blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP2148557

EP2148557 - Assembly with a semiconductor module and with a connection device [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  26.12.2014
Database last updated on 31.08.2024
Most recent event   Tooltip26.12.2014Application deemed to be withdrawnpublished on 28.01.2015  [2015/05]
Applicant(s)For all designated states
Semikron Elektronik GmbH & Co. KG Patentabteilung
Sigmundstrasse 200
90431 Nürnberg / DE
[2010/04]
Inventor(s)01 / Knebel, Markus
Hainstrasse 5
90587 Tuchenbach / DE
 [2010/04]
Application number, filing date09008702.403.07.2009
[2010/04]
Priority number, dateDE2008103446724.07.2008         Original published format: DE102008034467
[2010/04]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP2148557
Date:27.01.2010
Language:DE
[2010/04]
Type: A3 Search report 
No.:EP2148557
Date:22.01.2014
Language:DE
[2014/04]
Search report(s)(Supplementary) European search report - dispatched on:EP20.12.2013
ClassificationIPC:H05K7/10, H01L23/053, H01L23/538, H01L25/07
[2014/04]
CPC:
H01L23/02 (KR); H01L23/053 (EP); H01L23/48 (EP,KR);
H01L24/72 (EP); H01L25/072 (EP); H05K7/1069 (EP);
H01L23/3675 (EP); H01R13/2407 (EP) (-)
Former IPC [2010/04]H05K7/10
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2010/04]
Extension statesALNot yet paid
BANot yet paid
RSNot yet paid
TitleGerman:Anordnung mit einem Leistungshalbleitermodul und mit einer Verbindungseinrichtung[2010/04]
English:Assembly with a semiconductor module and with a connection device[2010/04]
French:Agencement doté d'un module semi-conducteur de puissance et d'un dispositif de connexion[2010/04]
Examination procedure23.07.2014Application deemed to be withdrawn, date of legal effect  [2015/05]
09.09.2014Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time  [2015/05]
Fees paidRenewal fee
22.06.2011Renewal fee patent year 03
31.07.2012Renewal fee patent year 04
31.07.2013Renewal fee patent year 05
Penalty fee
Additional fee for renewal fee
31.07.201406   M06   Not yet paid
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[AD]DE102006013078  (SEMIKRON ELEKTRONIK GMBH [DE]) [AD] 1 * paragraphs [0016] - [0024]; figure 1 *;
 [A]DE102006027482  (SEMIKRON ELEKTRONIK GMBH [DE]) [A] 1 * paragraphs [0022] - [0035]; figure 1 *;
 [AD]DE102004025609  (SEMIKRON ELEKTRONIK GMBH [DE]) [AD] 1 * paragraphs [0010] , [0021] , [0022]; figure 1 *;
 [AD]DE10355925  (SEMIKRON ELEKTRONIK GMBH [DE]) [AD] 1 * figure 1 *
by applicantDE102004025609
 DE10355925
 DE102006013078
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.