blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP2110853

EP2110853 - Assembly in pressure contact with a high power semiconductor module [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  15.04.2016
Database last updated on 03.10.2024
Most recent event   Tooltip15.04.2016Withdrawal of applicationpublished on 18.05.2016  [2016/20]
Applicant(s)For all designated states
SEMIKRON Elektronik GmbH & Co. KG
Sigmundstrasse 200
90431 Nürnberg / DE
[2009/43]
Inventor(s)01 / Reusser, Lars
Rinningstrasse 4
96114 Hirschaid / DE
02 / Lederer, Marco
Kindingerstrasse 23
90453 Nürnberg / DE
 [2009/43]
Application number, filing date09005275.411.04.2009
[2009/43]
Priority number, dateDE2008101879315.04.2008         Original published format: DE102008018793
[2009/43]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP2110853
Date:21.10.2009
Language:DE
[2009/43]
Type: A3 Search report 
No.:EP2110853
Date:12.10.2011
Language:DE
[2011/41]
Search report(s)(Supplementary) European search report - dispatched on:EP08.09.2011
ClassificationIPC:H01L25/07
[2009/43]
CPC:
H01L23/48 (EP); H01L25/072 (EP); H01L2924/16195 (EP);
H01R13/2435 (EP)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2009/43]
Extension statesALNot yet paid
BANot yet paid
RSNot yet paid
TitleGerman:Anordnung in Druckkontaktausführung mit einem Leistungshalbleitermodul[2009/43]
English:Assembly in pressure contact with a high power semiconductor module[2009/43]
French:Agencement dans une conception de contact sous pression avec un module semi-conducteur de puissance[2009/43]
Examination procedure21.09.2011Examination requested  [2011/44]
09.11.2011Amendment by applicant (claims and/or description)
11.04.2016Application withdrawn by applicant  [2016/20]
Fees paidRenewal fee
11.02.2011Renewal fee patent year 03
06.03.2012Renewal fee patent year 04
02.05.2013Renewal fee patent year 05
30.04.2014Renewal fee patent year 06
30.04.2015Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[AD]DE10306643  (SEMIKRON ELEKTRONIK GMBH [DE]) [AD] 1-8 * the whole document * * paragraph [0019] - paragraph [0025]; figures 1,2 *;
 [A]DE10127947  (SEMIKRON ELEKTRONIK GMBH [DE]) [A] 1 * the whole document *
by applicantDE19630173
 DE19903875
 DE10306643
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.