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EP2172304
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EP About this file: EP2172304
| EP2172304 - POLISHING APPARATUS [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 15.07.2011 Database last updated on 19.10.2024 | Most recent event Tooltip | 15.07.2011 | Withdrawal of application | published on 17.08.2011 [2011/33] | Applicant(s) | For all designated states EBARA CORPORATION 11-1, Haneda Asahi-cho Ohta-ku Tokyo 144-8510 / JP | [2010/14] | Inventor(s) | 01 /
TAKAHASHI, Tamami c/o Ebara Corporation 11-1 Haneda Asahi-cho Ohta-ku Tokyo 144-8510 / JP | 02 /
ITO, Kenya c/o Ebara Corporation 11-1 Haneda Asahi-cho Ohta-ku Tokyo 144-8510 / JP | 03 /
KUSA, Hiroaki c/o Ebara Corporation 11-1 Haneda Asahi-cho Ohta-ku Tokyo 144-8510 / JP | 04 /
SEKI, Masaya c/o Ebara Corporation 11-1 Haneda Asahi-cho Ohta-ku Tokyo 144-8510 / JP | [2010/14] | Representative(s) | Carstens, Dirk Wilhelm Wagner & Geyer Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstraße 5 80538 München / DE | [N/P] |
| Former [2010/14] | Carstens, Dirk Wilhelm Wagner & Geyer Gewürzmühlstrasse 5 80538 München / DE | Application number, filing date | 08778124.1 | 08.07.2008 | [2010/14] | WO2008JP62653 | Priority number, date | JP20070181616 | 11.07.2007 Original published format: JP 2007181616 | [2010/14] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2009008531 | Date: | 15.01.2009 | Language: | JA | [2009/03] | Type: | A1 Application with search report | No.: | EP2172304 | Date: | 07.04.2010 | Language: | EN | [2010/14] | Search report(s) | International search report - published on: | JP | 15.01.2009 | Classification | IPC: | B24B21/08, B24B9/00, B24B21/16, H01L21/304 | [2010/14] | CPC: |
B24B21/002 (EP,US);
B24B9/065 (EP,US);
H01L21/02021 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2010/14] | Title | German: | POLIERVORRICHTUNG | [2010/14] | English: | POLISHING APPARATUS | [2010/14] | French: | APPAREIL DE POLISSAGE | [2010/14] | Entry into regional phase | 11.01.2010 | Translation filed | 11.01.2010 | National basic fee paid | 11.01.2010 | Search fee paid | 11.01.2010 | Designation fee(s) paid | 11.01.2010 | Examination fee paid | Examination procedure | 11.01.2010 | Examination requested [2010/14] | 04.07.2011 | Application withdrawn by applicant [2011/33] | Fees paid | Renewal fee | 18.05.2010 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [YA]JPH1199459 (SANSHIN KK) [Y] 1, 3-4, 9 * , Par. No. [0019]; Fig. 6 (Family: none) * [A] 2, 5-8; | [YA]JP2003163188 (TOSHIBA CORP) [Y] 1, 3-4, 9 * , Par. Nos. [0048] to [0066] ; Fig. 21 & US 2003/0139049 A1 & TW 225273 B & KR 2003-43697 A & CN 1421903 A * [A] 2, 5-8; | [YA]WO2006041196 (TOSHIBA KK [JP], et al) [Y] 1, 3-4, 9 * , Page 12, line 24 to page 13, line 7; Fig. 11 & JP 2008-518792 A * [A] 2, 5-8; | [A]JP2007152471 (HITACHI CHEMICAL CO LTD) [A] 1-9* , Full text; all drawings (Family: none) * |