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Extract from the Register of European Patents

EP About this file: EP2149918

EP2149918 - Light emitting diode [Right-click to bookmark this link]
Former [2010/05]Improved bond pad design for enhancing light extraction from LED chips
[2019/01]
StatusThe application is deemed to be withdrawn
Status updated on  20.09.2019
Database last updated on 13.07.2024
FormerGrant of patent is intended
Status updated on  16.12.2018
FormerExamination is in progress
Status updated on  29.11.2016
Most recent event   Tooltip20.09.2019Application deemed to be withdrawnpublished on 23.10.2019  [2019/43]
Applicant(s)For all designated states
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703 / US
[2010/05]
Inventor(s)01 / Li, Ting
975 Jasper Avenue Ventura
California, CA 93004 / US
 [2010/05]
Representative(s)Boult Wade Tennant LLP
Salisbury Square House
8 Salisbury Square
London EC4Y 8AP / GB
[N/P]
Former [2014/02]Boult Wade Tennant
Verulam Gardens
70 Gray's Inn Road
London WC1X 8BT / GB
Former [2010/39]Cross, Rupert Edward Blount, et al
Boult Wade Tennant Verulam Gardens 70 Gray's Inn Road
London WC1X 8BT / GB
Former [2010/05]South, Nicholas Geoffrey, et al
A.A. Thornton & Co. 235 High Holborn
London WC1V 7LE / GB
Application number, filing date09159460.605.05.2009
[2010/05]
Priority number, dateUS2008018503101.08.2008         Original published format: US 185031
[2010/05]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2149918
Date:03.02.2010
Language:EN
[2010/05]
Search report(s)(Supplementary) European search report - dispatched on:EP17.12.2009
ClassificationIPC:H01L33/38, // H01L33/20
[2019/01]
CPC:
H01L33/38 (EP,US); H01L33/20 (EP,US)
Former IPC [2010/05]H01L33/00
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2010/05]
TitleGerman:Lichtemittierende Diode[2019/01]
English:Light emitting diode[2019/01]
French:Diode électroluminescente[2019/01]
Former [2010/05]Verbesserte Kontaktflächenanordnung zur erhöhten Lichtgewinnung aus LED-Chips
Former [2010/05]Improved bond pad design for enhancing light extraction from LED chips
Former [2010/05]Conception améliorée de plots de connexion pour améliorer l'extraction de lumière de puces de diodes DEL
Examination procedure30.07.2010Examination requested  [2010/36]
20.08.2010Despatch of a communication from the examining division (Time limit: M04)
29.12.2010Reply to a communication from the examining division
10.02.2016Despatch of a communication from the examining division (Time limit: M06)
25.11.2016Reply to a communication from the examining division
27.11.2018Cancellation of oral proceeding that was planned for 30.11.2018
30.11.2018Date of oral proceedings (cancelled)
17.12.2018Communication of intention to grant the patent
30.04.2019Application deemed to be withdrawn, date of legal effect  [2019/43]
05.06.2019Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time  [2019/43]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  20.08.2010
Request for further processing for:The application is deemed to be withdrawn due to failure to reply to the examination report
25.11.2016Request for further processing filed
25.11.2016Full payment received (date of receipt of payment)
Request granted
07.12.2016Decision despatched
Fees paidRenewal fee
11.05.2011Renewal fee patent year 03
29.03.2012Renewal fee patent year 04
10.05.2013Renewal fee patent year 05
31.03.2014Renewal fee patent year 06
12.05.2015Renewal fee patent year 07
10.05.2016Renewal fee patent year 08
10.05.2017Renewal fee patent year 09
11.05.2018Renewal fee patent year 10
15.05.2019Renewal fee patent year 11
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Documents cited:Search[A]DE2755433  (LICENTIA GMBH) [A] 1-15* the whole document *;
 [XAI]US6518598  (CHEN SHI-MING [TW]) [X] 1-2,4,8 * column 3, line 4 - column 5, line 41; figures 2,3 * [A] 11-15 [I] 3,5-7,10;
 [XA]US2003102484  (HATA TOSHIO [JP], et al) [X] 1,4 * paragraph [0045] - paragraph [0141]; figures 1-8 * [A] 2-3,5-15;
 [YA]WO2006128446  (OSRAM OPTO SEMICONDUCTORS GMBH [DE], et al) [Y] 2,12-15 * page 17, paragraph 5 - page 33, paragraph 4; figures 1-12 * [A] 1,3-11;
 [XAYI]JP2007073590  (KYOCERA CORP) [X] 1,4,7 * abstract * [A] 9,11-15 [Y] 2 [I] 3,5-6,8,10;
 [XYI]US2007102715  (KO KUN Y [KR], et al) [X] 1,4,9 * paragraph [0025] - paragraph [0035]; figures 2-5 * [Y] 2,12-15 [I] 3,5-8,10-11
ExaminationJP2001308380
 US2006244005
 US2007145392
 WO2008038842
by applicantUS2007145392
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.