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EP2109024
European procedure
Extract from the Register of European Patents
EP About this file: EP2109024
| EP2109024 - Semiconductor device with temperature compensation circuit [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 14.06.2013 Database last updated on 21.05.2024 | Most recent event Tooltip | 07.02.2014 | Lapse of the patent in a contracting state New state(s): FR | published on 12.03.2014 [2014/11] | Applicant(s) | For all designated states Fujitsu Semiconductor Limited 2-10-23 Shin-Yokohama Kohoku-ku, Yokohama-shi Kanagawa 222-0033 / JP | [2010/25] |
| Former [2009/42] | For all designated states Fujitsu Microelectronics Limited 7-1, Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0722 / JP | Inventor(s) | 01 /
Nanba, Hiromi c/o FUJITSU LIMITED 1-1, Kamikodanaka 4-chome Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 / JP | 02 /
Minobe, Kenichi c/o FUJITSU LIMITED 1-1, Kamikodanaka 4-chome Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 / JP | [2012/32] |
| Former [2009/42] | 01 /
Nanba, Hiromi c/o FUJITSU LIMITED 1-1, Kamikodanaka 4-chome Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 / JP | ||
| 02 /
Minobe, Kenichi c/o FUJITSU LIMITED 1-1, Kamikodanaka 4-chome Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 / JP | Representative(s) | Keltsch, Ulrike, et al Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London WC1V 7JH / GB | [N/P] |
| Former [2013/21] | Holz, Ulrike, et al Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London WC1V 7JH / GB | ||
| Former [2012/32] | Holtby, Christopher Lawrence Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London WC1V 7JH / GB | ||
| Former [2009/42] | Holtby, Christopher Lawrence Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London WC1V 7JH / GB | Application number, filing date | 09166132.2 | 08.04.2002 | [2009/42] | Priority number, date | JP20010311594 | 09.10.2001 Original published format: JP 2001311594 | [2009/42] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2109024 | Date: | 14.10.2009 | Language: | EN | [2009/42] | Type: | B1 Patent specification | No.: | EP2109024 | Date: | 08.08.2012 | Language: | EN | [2012/32] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 09.09.2009 | Classification | IPC: | G05D23/24, G01K7/24, H03J3/04, G06F1/20 | [2012/11] | CPC: |
H03J3/04 (EP,US);
G01K7/24 (EP,US);
G05D23/1906 (EP,US);
G05D23/1928 (EP,US);
G05D23/24 (EP,US);
G06F1/206 (EP,US)
|
| Former IPC [2009/42] | G05D23/24, G01K7/24, H03J3/04 | Designated contracting states | DE, FR, GB [2009/42] | Title | German: | Halbleiteranordnung mit Temperaturkompensationsschaltung | [2009/42] | English: | Semiconductor device with temperature compensation circuit | [2009/42] | French: | Dispositif semiconducteur avec circuit de compensation en temperature | [2009/42] | Examination procedure | 12.04.2010 | Examination requested [2010/21] | 13.04.2010 | Amendment by applicant (claims and/or description) | 29.10.2010 | Despatch of a communication from the examining division (Time limit: M06) | 09.05.2011 | Reply to a communication from the examining division | 28.02.2012 | Communication of intention to grant the patent | 25.06.2012 | Fee for grant paid | 25.06.2012 | Fee for publishing/printing paid | Parent application(s) Tooltip | EP02252513.3 / EP1302832 | EP05013415.4 / EP1580636 | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP20020252513) is 12.11.2003 | Opposition(s) | 10.05.2013 | No opposition filed within time limit [2013/29] | Fees paid | Renewal fee | 18.11.2009 | Renewal fee patent year 03 | 18.11.2009 | Renewal fee patent year 04 | 18.11.2009 | Renewal fee patent year 05 | 18.11.2009 | Renewal fee patent year 06 | 18.11.2009 | Renewal fee patent year 07 | 18.11.2009 | Renewal fee patent year 08 | 28.04.2010 | Renewal fee patent year 09 | 21.04.2011 | Renewal fee patent year 10 | 03.02.2012 | Renewal fee patent year 11 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | GB | 08.04.2013 | FR | 30.04.2013 | [2014/11] |
| Former [2014/09] | GB | 08.04.2013 | Documents cited: | Search | [X]US4345477 (JOHNSON RUSSELL L) [X] 1 * column 11, line 27 - column 13, line 55; figure 1 *; | [XY]EP0695933 (SSI TECHNOLOGIES INC [US]) [X] 8-10 * abstract * * page 2, line 38 - page 3, line 2 * * page 3, line 25 - page 5, line 23; figure 1 * [Y] 1-4; | [Y]EP0868024 (SANYO ELECTRIC CO [JP]) [Y] 1-4 * abstract * * column 3, line 36 - column 6, line 5 ** figures 4-6 * |