.201003   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XI]US5776356  (YOKOYAMA SEIICHI [JP], et al);
 [A]US5863839  (OLSON DALE A [US], et al);
 [A]US2005095783  (HASELDEN BARBARA A [US], et al);
 [XA]US2006252265  (JIN GUANGXIANG [US], et al);
 [XAI]US2007026611  (SAITO GO [JP], et al);
 [XAI]US2007042601  (WANG XIKUN [US], et al)
by applicantUS2004198069
 US6806095
 US2007224813
 US2007249182
 US20070948376
 US20070777259
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.