EP2149918 - Light emitting diode [Right-click to bookmark this link] | |||
Former [2010/05] | Improved bond pad design for enhancing light extraction from LED chips | ||
[2019/01] | Status | The application is deemed to be withdrawn Status updated on 20.09.2019 Database last updated on 13.07.2024 | |
Former | Grant of patent is intended Status updated on 16.12.2018 | ||
Former | Examination is in progress Status updated on 29.11.2016 | Most recent event Tooltip | 20.09.2019 | Application deemed to be withdrawn | published on 23.10.2019 [2019/43] | Applicant(s) | For all designated states Cree, Inc. 4600 Silicon Drive Durham, NC 27703 / US | [2010/05] | Inventor(s) | 01 /
Li, Ting 975 Jasper Avenue Ventura California, CA 93004 / US | [2010/05] | Representative(s) | Boult Wade Tennant LLP Salisbury Square House 8 Salisbury Square London EC4Y 8AP / GB | [N/P] |
Former [2014/02] | Boult Wade Tennant Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | ||
Former [2010/39] | Cross, Rupert Edward Blount, et al Boult Wade Tennant Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | ||
Former [2010/05] | South, Nicholas Geoffrey, et al A.A. Thornton & Co. 235 High Holborn London WC1V 7LE / GB | Application number, filing date | 09159460.6 | 05.05.2009 | [2010/05] | Priority number, date | US20080185031 | 01.08.2008 Original published format: US 185031 | [2010/05] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2149918 | Date: | 03.02.2010 | Language: | EN | [2010/05] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.12.2009 | Classification | IPC: | H01L33/38, // H01L33/20 | [2019/01] | CPC: |
H01L33/38 (EP,US);
H01L33/20 (EP,US)
|
Former IPC [2010/05] | H01L33/00 | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2010/05] | Title | German: | Lichtemittierende Diode | [2019/01] | English: | Light emitting diode | [2019/01] | French: | Diode électroluminescente | [2019/01] |
Former [2010/05] | Verbesserte Kontaktflächenanordnung zur erhöhten Lichtgewinnung aus LED-Chips | ||
Former [2010/05] | Improved bond pad design for enhancing light extraction from LED chips | ||
Former [2010/05] | Conception améliorée de plots de connexion pour améliorer l'extraction de lumière de puces de diodes DEL | Examination procedure | 30.07.2010 | Examination requested [2010/36] | 20.08.2010 | Despatch of a communication from the examining division (Time limit: M04) | 29.12.2010 | Reply to a communication from the examining division | 10.02.2016 | Despatch of a communication from the examining division (Time limit: M06) | 25.11.2016 | Reply to a communication from the examining division | 27.11.2018 | Cancellation of oral proceeding that was planned for 30.11.2018 | 30.11.2018 | Date of oral proceedings (cancelled) | 17.12.2018 | Communication of intention to grant the patent | 30.04.2019 | Application deemed to be withdrawn, date of legal effect [2019/43] | 05.06.2019 | Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2019/43] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 20.08.2010 | Request for further processing for: | The application is deemed to be withdrawn due to failure to reply to the examination report | 25.11.2016 | Request for further processing filed | 25.11.2016 | Full payment received (date of receipt of payment) Request granted | 07.12.2016 | Decision despatched | Fees paid | Renewal fee | 11.05.2011 | Renewal fee patent year 03 | 29.03.2012 | Renewal fee patent year 04 | 10.05.2013 | Renewal fee patent year 05 | 31.03.2014 | Renewal fee patent year 06 | 12.05.2015 | Renewal fee patent year 07 | 10.05.2016 | Renewal fee patent year 08 | 10.05.2017 | Renewal fee patent year 09 | 11.05.2018 | Renewal fee patent year 10 | 15.05.2019 | Renewal fee patent year 11 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]DE2755433 (LICENTIA GMBH) [A] 1-15* the whole document *; | [XAI]US6518598 (CHEN SHI-MING [TW]) [X] 1-2,4,8 * column 3, line 4 - column 5, line 41; figures 2,3 * [A] 11-15 [I] 3,5-7,10; | [XA]US2003102484 (HATA TOSHIO [JP], et al) [X] 1,4 * paragraph [0045] - paragraph [0141]; figures 1-8 * [A] 2-3,5-15; | [YA]WO2006128446 (OSRAM OPTO SEMICONDUCTORS GMBH [DE], et al) [Y] 2,12-15 * page 17, paragraph 5 - page 33, paragraph 4; figures 1-12 * [A] 1,3-11; | [XAYI]JP2007073590 (KYOCERA CORP) [X] 1,4,7 * abstract * [A] 9,11-15 [Y] 2 [I] 3,5-6,8,10; | [XYI]US2007102715 (KO KUN Y [KR], et al) [X] 1,4,9 * paragraph [0025] - paragraph [0035]; figures 2-5 * [Y] 2,12-15 [I] 3,5-8,10-11 | Examination | JP2001308380 | US2006244005 | US2007145392 | WO2008038842 | by applicant | US2007145392 |