EP1953183 - Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 11.07.2014 Database last updated on 31.08.2024 | Most recent event Tooltip | 11.07.2014 | No opposition filed within time limit | published on 13.08.2014 [2014/33] | Applicant(s) | For all designated states Shin-Etsu Chemical Co., Ltd. 6-1, Ohtemachi 2-chome, Chiyoda-ku Tokyo / JP | [2008/32] | Inventor(s) | 01 /
Kato, Hideto, c/o Shin-Etsu Chemical Co. Ltd. 28-1, Nishi Fukushima Kubiki-ku Joetsu-shi, Niigata-ken / JP | 02 /
Asai, Satoshi, c/o Shin-Etsu Chemical Co. Ltd. 28-1, Nishi Fukushima Kubiki-ku Joetsu-shi, Niigata-ken / JP | [2013/36] |
Former [2008/32] | 01 /
Kato, Hideto, c/o Shin-Etsu Chemical Co. Ltd. 28-1, Nishi Fukushima, Kubiki-ku Joetsu-shi, Niigata-ken / JP | ||
02 /
Asai, Satoshi, c/o Shin-Etsu Chemical Co. Ltd. 28-1, Nishi Fukushima, Kubiki-ku Joetsu-shi, Niigata-ken / JP | Representative(s) | Stoner, Gerard Patrick, et al Mewburn Ellis LLP City Tower 40 Basinghall Street London EC2V 5DE / GB | [N/P] |
Former [2013/36] | Stoner, Gerard Patrick, et al Mewburn Ellis LLP 33 Gutter Lane London EC2V 8AS / GB | ||
Former [2008/32] | Stoner, Gerard Patrick, et al Mewburn Ellis LLP York House 23 Kingsway London WC2B 6HP / GB | Application number, filing date | 08250362.4 | 30.01.2008 | [2008/32] | Priority number, date | JP20070021023 | 31.01.2007 Original published format: JP 2007021023 | [2008/32] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1953183 | Date: | 06.08.2008 | Language: | EN | [2008/32] | Type: | A3 Search report | No.: | EP1953183 | Date: | 19.11.2008 | [2008/47] | Type: | B1 Patent specification | No.: | EP1953183 | Date: | 04.09.2013 | Language: | EN | [2013/36] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 22.10.2008 | Classification | IPC: | C08G77/60, C08J5/18, C08J7/04, C08L83/16, C09D183/16, G03F7/075, H01L21/312 | [2008/47] | CPC: |
C08G77/52 (EP,KR,US);
H01L21/02126 (EP,US);
C08G77/60 (EP,KR,US);
C09D183/14 (EP,KR,US);
C09D183/16 (EP,KR,US);
G03F7/0043 (KR);
G03F7/0045 (KR);
G03F7/0757 (EP,KR,US);
H01L21/02282 (EP,US);
H01L21/312 (US);
H01L21/02107 (KR);
Y10S430/106 (EP,KR,US);
|
Former IPC [2008/32] | C08G77/00 | Designated contracting states | DE, FR, GB [2009/30] |
Former [2008/32] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR | Title | German: | Silphenylenhaltiges Polymer, lichthärtbare Harzzusammensetzung, Musterungsverfahren und Substratschaltungsschutzfilm | [2008/32] | English: | Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film | [2008/32] | French: | Polymère portant du silphénylène, composition de résine photodurcissable, procédé de formation de motif, et film de protection de circuit de substrat | [2008/32] | Examination procedure | 05.03.2009 | Examination requested [2009/16] | 20.05.2009 | Loss of particular rights, legal effect: designated state(s) | 25.06.2009 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR | 01.03.2013 | Communication of intention to grant the patent | 23.04.2013 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 15.05.2013 | Communication of intention to grant the patent | 24.07.2013 | Fee for grant paid | 24.07.2013 | Fee for publishing/printing paid | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 01.03.2013 | Opposition(s) | 05.06.2014 | No opposition filed within time limit [2014/33] | Fees paid | Renewal fee | 13.01.2010 | Renewal fee patent year 03 | 14.01.2011 | Renewal fee patent year 04 | 11.01.2012 | Renewal fee patent year 05 | 10.01.2013 | Renewal fee patent year 06 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4990546 (ECKBERG RICHARD P [US]) [A] 1-4 * example 1 *; | [A]US6072016 (KOBAYASHI HIDEKI [JP], et al) [A] 1-4* the whole document * | by applicant | US3159601 | US3159662 | US3220972 | US3775452 | JPS49115541 | JPS54145794 | JPS5545746 | JPH0146862B | JPH03209478 | JPH10265571 | JPH10274850 | JPH1165107 | JP2001335619 | JP2002088158 | JP2002293877 | US6590010 |