blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
FAQ - Register Alert
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP2197025

EP2197025 - Method for manufacturing a power semiconductor device [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  02.03.2012
Database last updated on 02.09.2024
Most recent event   Tooltip04.10.2013Lapse of the patent in a contracting state
New state(s): HU		published on 06.11.2013  [2013/45]
Applicant(s)For all designated states
ABB Technology AG
Affolternstrasse 44
8050 Zürich / CH
[N/P]
Former [2010/24]For all designated states
ABB Technology AG
Affolternstrasse 44
8050 Zürich / CH
Inventor(s)01 / Kopta, Arnost
Uetliberghalde 5
CH-8045, Zürich / CH
02 / Rahimo, Munaf
Bachweg 10
CH-5619, Uezwil / CH
 [2010/24]
Representative(s)ABB Patent Attorneys
C/o ABB Schweiz AG
Intellectual Property CH-IP
Brown Boveri Strasse 6
5400 Baden / CH
[N/P]
Former [2010/24]ABB Patent Attorneys
C/o ABB Schweiz AG Intellectual Property (CH-LC/IP) Brown Boveri Strasse 6
5400 Baden / CH
Application number, filing date08171450.312.12.2008
[2010/24]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2197025
Date:16.06.2010
Language:EN
[2010/24]
Type: B1 Patent specification 
No.:EP2197025
Date:27.04.2011
Language:EN
[2011/17]
Search report(s)(Supplementary) European search report - dispatched on:EP05.03.2009
ClassificationIPC:H01L21/331, H01L21/336, H01L29/739, H01L29/78
[2010/24]
CPC:
H01L29/7802 (EP,US); H01L29/0878 (EP,US); H01L29/1095 (EP,US);
H01L29/66333 (EP,US); H01L29/66712 (EP,US); H01L29/7395 (EP,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2010/24]
TitleGerman:Herstellungsverfahren eines Leistungshalbleiterbauelements[2010/24]
English:Method for manufacturing a power semiconductor device[2010/24]
French:Méthode de fabrication d'un dispositif semi-conducteur de puissance[2010/24]
Examination procedure18.11.2009Amendment by applicant (claims and/or description)
18.11.2009Examination requested  [2010/24]
23.12.2010Communication of intention to grant the patent
25.02.2011Fee for grant paid
25.02.2011Fee for publishing/printing paid
Opposition(s)30.01.2012No opposition filed within time limit [2012/14]
Fees paidRenewal fee
23.12.2010Renewal fee patent year 03
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HR27.04.2011
HU27.04.2011
IT27.04.2011
LT27.04.2011
LV27.04.2011
MT27.04.2011
NL27.04.2011
PL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
TR27.04.2011
BG27.07.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
IE12.12.2011
LU12.12.2011
MC31.12.2011
[2013/45]
Former [2013/44]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HR27.04.2011
IT27.04.2011
LT27.04.2011
LV27.04.2011
MT27.04.2011
NL27.04.2011
PL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
TR27.04.2011
BG27.07.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
IE12.12.2011
LU12.12.2011
MC31.12.2011
Former [2013/29]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HR27.04.2011
IT27.04.2011
LT27.04.2011
LV27.04.2011
MT27.04.2011
NL27.04.2011
PL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
BG27.07.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
IE12.12.2011
LU12.12.2011
MC31.12.2011
Former [2013/25]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HR27.04.2011
IT27.04.2011
LT27.04.2011
LV27.04.2011
MT27.04.2011
NL27.04.2011
PL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
IE12.12.2011
LU12.12.2011
MC31.12.2011
Former [2013/14]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HR27.04.2011
IT27.04.2011
LT27.04.2011
LV27.04.2011
MT27.04.2011
NL27.04.2011
PL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
IE12.12.2011
MC31.12.2011
Former [2012/47]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HR27.04.2011
IT27.04.2011
LT27.04.2011
LV27.04.2011
NL27.04.2011
PL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
IE12.12.2011
MC31.12.2011
Former [2012/34]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HR27.04.2011
IT27.04.2011
LT27.04.2011
LV27.04.2011
NL27.04.2011
PL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
MC31.12.2011
Former [2012/24]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HR27.04.2011
IT27.04.2011
LT27.04.2011
LV27.04.2011
NL27.04.2011
PL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
Former [2012/13]AT27.04.2011
BE27.04.2011
CY27.04.2011
CZ27.04.2011
DK27.04.2011
EE27.04.2011
FI27.04.2011
HR27.04.2011
LT27.04.2011
LV27.04.2011
NL27.04.2011
PL27.04.2011
RO27.04.2011
SE27.04.2011
SI27.04.2011
SK27.04.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
Former [2012/01]AT27.04.2011
BE27.04.2011
CY27.04.2011
FI27.04.2011
HR27.04.2011
LT27.04.2011
LV27.04.2011
NL27.04.2011
SE27.04.2011
SI27.04.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
PL26.09.2011
Former [2011/52]AT27.04.2011
CY27.04.2011
FI27.04.2011
HR27.04.2011
LT27.04.2011
LV27.04.2011
SE27.04.2011
SI27.04.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
PL26.09.2011
Former [2011/50]CY27.04.2011
FI27.04.2011
HR27.04.2011
LT27.04.2011
LV27.04.2011
SE27.04.2011
SI27.04.2011
NO27.07.2011
GR28.07.2011
IS27.08.2011
PT29.08.2011
PL26.09.2011
Former [2011/49]CY27.04.2011
FI27.04.2011
HR27.04.2011
LT27.04.2011
SE27.04.2011
NO27.07.2011
GR28.07.2011
PT29.08.2011
Former [2011/48]LT27.04.2011
SE27.04.2011
NO27.07.2011
PT29.08.2011
Former [2011/47]LT27.04.2011
NO27.07.2011
PT29.08.2011
Documents cited:Search[A]JPH03205832  (HITACHI LTD, et al) [A] 1-8 * English lang. Abs. and corresponding figure *;
 [DA]EP0837508  (HITACHI LTD [JP]) [DA] 1-8 * Fig.14 and corresponding text *;
 [A]US2004065934  (SRIDEVAN SRIKANT [US], et al) [A] 1-8* Figure 5 and corresponding text *
by applicantEP0837508
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.