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Extract from the Register of European Patents

EP About this file: EP2061072

EP2061072 - Flip chip wafer, flip chip die and manufacturing processes thereof [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  28.06.2013
Database last updated on 24.04.2024
Most recent event   Tooltip28.06.2013Application deemed to be withdrawnpublished on 31.07.2013  [2013/31]
Applicant(s)For all designated states
Biotronik CRM Patent AG
Neuhofstrasse 4
6341 Baar / CH
[N/P]
Former [2009/21]For all designated states
BIOTRONIK CRM Patent AG
Neuhofstrasse 4
6341 Baar / CH
Inventor(s)01 / Chen, Singjang
11127 SW Partridge Loop
Beaverton, OR 97007 / US
 [2009/21]
Representative(s)Lindner-Vogt, Karin L.
Biotronik SE & Co. KG
Woermannkehre 1
12359 Berlin / DE
[N/P]
Former [2009/21]Lindner-Vogt, Karin L.
Biotronik GmbH & Co. KG Corporate Intellectual Properties Woehrmannkehre 1
12359 Berlin / DE
Application number, filing date08167131.521.10.2008
[2009/21]
Priority number, dateUS2007094048115.11.2007         Original published format: US 940481
[2009/21]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2061072
Date:20.05.2009
Language:EN
[2009/21]
Type: A3 Search report 
No.:EP2061072
Date:11.07.2012
Language:EN
[2012/28]
Search report(s)(Supplementary) European search report - dispatched on:EP08.06.2012
ClassificationIPC:H01L21/60
[2009/21]
CPC:
H01L24/94 (EP,US); H01L21/563 (EP,US); H01L23/293 (EP,US);
H01L24/11 (EP,US); H01L24/27 (EP,US); H01L24/73 (EP,US);
H01L2224/023 (EP); H01L2224/0401 (EP,US); H01L2224/05572 (EP,US);
H01L2224/1132 (EP,US); H01L2224/1146 (EP,US); H01L2224/1147 (EP,US);
H01L2224/1148 (EP,US); H01L2224/1162 (EP,US); H01L2224/11849 (EP,US);
H01L2224/11901 (EP,US); H01L2224/13022 (EP,US); H01L2224/131 (EP,US);
H01L2224/16 (EP,US); H01L2224/274 (EP,US); H01L2224/27515 (EP,US);
H01L2224/27901 (EP,US); H01L2224/29011 (EP,US); H01L2224/29082 (EP,US);
H01L2224/29187 (EP,US); H01L2224/73104 (EP,US); H01L2224/73203 (EP,US);
H01L2224/94 (EP,US); H01L23/3171 (EP,US); H01L23/3192 (EP,US);
H01L2924/00013 (EP,US); H01L2924/0002 (EP,US); H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US);
H01L2924/01075 (EP,US); H01L2924/01078 (EP,US); H01L2924/01082 (EP,US);
H01L2924/014 (EP,US); H01L2924/12042 (EP,US); H01L2924/14 (EP,US);
H01L2924/1461 (EP,US); H01L2924/30105 (EP,US); H01L2924/30107 (EP,US) (-)
C-Set:
H01L2224/023, H01L2924/0001 (EP);
H01L2224/1146, H01L2924/00014 (US,EP);
H01L2224/131, H01L2924/01014 (US,EP);
H01L2224/29187, H01L2924/0665 (US,EP);
H01L2924/00013, H01L2224/29099 (US,EP);
H01L2924/0002, H01L2224/05552 (EP,US);
H01L2924/12042, H01L2924/00 (EP,US);
H01L2924/1461, H01L2924/00 (EP,US)
(-)
Designated contracting states(deleted) [2013/12]
Former [2009/21]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Flipchip-Wafer, Flipchip und Herstellungsverfahren[2009/21]
English:Flip chip wafer, flip chip die and manufacturing processes thereof[2009/21]
French:Plaquette à puce à protubérances ("flip-chip"), puce à protubérances et leurs procédés de fabrication[2009/21]
Examination procedure12.01.2013Application deemed to be withdrawn, date of legal effect  [2013/31]
25.02.2013Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time  [2013/31]
Fees paidRenewal fee
25.10.2010Renewal fee patent year 03
27.09.2011Renewal fee patent year 04
26.09.2012Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]US5641113  (SOMAKI MOTOAKI [JP], et al) [X] 1-6,10-13 * column 2, line 31 - column 8, line 44; figures 2A-2E,4A-4d * * column 9, line 47 - line 50 *;
 [X]JP2000228417  (SONY CORP) [X] 1-6,10-13 * abstract * * paragraphs [0009] - [0013] - [0025] - [0028] - [0033] - [0036] - [0047] , [0054] , [0074] , [0076]; figures 1,2,7,8,11 *;
 [X]US6271107  (MASSINGILL THOMAS [US], et al) [X] 7,9,12 * column 3, line 21 - line 30; figures 1-5 * * column 3, line 65 - column 4, line 4 * * column 4, line 43 - line 46 * * column 5, line 57 - line 60 * * column 5, line 64 - column 6, line 27 * * column 6, line 57 - line 60 * * column 7, line 10 - line 16 * * column 8, lines 13-35,36-41 *;
 [A]US2002064935  (HONDA HIROKAZU [JP]) [A] 1-6,10-13 * paragraphs [0021] , [0045] - [0060]; figures 2O-2S,3A-3F *;
 [X]US6458622  (KESER LIZABETH ANN [US], et al) [X] 7,8,12 * column 4, line 56 - line 58; figures 8,9 ** column 6, lines 28-35,38-41 *;
 [A]US2005224962  (AKAMATSU TETSUYA [JP], et al) [A] 1-6,10-13 * paragraphs [0060] - [0083]; figures 7-12 *
by applicant   - Q. TONG ET AL., "Recent advances on waver-level flip chip packaging process", ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, (2000), page 101, XP001054550
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.