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EP2105975

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EP About this file: EP2105975

EP2105975 - Resin sheet for encapsulating optical semiconductor element and optical semiconductor device [Right-click to bookmark this link]
Status	The application has been withdrawn Status updated on 17.06.2016 Database last updated on 03.10.2024
Most recent event Tooltip	17.06.2016	Withdrawal of application	published on 20.07.2016 [2016/29]
Applicant(s)	For all designated states NITTO DENKO CORPORATION 1-2, Shimohozumi 1-chome Ibaraki-shi Osaka / JP
	[2009/40]
Inventor(s)	01 / Suehiro, Ichiro c/o Nitto Denko Corporation 1-2 Shimohozumi 1-chome Ibaraki-shi Osaka / JP
	02 / Akazawa, Kouji c/o Nitto Denko Corporation 1-2 Shimohozumi 1-chome Ibaraki-shi Osaka / JP
	03 / Usui, Hideyuki c/o Nitto Denko Corporation 1-2 Shimohozumi 1-chome Ibaraki-shi Osaka / JP
	[2009/40]
Representative(s)	Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstrasse 4 80802 München / DE
	[N/P]
Former [2009/40]	Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät Leopoldstrasse 4 80802 München / DE
Application number, filing date	09004125.2	23.03.2009
	[2009/40]
Priority number, date	JP20080078352	25.03.2008 Original published format: JP 2008078352
	[2009/40]
Filing language	EN
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	EP2105975
	Date:	30.09.2009
	Language:	EN
	[2009/40]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	27.07.2009
Classification	IPC:	H01L33/00, H01L21/56	[2009/40]
	CPC:	H01L21/561 (EP,US); H01L24/97 (EP,US); H01L33/483 (EP,US); H01L33/52 (EP,US); H01L2224/48091 (EP,US); H01L2224/49107 (EP,US); (+) H01L2224/73265 (EP,US); H01L2924/12041 (EP,US); H01L2924/181 (EP,US); H01L33/44 (EP,US); Y10T428/24851 (EP,US) (-)
	C-Set:	H01L2224/48091, H01L2924/00014 (EP,US); H01L2924/12041, H01L2924/00 (US,EP); H01L2924/181, H01L2924/00012 (US,EP)
Designated contracting states	DE, FR, GB, IT [2010/22]
Former [2009/40]	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR
Title	German:	Harzfolie zur Verkapselung optischer Halbleiterelemente und optisches Halbleiterbauelement	[2009/40]
	English:	Resin sheet for encapsulating optical semiconductor element and optical semiconductor device	[2009/40]
	French:	Feuille de résine pour encapsuler un élément optique semi-conducteur et dispositif semi-conducteur optique	[2009/40]
Examination procedure	17.12.2009	Amendment by applicant (claims and/or description)
	22.12.2009	Examination requested [2010/06]
	31.03.2010	Loss of particular rights, legal effect: designated state(s)
	06.05.2010	Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HR, HU, IE, IS, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR
	02.06.2016	Application withdrawn by applicant [2016/29]
Fees paid	Renewal fee
	30.03.2011	Renewal fee patent year 03
	28.03.2012	Renewal fee patent year 04
	26.03.2013	Renewal fee patent year 05
	27.03.2014	Renewal fee patent year 06
	27.03.2015	Renewal fee patent year 07
	29.03.2016	Renewal fee patent year 08
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[X]US2006157722 (TAKEZAWA HATSUO [JP], et al) [X] 1-4 * paragraph [0036] - paragraph [0107]; figures 1-16 *;
		[A]WO2007139098 (SANYO ELECTRIC CO [JP], et al) [A] 1-4 * paragraph [0026] - paragraph [0068]; figures 1,5-9 *;
		[PA]EP2023413 (SANYO ELECTRIC CO [JP], et al) [PA] 1-4 * paragraph [0026] - paragraph [0068]; figures 1,5-9 *;
		[A]US2004145044 (SUGAYA YASUHIRO [JP], et al) [A] 1-4 * paragraph [0048] - paragraph [0070]; figures 1,2 *;
		[A]EP0684648 (SHARP KK [JP]) [A] 1-4 * column 11, line 29 - column 29, line 49; figures 1-24 *;
		[A]US2004160750 (MASUKO SHINGO [JP]) [A] 1-4 * paragraph [0031] - paragraph [0057]; figures 3-11 *;
		[A]US2002187570 (FUKASAWA KOICHI [JP], et al) [A] 1-4 * paragraph [0014] - paragraph [0018]; figures 1-5 *;
		[A]EP1538681 (NITTO DENKO CORP [JP]) [A] 1-4 * paragraph [0042] - paragraph [0057]; figures 1-4 *
	by applicant	JP2005223216

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