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EP2239085
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EP About this file: EP2239085
| EP2239085 - METHOD FOR CHAMFERING/MACHINING BRITTLE MATERIAL SUBSTRATE AND CHAMFERING/MACHINING APPARATUS [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 10.11.2017 Database last updated on 28.05.2024 | |
| Former | Request for examination was made Status updated on 19.07.2017 | Most recent event Tooltip | 10.11.2017 | Application deemed to be withdrawn | published on 13.12.2017 [2017/50] | Applicant(s) | For all designated states Mitsuboshi Diamond Industrial Co., Ltd. 2-12-12, Minami-Kaneden Suita-city Osaka 564-0044 / JP | [N/P] |
| Former [2010/41] | For all designated states Mitsuboshi Diamond Industrial Co., Ltd. 2-12-12 Minami-Kaneden Suita-city, Osaka 564-0044 / JP | Inventor(s) | 01 /
KUMATANI, Issei c/o MITSUBOSHI DIAMOND INDUSTRIAL CO. LTD. 2-12-12 Minami-Kaneden Suita-city Osaka 564-0044 / JP | 02 /
SUNATA, Tomihisa c/o MITSUBOSHI DIAMOND INDUSTRIAL CO. LTD. 2-12-12 Minami-Kaneden Suita-city Osaka 564-0044 / JP | 03 /
SHIMIZU, Seiji c/o MITSUBOSHI DIAMOND INDUSTRIAL CO. LTD. 2-12-12 Minami-Kaneden Suita-city Osaka 564-0044 / JP | [2010/41] | Representative(s) | TBK Bavariaring 4-6 80336 München / DE | [N/P] |
| Former [2010/41] | TBK-Patent Bavariaring 4-6 80336 München / DE | Application number, filing date | 08862224.6 | 11.12.2008 | [2010/41] | WO2008JP72471 | Priority number, date | JP20070327599 | 19.12.2007 Original published format: JP 2007327599 | [2010/41] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2009078324 | Date: | 25.06.2009 | Language: | JA | [2009/26] | Type: | A1 Application with search report | No.: | EP2239085 | Date: | 13.10.2010 | Language: | EN | [2010/41] | Search report(s) | International search report - published on: | JP | 25.06.2009 | (Supplementary) European search report - dispatched on: | EP | 16.11.2016 | Classification | IPC: | B23K26/06, B23K26/08, B23K26/36, B28D5/00, C03B29/08 | [2010/41] | CPC: |
B28D5/00 (EP);
B23K26/40 (EP,KR);
B23K26/082 (EP);
B23K26/0821 (EP,KR);
B23K2101/40 (EP,KR);
B23K2103/50 (EP,KR)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2010/41] | Title | German: | VERFAHREN ZUM ABFASEN/BEARBEITEN EINES SUBSTRATS AUS SPRÖDEM MATERIAL UND ABFAS-/BEARBEITUNGSVORRICHTUNG | [2010/41] | English: | METHOD FOR CHAMFERING/MACHINING BRITTLE MATERIAL SUBSTRATE AND CHAMFERING/MACHINING APPARATUS | [2010/41] | French: | PROCÉDÉ POUR CHANFREINER/USINER UN SUBSTRAT EN MATÉRIAU CASSANT ET APPAREIL DE BISEAUTAGE/USINAGE | [2010/41] | Entry into regional phase | 15.07.2010 | Translation filed | 15.07.2010 | National basic fee paid | 15.07.2010 | Search fee paid | 15.07.2010 | Designation fee(s) paid | 15.07.2010 | Examination fee paid | Examination procedure | 15.07.2010 | Examination requested [2010/41] | 13.06.2017 | Application deemed to be withdrawn, date of legal effect [2017/50] | 20.07.2017 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2017/50] | Fees paid | Renewal fee | 29.12.2010 | Renewal fee patent year 03 | 30.12.2011 | Renewal fee patent year 04 | 27.12.2012 | Renewal fee patent year 05 | 19.12.2013 | Renewal fee patent year 06 | 23.12.2014 | Renewal fee patent year 07 | 29.12.2015 | Renewal fee patent year 08 | 29.12.2016 | Renewal fee patent year 09 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]WO9951386 (AVERY DENNISON CORP [US], et al) [X] 5-12 * page 20, line 7 - line 24; figure 6D * [I] 1-4; | [XI]JP2005178288 (SHIBUYA KOGYO CO LTD, et al) [X] 5-12 * abstract * [I] 1-4; | [X]JP2007021558 (SEIKO EPSON CORP) [X] 1-12 * abstract * | International search | [A]JP2007245235 (SHIBAURA MECHATRONICS CORP); | [A]JP2007319881 (SEIKO EPSON CORP) |